JP2020500308A - 検査体に対する良否判定条件を調整する方法及び装置 - Google Patents
検査体に対する良否判定条件を調整する方法及び装置 Download PDFInfo
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- JP2020500308A JP2020500308A JP2019525739A JP2019525739A JP2020500308A JP 2020500308 A JP2020500308 A JP 2020500308A JP 2019525739 A JP2019525739 A JP 2019525739A JP 2019525739 A JP2019525739 A JP 2019525739A JP 2020500308 A JP2020500308 A JP 2020500308A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8858—Flaw counting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/00584—Control arrangements for automatic analysers
- G01N35/00722—Communications; Identification
- G01N2035/00891—Displaying information to the operator
- G01N2035/0091—GUI [graphical user interfaces]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021096523A JP7302131B2 (ja) | 2016-11-14 | 2021-06-09 | 検査体に対する良否判定条件を調整する方法及び装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160151400A KR20180054063A (ko) | 2016-11-14 | 2016-11-14 | 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 |
| KR10-2016-0151400 | 2016-11-14 | ||
| PCT/KR2017/012408 WO2018088760A2 (ko) | 2016-11-14 | 2017-11-03 | 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021096523A Division JP7302131B2 (ja) | 2016-11-14 | 2021-06-09 | 検査体に対する良否判定条件を調整する方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020500308A true JP2020500308A (ja) | 2020-01-09 |
| JP2020500308A5 JP2020500308A5 (enExample) | 2020-02-20 |
Family
ID=62110763
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019525739A Pending JP2020500308A (ja) | 2016-11-14 | 2017-11-03 | 検査体に対する良否判定条件を調整する方法及び装置 |
| JP2021096523A Active JP7302131B2 (ja) | 2016-11-14 | 2021-06-09 | 検査体に対する良否判定条件を調整する方法及び装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021096523A Active JP7302131B2 (ja) | 2016-11-14 | 2021-06-09 | 検査体に対する良否判定条件を調整する方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11199503B2 (enExample) |
| EP (2) | EP3961332B1 (enExample) |
| JP (2) | JP2020500308A (enExample) |
| KR (1) | KR20180054063A (enExample) |
| CN (2) | CN109997028B (enExample) |
| WO (1) | WO2018088760A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021128174A (ja) * | 2016-11-14 | 2021-09-02 | コー・ヤング・テクノロジー・インコーポレーテッド | 検査体に対する良否判定条件を調整する方法及び装置 |
| JP2023068507A (ja) * | 2021-11-02 | 2023-05-17 | オムロン株式会社 | パラメータ調整支援装置及びパラメータ調整支援方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11366068B2 (en) * | 2016-11-14 | 2022-06-21 | Koh Young Technology Inc. | Inspection apparatus and operating method thereof |
| US11113140B2 (en) * | 2019-05-20 | 2021-09-07 | Alibaba Group Holding Limited | Detecting error in executing computation graph on heterogeneous computing devices |
| JP7204609B2 (ja) * | 2019-07-30 | 2023-01-16 | 三菱重工エンジニアリング株式会社 | 検証処理装置、検証方法及びプログラム |
| CN116242830A (zh) * | 2021-12-08 | 2023-06-09 | 先进半导体材料(深圳)有限公司 | 引线框架的瑕疵检测方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1264221A2 (en) * | 2000-03-10 | 2002-12-11 | Smiths Detection Inc. | Control for an industrial process using one or more multidimensional variables |
