JP2020500308A - 検査体に対する良否判定条件を調整する方法及び装置 - Google Patents

検査体に対する良否判定条件を調整する方法及び装置 Download PDF

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JP2020500308A
JP2020500308A JP2019525739A JP2019525739A JP2020500308A JP 2020500308 A JP2020500308 A JP 2020500308A JP 2019525739 A JP2019525739 A JP 2019525739A JP 2019525739 A JP2019525739 A JP 2019525739A JP 2020500308 A JP2020500308 A JP 2020500308A
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JP2020500308A5 (enExample
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ク、デソン
キム、ヨン
パク、キウォン
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コー・ヤング・テクノロジー・インコーポレーテッド
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765Method using an image detector and processing of image signal
    • G01N2021/177Detector of the video camera type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8858Flaw counting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00584Control arrangements for automatic analysers
    • G01N35/00722Communications; Identification
    • G01N2035/00891Displaying information to the operator
    • G01N2035/0091GUI [graphical user interfaces]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2019525739A 2016-11-14 2017-11-03 検査体に対する良否判定条件を調整する方法及び装置 Pending JP2020500308A (ja)

Priority Applications (1)

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JP2021096523A JP7302131B2 (ja) 2016-11-14 2021-06-09 検査体に対する良否判定条件を調整する方法及び装置

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KR1020160151400A KR20180054063A (ko) 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
KR10-2016-0151400 2016-11-14
PCT/KR2017/012408 WO2018088760A2 (ko) 2016-11-14 2017-11-03 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치

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US (1) US11199503B2 (enExample)
EP (2) EP3961332B1 (enExample)
JP (2) JP2020500308A (enExample)
KR (1) KR20180054063A (enExample)
CN (2) CN109997028B (enExample)
WO (1) WO2018088760A2 (enExample)

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JP2021128174A (ja) * 2016-11-14 2021-09-02 コー・ヤング・テクノロジー・インコーポレーテッド 検査体に対する良否判定条件を調整する方法及び装置
JP2023068507A (ja) * 2021-11-02 2023-05-17 オムロン株式会社 パラメータ調整支援装置及びパラメータ調整支援方法

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JP7204609B2 (ja) * 2019-07-30 2023-01-16 三菱重工エンジニアリング株式会社 検証処理装置、検証方法及びプログラム
CN116242830A (zh) * 2021-12-08 2023-06-09 先进半导体材料(深圳)有限公司 引线框架的瑕疵检测方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021128174A (ja) * 2016-11-14 2021-09-02 コー・ヤング・テクノロジー・インコーポレーテッド 検査体に対する良否判定条件を調整する方法及び装置
JP7302131B2 (ja) 2016-11-14 2023-07-04 コー・ヤング・テクノロジー・インコーポレーテッド 検査体に対する良否判定条件を調整する方法及び装置
JP2023068507A (ja) * 2021-11-02 2023-05-17 オムロン株式会社 パラメータ調整支援装置及びパラメータ調整支援方法
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Also Published As

Publication number Publication date
EP3540412B1 (en) 2021-11-24
JP7302131B2 (ja) 2023-07-04
EP3540412A2 (en) 2019-09-18
EP3961332C0 (en) 2024-03-13
WO2018088760A2 (ko) 2018-05-17
EP3540412A4 (en) 2020-07-15
KR20180054063A (ko) 2018-05-24
JP2021128174A (ja) 2021-09-02
CN109997028B (zh) 2022-07-05
EP3961332B1 (en) 2024-03-13
EP3961332A1 (en) 2022-03-02
WO2018088760A3 (ko) 2018-08-16
CN115112663A (zh) 2022-09-27
US11199503B2 (en) 2021-12-14
US20190376906A1 (en) 2019-12-12
CN109997028A (zh) 2019-07-09

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