JP2021527813A5 - - Google Patents
Info
- Publication number
- JP2021527813A5 JP2021527813A5 JP2020570693A JP2020570693A JP2021527813A5 JP 2021527813 A5 JP2021527813 A5 JP 2021527813A5 JP 2020570693 A JP2020570693 A JP 2020570693A JP 2020570693 A JP2020570693 A JP 2020570693A JP 2021527813 A5 JP2021527813 A5 JP 2021527813A5
- Authority
- JP
- Japan
- Prior art keywords
- sample
- inspection system
- scattered signals
- depth
- defects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862687123P | 2018-06-19 | 2018-06-19 | |
| US62/687,123 | 2018-06-19 | ||
| US16/165,742 US10732130B2 (en) | 2018-06-19 | 2018-10-19 | Embedded particle depth binning based on multiple scattering signals |
| US16/165,742 | 2018-10-19 | ||
| PCT/US2019/036432 WO2019245785A1 (en) | 2018-06-19 | 2019-06-11 | Embedded particle depth binning based on multiple scattering signals |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021527813A JP2021527813A (ja) | 2021-10-14 |
| JP2021527813A5 true JP2021527813A5 (https=) | 2022-06-16 |
| JP7236473B2 JP7236473B2 (ja) | 2023-03-09 |
Family
ID=68840629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020570693A Active JP7236473B2 (ja) | 2018-06-19 | 2019-06-11 | 多重散乱信号に基づく埋設粒子深度値域分類 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10732130B2 (https=) |
| JP (1) | JP7236473B2 (https=) |
| KR (1) | KR102495449B1 (https=) |
| CN (1) | CN112219113B (https=) |
| IL (1) | IL279286B2 (https=) |
| SG (1) | SG11202012061QA (https=) |
| TW (1) | TWI785253B (https=) |
| WO (1) | WO2019245785A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
| US11668658B2 (en) * | 2018-10-08 | 2023-06-06 | Araz Yacoubian | Multi-parameter inspection apparatus for monitoring of additive manufacturing parts |
| JP7206020B2 (ja) * | 2020-11-17 | 2023-01-17 | マシンビジョンライティング株式会社 | 画像観察装置及びその照明光学系 |
| WO2023023701A1 (en) * | 2021-08-24 | 2023-03-02 | Mark Andrew Fraser | Handcart |
| TWI839846B (zh) | 2022-09-15 | 2024-04-21 | 華洋精機股份有限公司 | 可用來判斷透明膜表面的瑕疵位於膜表或膜背的檢測方法及檢測系統 |
| US12092966B2 (en) | 2022-11-23 | 2024-09-17 | Kla Corporation | Device feature specific edge placement error (EPE) |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3333631A (en) * | 1964-12-03 | 1967-08-01 | Mobil Oil Corp | Method for optimum miscible flooding of reservoirs using a model to determine input profile |
| US6201601B1 (en) | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| US6181420B1 (en) | 1998-10-06 | 2001-01-30 | Zygo Corporation | Interferometry system having reduced cyclic errors |
| KR20040076742A (ko) * | 2003-02-26 | 2004-09-03 | 삼성전자주식회사 | 결함 분류 방법 및 결함 분류 장치 |
| US6947588B2 (en) | 2003-07-14 | 2005-09-20 | August Technology Corp. | Edge normal process |
| DE10333445B4 (de) * | 2003-07-23 | 2021-10-14 | Leica Microsystems Cms Gmbh | Konfokales Rastermikroskop |
| US7554656B2 (en) * | 2005-10-06 | 2009-06-30 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of a wafer |
| US7436505B2 (en) * | 2006-04-04 | 2008-10-14 | Kla-Tencor Technologies Corp. | Computer-implemented methods and systems for determining a configuration for a light scattering inspection system |
| US7714997B2 (en) * | 2006-11-07 | 2010-05-11 | Hitachi High-Technologies Corporation | Apparatus for inspecting defects |
| US8289527B2 (en) | 2010-04-01 | 2012-10-16 | Tokyo Electron Limited | Optimization of ray tracing and beam propagation parameters |
| US20120316855A1 (en) | 2011-06-08 | 2012-12-13 | Kla-Tencor Corporation | Using Three-Dimensional Representations for Defect-Related Applications |
| US9151940B2 (en) * | 2012-12-05 | 2015-10-06 | Kla-Tencor Corporation | Semiconductor inspection and metrology system using laser pulse multiplier |
| KR20140122608A (ko) | 2013-04-10 | 2014-10-20 | 삼성전자주식회사 | 디펙의 깊이 정보 추출 장치 및 방법과 그 디펙의 깊이 정보를 이용한 반도체 공정 개선방법 |
| US9310320B2 (en) | 2013-04-15 | 2016-04-12 | Kla-Tencor Corp. | Based sampling and binning for yield critical defects |
| US9535010B2 (en) | 2014-05-15 | 2017-01-03 | Kla-Tencor Corp. | Defect sampling for electron beam review based on defect attributes from optical inspection and optical review |
| TWI649932B (zh) * | 2014-06-20 | 2019-02-01 | 美商克萊譚克公司 | 使用面鏡及/或稜鏡之雷射重覆率倍增器及平頂射束分佈產生器 |
| US9606069B2 (en) * | 2014-06-25 | 2017-03-28 | Kla-Tencor Corporation | Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate |
| JP6369860B2 (ja) * | 2014-07-15 | 2018-08-08 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法及びその装置 |
| US9726615B2 (en) * | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
| EP3398123B1 (en) * | 2015-12-31 | 2025-03-12 | KLA - Tencor Corporation | Accelerated training of a machine learning based model for semiconductor applications |
| WO2017114641A1 (en) * | 2015-12-31 | 2017-07-06 | Asml Holding N.V. | Method and device for focusing in an inspection system |
| US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
| US11580398B2 (en) * | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
| EP3333631A1 (en) | 2016-12-06 | 2018-06-13 | ASML Netherlands B.V. | Method of measuring a target, metrology apparatus, polarizer assembly |
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
-
2018
- 2018-10-19 US US16/165,742 patent/US10732130B2/en active Active
-
2019
- 2019-06-11 IL IL279286A patent/IL279286B2/en unknown
- 2019-06-11 SG SG11202012061QA patent/SG11202012061QA/en unknown
- 2019-06-11 CN CN201980037368.6A patent/CN112219113B/zh active Active
- 2019-06-11 JP JP2020570693A patent/JP7236473B2/ja active Active
- 2019-06-11 WO PCT/US2019/036432 patent/WO2019245785A1/en not_active Ceased
- 2019-06-11 KR KR1020217000554A patent/KR102495449B1/ko active Active
- 2019-06-17 TW TW108120821A patent/TWI785253B/zh active
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