| JP2006317266A (ja) * | 2005-05-12 | 2006-11-24 | Omron Corp | 検査基準設定装置及び方法、並びに、工程検査装置 |
| JP2006343152A (ja) * | 2005-06-07 | 2006-12-21 | Anritsu Corp | 印刷はんだ検査装置 |
| JP2013108798A (ja) * | 2011-11-18 | 2013-06-06 | Keyence Corp | 画像処理装置及び該画像処理装置で用いる判定閾値設定方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5555316A (en) * | 1992-06-30 | 1996-09-10 | Matsushita Electric Industrial Co., Ltd. | Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| JPH11258180A (ja) | 1998-03-11 | 1999-09-24 | Seiko Epson Corp | 外観検査方法及びシステム |
| CN100428277C (zh) * | 1999-11-29 | 2008-10-22 | 奥林巴斯光学工业株式会社 | 缺陷检查系统 |
| JP2001183307A (ja) * | 1999-12-27 | 2001-07-06 | Nagoya Electric Works Co Ltd | 実装済プリント基板検査装置における判定基準自動調整方法およびその装置 |
| US6825856B1 (en) * | 2000-07-26 | 2004-11-30 | Agilent Technologies, Inc. | Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization |
| US6898305B2 (en) * | 2001-02-22 | 2005-05-24 | Hitachi, Ltd. | Circuit pattern inspection method and apparatus |
| US7206701B2 (en) * | 2001-12-21 | 2007-04-17 | United States Of America As Represented By The Secretary Of The Department Of Health And Human Services, Centers For Disease Control And Prevention | Systems and methods for automated quantitative analysis of digitized spectra |
| JP3733094B2 (ja) * | 2002-08-22 | 2006-01-11 | トヨタ自動車株式会社 | 良否判定装置、良否判定プログラムおよび良否判定方法 |
| JP2005092466A (ja) * | 2003-09-16 | 2005-04-07 | Toshiba Corp | 診断プロセス支援方法とそのためのプログラム |
| JP3705296B1 (ja) * | 2004-04-30 | 2005-10-12 | オムロン株式会社 | 品質制御装置およびその制御方法、品質制御プログラム、並びに該プログラムを記録した記録媒体 |
| US7729789B2 (en) * | 2004-05-04 | 2010-06-01 | Fisher-Rosemount Systems, Inc. | Process plant monitoring based on multivariate statistical analysis and on-line process simulation |
| CN101297294A (zh) * | 2004-05-21 | 2008-10-29 | 派拉斯科技术公司 | 图形重新检验用户设置界面 |
| JP4453503B2 (ja) * | 2004-09-28 | 2010-04-21 | オムロン株式会社 | 基板検査装置および基板検査方法並びに基板検査装置の検査ロジック生成装置および検査ロジック生成方法 |
| US7844100B2 (en) * | 2004-11-29 | 2010-11-30 | Applied Materials Israel, Ltd. | Method for filtering nuisance defects |
| JP4645422B2 (ja) * | 2005-11-18 | 2011-03-09 | オムロン株式会社 | 判定装置、判定装置の制御プログラム、および判定装置の制御プログラムを記録した記録媒体 |
| US20090073440A1 (en) * | 2006-09-30 | 2009-03-19 | Timothy Tiemeyer | System and method for detecting surface features on a semiconductor workpiece surface |
| JP2009267099A (ja) * | 2008-04-25 | 2009-11-12 | Omron Corp | 基板検査方法および自動外観検査の検査結果確認システム |
| JP5572293B2 (ja) * | 2008-07-07 | 2014-08-13 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び欠陥検査装置 |
| JP2010230452A (ja) * | 2009-03-26 | 2010-10-14 | Panasonic Electric Works Co Ltd | 欠陥検査方法および欠陥検査システム |
| US9124810B2 (en) * | 2010-04-14 | 2015-09-01 | Koh Young Technology Inc. | Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus |
| JP5625935B2 (ja) * | 2011-01-18 | 2014-11-19 | オムロン株式会社 | 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム |
| JP5390652B2 (ja) | 2012-03-01 | 2014-01-15 | 株式会社明治 | 検査装置における良品判定基準設定方法及び良品判定基準設定装置 |
| KR101614061B1 (ko) * | 2012-03-29 | 2016-04-20 | 주식회사 고영테크놀러지 | 조인트 검사 장치 |
| US9715723B2 (en) * | 2012-04-19 | 2017-07-25 | Applied Materials Israel Ltd | Optimization of unknown defect rejection for automatic defect classification |
