JP6906614B2 - 欠陥材料分類のためのシステムおよび方法 - Google Patents
欠陥材料分類のためのシステムおよび方法 Download PDFInfo
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- JP6906614B2 JP6906614B2 JP2019536595A JP2019536595A JP6906614B2 JP 6906614 B2 JP6906614 B2 JP 6906614B2 JP 2019536595 A JP2019536595 A JP 2019536595A JP 2019536595 A JP2019536595 A JP 2019536595A JP 6906614 B2 JP6906614 B2 JP 6906614B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
- G01N21/643—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes" non-biological material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6445—Measuring fluorescence polarisation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
- H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/27—Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/645—Specially adapted constructive features of fluorimeters
- G01N21/6456—Spatial resolved fluorescence measurements; Imaging
- G01N2021/646—Detecting fluorescent inhomogeneities at a position, e.g. for detecting defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
Landscapes
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Molecular Biology (AREA)
- Optics & Photonics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762442838P | 2017-01-05 | 2017-01-05 | |
| US62/442,838 | 2017-01-05 | ||
| US15/480,206 | 2017-04-05 | ||
| US15/480,206 US10234402B2 (en) | 2017-01-05 | 2017-04-05 | Systems and methods for defect material classification |
| PCT/US2018/012103 WO2018128995A1 (en) | 2017-01-05 | 2018-01-02 | Systems and methods for defect material classification |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020504304A JP2020504304A (ja) | 2020-02-06 |
| JP2020504304A5 JP2020504304A5 (https=) | 2021-02-12 |
| JP6906614B2 true JP6906614B2 (ja) | 2021-07-21 |
Family
ID=62712307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019536595A Active JP6906614B2 (ja) | 2017-01-05 | 2018-01-02 | 欠陥材料分類のためのシステムおよび方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10234402B2 (https=) |
| JP (1) | JP6906614B2 (https=) |
| KR (1) | KR102313412B1 (https=) |
| CN (1) | CN110301038B (https=) |
| DE (1) | DE112018000314T5 (https=) |
| IL (2) | IL267771B (https=) |
| TW (1) | TWI748034B (https=) |
| WO (1) | WO2018128995A1 (https=) |
Families Citing this family (35)
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| US9995850B2 (en) | 2013-06-06 | 2018-06-12 | Kla-Tencor Corporation | System, method and apparatus for polarization control |
| US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
| US10215714B1 (en) * | 2017-08-16 | 2019-02-26 | Siemens Energy, Inc. | Method and system for detecting defects on surface of object |
| US10192301B1 (en) * | 2017-08-16 | 2019-01-29 | Siemens Energy, Inc. | Method and system for detecting line defects on surface of object |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| TWI705242B (zh) * | 2018-10-08 | 2020-09-21 | 銓發科技股份有限公司 | 光學檢測設備及方法 |
| US11262591B2 (en) | 2018-11-09 | 2022-03-01 | Kla Corporation | System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution |
| US10942135B2 (en) * | 2018-11-14 | 2021-03-09 | Kla Corporation | Radial polarizer for particle detection |
| TWI689722B (zh) * | 2018-12-04 | 2020-04-01 | 台灣積體電路製造股份有限公司 | 辨識晶圓上微塵顆粒的方法、電子裝置及電腦可讀取記錄媒體 |
| KR102324622B1 (ko) * | 2018-12-12 | 2021-11-12 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 프로세스 모니터링 |
| US11137350B2 (en) * | 2019-01-28 | 2021-10-05 | Kla Corporation | Mid-infrared spectroscopy for measurement of high aspect ratio structures |
| US11294162B2 (en) * | 2019-02-07 | 2022-04-05 | Nanotronics Imaging, Inc. | Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel |
| US10948423B2 (en) | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
| US11703460B2 (en) * | 2019-07-09 | 2023-07-18 | Kla Corporation | Methods and systems for optical surface defect material characterization |
| CN111007016A (zh) * | 2019-12-09 | 2020-04-14 | 暨南大学 | 一种检测透明材料表面微小颗粒杂质的装置及使用方法 |
