KR20180054063A - 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 - Google Patents

검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 Download PDF

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KR20180054063A
KR20180054063A KR1020160151400A KR20160151400A KR20180054063A KR 20180054063 A KR20180054063 A KR 20180054063A KR 1020160151400 A KR1020160151400 A KR 1020160151400A KR 20160151400 A KR20160151400 A KR 20160151400A KR 20180054063 A KR20180054063 A KR 20180054063A
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South Korea
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error
inspection
reference value
value
good
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KR1020160151400A
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English (en)
Korean (ko)
Inventor
구대성
김용
박기원
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주식회사 고영테크놀러지
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Priority to KR1020160151400A priority Critical patent/KR20180054063A/ko
Priority to CN201780070386.5A priority patent/CN109997028B/zh
Priority to CN202210685954.5A priority patent/CN115112663A/zh
Priority to US16/349,802 priority patent/US11199503B2/en
Priority to JP2019525739A priority patent/JP2020500308A/ja
Priority to EP17869347.9A priority patent/EP3540412B1/en
Priority to EP21196822.7A priority patent/EP3961332B1/en
Priority to PCT/KR2017/012408 priority patent/WO2018088760A2/ko
Publication of KR20180054063A publication Critical patent/KR20180054063A/ko
Priority to US16/713,886 priority patent/US11366068B2/en
Priority to JP2021096523A priority patent/JP7302131B2/ja
Ceased legal-status Critical Current

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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765Method using an image detector and processing of image signal
    • G01N2021/177Detector of the video camera type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8858Flaw counting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00584Control arrangements for automatic analysers
    • G01N35/00722Communications; Identification
    • G01N2035/00891Displaying information to the operator
    • G01N2035/0091GUI [graphical user interfaces]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
KR1020160151400A 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 Ceased KR20180054063A (ko)

Priority Applications (10)

Application Number Priority Date Filing Date Title
KR1020160151400A KR20180054063A (ko) 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
EP17869347.9A EP3540412B1 (en) 2016-11-14 2017-11-03 Method and device for adjusting quality determination conditions for test body
CN202210685954.5A CN115112663A (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置
US16/349,802 US11199503B2 (en) 2016-11-14 2017-11-03 Method and device for adjusting quality determination conditions for test body
JP2019525739A JP2020500308A (ja) 2016-11-14 2017-11-03 検査体に対する良否判定条件を調整する方法及び装置
CN201780070386.5A CN109997028B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置
EP21196822.7A EP3961332B1 (en) 2016-11-14 2017-11-03 Method and device for adjusting quality determination conditions for test body
PCT/KR2017/012408 WO2018088760A2 (ko) 2016-11-14 2017-11-03 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
US16/713,886 US11366068B2 (en) 2016-11-14 2019-12-13 Inspection apparatus and operating method thereof
JP2021096523A JP7302131B2 (ja) 2016-11-14 2021-06-09 検査体に対する良否判定条件を調整する方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160151400A KR20180054063A (ko) 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190057238A Division KR102070858B1 (ko) 2019-05-16 2019-05-16 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치

Publications (1)

Publication Number Publication Date
KR20180054063A true KR20180054063A (ko) 2018-05-24

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KR1020160151400A Ceased KR20180054063A (ko) 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치

Country Status (6)

Country Link
US (1) US11199503B2 (enExample)
EP (2) EP3961332B1 (enExample)
JP (2) JP2020500308A (enExample)
KR (1) KR20180054063A (enExample)
CN (2) CN115112663A (enExample)
WO (1) WO2018088760A2 (enExample)

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JP7771629B2 (ja) * 2021-11-02 2025-11-18 オムロン株式会社 パラメータ調整支援装置及びパラメータ調整支援方法
CN116242830A (zh) * 2021-12-08 2023-06-09 先进半导体材料(深圳)有限公司 引线框架的瑕疵检测方法

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Also Published As

Publication number Publication date
EP3540412A2 (en) 2019-09-18
EP3961332C0 (en) 2024-03-13
JP2020500308A (ja) 2020-01-09
WO2018088760A2 (ko) 2018-05-17
CN115112663A (zh) 2022-09-27
WO2018088760A3 (ko) 2018-08-16
EP3961332B1 (en) 2024-03-13
JP2021128174A (ja) 2021-09-02
JP7302131B2 (ja) 2023-07-04
EP3961332A1 (en) 2022-03-02
EP3540412A4 (en) 2020-07-15
US11199503B2 (en) 2021-12-14
CN109997028B (zh) 2022-07-05
EP3540412B1 (en) 2021-11-24
US20190376906A1 (en) 2019-12-12
CN109997028A (zh) 2019-07-09

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