| KR102153149B1 (ko) | 2012-10-24 | 2020-09-07 | 도쿄엘렉트론가부시키가이샤 | 보정값 산출 장치, 보정값 산출 방법 및 컴퓨터 프로그램 |
| US20160189055A1 (en) * | 2014-12-31 | 2016-06-30 | Applied Materials Israel Ltd. | Tuning of parameters for automatic classification |
| US20180284739A1 (en) * | 2016-03-28 | 2018-10-04 | Mitsubishi Electric Corporation | Quality control apparatus, quality control method, and quality control program |
| KR102084535B1 (ko) * | 2016-03-30 | 2020-03-05 | 가부시키가이샤 히다치 하이테크놀로지즈 | 결함 검사 장치, 결함 검사 방법 |
| US11366068B2 (en) * | 2016-11-14 | 2022-06-21 | Koh Young Technology Inc. | Inspection apparatus and operating method thereof |
| KR20180054063A (ko) * | 2016-11-14 | 2018-05-24 | 주식회사 고영테크놀러지 | 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 |
| JP7006567B2 (ja) * | 2018-11-09 | 2022-01-24 | オムロン株式会社 | 撮影方法及び撮影装置 |
-
2016
- 2016-11-14 KR KR1020160151400A patent/KR20180054063A/ko not_active Ceased
-
2017
- 2017-11-03 EP EP21196822.7A patent/EP3961332B1/en active Active
- 2017-11-03 EP EP17869347.9A patent/EP3540412B1/en active Active
- 2017-11-03 US US16/349,802 patent/US11199503B2/en active Active
- 2017-11-03 CN CN201780070386.5A patent/CN109997028B/zh active Active
- 2017-11-03 JP JP2019525739A patent/JP2020500308A/ja active Pending
- 2017-11-03 CN CN202210685954.5A patent/CN115112663A/zh active Pending
- 2017-11-03 WO PCT/KR2017/012408 patent/WO2018088760A2/ko not_active Ceased
-
2021
- 2021-06-09 JP JP2021096523A patent/JP7302131B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1264221A2 (en) * | 2000-03-10 | 2002-12-11 | Smiths Detection Inc. | Control for an industrial process using one or more multidimensional variables |
| JP2006317266A (ja) * | 2005-05-12 | 2006-11-24 | Omron Corp | 検査基準設定装置及び方法、並びに、工程検査装置 |
| JP2006343152A (ja) * | 2005-06-07 | 2006-12-21 | Anritsu Corp | 印刷はんだ検査装置 |
| JP2013108798A (ja) * | 2011-11-18 | 2013-06-06 | Keyence Corp | 画像処理装置及び該画像処理装置で用いる判定閾値設定方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021128174A (ja) * | 2016-11-14 | 2021-09-02 | コー・ヤング・テクノロジー・インコーポレーテッド | 検査体に対する良否判定条件を調整する方法及び装置 |
| JP7302131B2 (ja) | 2016-11-14 | 2023-07-04 | コー・ヤング・テクノロジー・インコーポレーテッド | 検査体に対する良否判定条件を調整する方法及び装置 |
| JP2023068507A (ja) * | 2021-11-02 | 2023-05-17 | オムロン株式会社 | パラメータ調整支援装置及びパラメータ調整支援方法 |
| JP7771629B2 (ja) | 2021-11-02 | 2025-11-18 | オムロン株式会社 | パラメータ調整支援装置及びパラメータ調整支援方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3540412B1 (en) | 2021-11-24 |
| JP7302131B2 (ja) | 2023-07-04 |
| EP3540412A2 (en) | 2019-09-18 |
| EP3961332C0 (en) | 2024-03-13 |
| WO2018088760A2 (ko) | 2018-05-17 |
| EP3540412A4 (en) | 2020-07-15 |
| KR20180054063A (ko) | 2018-05-24 |
| JP2021128174A (ja) | 2021-09-02 |
| CN109997028B (zh) | 2022-07-05 |
| EP3961332B1 (en) | 2024-03-13 |
| EP3961332A1 (en) | 2022-03-02 |
| WO2018088760A3 (ko) | 2018-08-16 |
| CN115112663A (zh) | 2022-09-27 |
| US11199503B2 (en) | 2021-12-14 |
| US20190376906A1 (en) | 2019-12-12 |
| CN109997028A (zh) | 2019-07-09 |
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