| CN111406198B (zh) | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| CN111356896B (zh) | 2020-02-24 | 2021-01-12 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| WO2021168611A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for semiconductor chip surface topography metrology |
| WO2021168610A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems having light source with extended spectrum for semiconductor chip surface topography metrology |
| US12379655B2 (en) * | 2020-04-24 | 2025-08-05 | Asml Holding N.V. | Contaminant identification metrology system, lithographic apparatus, and methods thereof |
| CN111879789A (zh) * | 2020-07-15 | 2020-11-03 | 深圳科瑞技术股份有限公司 | 金属表面缺陷检测方法及系统 |
| US12072267B2 (en) * | 2020-08-31 | 2024-08-27 | Applied Materials, Inc. | Method and hardware for post maintenance vacuum recovery system |
| CN111929310B (zh) * | 2020-09-25 | 2021-02-05 | 歌尔股份有限公司 | 表面缺陷检测方法、装置、设备及存储介质 |
| US20220139743A1 (en) * | 2020-11-04 | 2022-05-05 | Tokyo Electron Limited | Optical Sensor for Inspecting Pattern Collapse Defects |
| CN115248531A (zh) * | 2021-04-26 | 2022-10-28 | 上海微电子装备(集团)股份有限公司 | 颗粒度检测装置及其检测方法、光刻机 |
| US11664283B2 (en) * | 2021-08-20 | 2023-05-30 | Tokyo Electron Limited | Raman sensor for supercritical fluids metrology |
| TWI796791B (zh) * | 2021-09-16 | 2023-03-21 | 崇浩光電科技股份有限公司 | 二維掃描式拉曼光譜檢測系統 |
| CN113985592B (zh) * | 2021-09-24 | 2024-09-03 | 江苏锐精光电研究院有限公司 | 基于色散元件的多角度全内反射照明成像装置 |
| JP7604354B2 (ja) * | 2021-10-29 | 2024-12-23 | 株式会社ニューフレアテクノロジー | 検査装置及び焦点位置調整方法 |
| CN114815206A (zh) * | 2022-04-19 | 2022-07-29 | 中国工程物理研究院激光聚变研究中心 | 一种在线x光高分辨探测器 |
| KR20240100906A (ko) * | 2022-12-23 | 2024-07-02 | 엘지이노텍 주식회사 | 대상체의 불량 검출 장치 및 대상체의 불량 검출 방법 |
| US20250060324A1 (en) * | 2023-08-14 | 2025-02-20 | Tokyo Electron Limited | Hybrid x-ray and optical metrology and navigation |
| WO2025048706A1 (en) * | 2023-08-28 | 2025-03-06 | Semiconductor Technologies & Instruments Pte Ltd. | System and method for die inspections |
| EP4575468B1 (en) * | 2023-12-18 | 2026-04-01 | Unity Semiconductor | A method and a device for detecting crystalline defects in a substrate by dark field and photoluminescence |
| WO2026038098A1 (en) | 2024-08-16 | 2026-02-19 | Orbotech Ltd. | Thermal detection of internal defects in semiconductor |
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| JP6531108B2 (ja) | 2013-10-23 | 2019-06-12 | ナノヴィジョン・テクノロジー・(ベイジン)・カンパニー・リミテッド | 光子計数に基づく放射線結像システム、方法、及びそのデバイス |
| US9410901B2 (en) * | 2014-03-17 | 2016-08-09 | Kla-Tencor Corporation | Image sensor, an inspection system and a method of inspecting an article |
| JP6369860B2 (ja) | 2014-07-15 | 2018-08-08 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法及びその装置 |
| US9891177B2 (en) | 2014-10-03 | 2018-02-13 | Kla-Tencor Corporation | TDI sensor in a darkfield system |
| US9859138B2 (en) | 2014-10-20 | 2018-01-02 | Lam Research Corporation | Integrated substrate defect detection using precision coating |
| US9518934B2 (en) * | 2014-11-04 | 2016-12-13 | Kla-Tencor Corp. | Wafer defect discovery |
| US9874526B2 (en) * | 2016-03-28 | 2018-01-23 | Kla-Tencor Corporation | Methods and apparatus for polarized wafer inspection |
| US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
-
2017
- 2017-04-05 US US15/480,206 patent/US10234402B2/en active Active
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2018
- 2018-01-02 KR KR1020197022835A patent/KR102313412B1/ko active Active
- 2018-01-02 CN CN201880011822.6A patent/CN110301038B/zh active Active
- 2018-01-02 WO PCT/US2018/012103 patent/WO2018128995A1/en not_active Ceased
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| IL267771B (en) | 2021-07-29 |
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| US10234402B2 (en) | 2019-03-19 |
| WO2018128995A1 (en) | 2018-07-12 |
| KR102313412B1 (ko) | 2021-10-14 |
| JP2020504304A (ja) | 2020-02-06 |
| IL267771A (en) | 2019-09-26 |
| CN110301038B (zh) | 2021-07-09 |
| DE112018000314T5 (de) | 2019-09-26 |
| US10670537B2 (en) | 2020-06-02 |
| US20190212277A1 (en) | 2019-07-11 |
| TW201831886A (zh) | 2018-09-01 |
| US20180188188A1 (en) | 2018-07-05 |
| CN110301038A (zh) | 2019-10-01 |
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