JP2020175490A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2020175490A JP2020175490A JP2019080848A JP2019080848A JP2020175490A JP 2020175490 A JP2020175490 A JP 2020175490A JP 2019080848 A JP2019080848 A JP 2019080848A JP 2019080848 A JP2019080848 A JP 2019080848A JP 2020175490 A JP2020175490 A JP 2020175490A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- linear motor
- moving table
- rail
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003754 machining Methods 0.000 claims description 46
- 230000000116 mitigating effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001141 propulsive effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Machine Tool Units (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
4:保持手段
6:加工手段
8:加工送り手段
30:移動テーブル
32:基台
32a:案内レール
32b:緩和レール
34:リニアモータレール
36:ダンパー
38:永久磁石
48:電磁石
Claims (4)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、
該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設された基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成された加工装置。 - 該リニアモータレールには永久磁石が配設され、該移動テーブルには該永久磁石に対向して位相が変化する電磁石が配設される請求項1記載の加工装置。
- 該移動テーブルには永久磁石が配設され、該リニアモータレールには該永久磁石に対向して位相が変化する電磁石が配設される請求項1記載の加工装置。
- 該加工手段は該保持手段に保持された被加工物にレーザー光線を照射して加工を施す請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019080848A JP7283964B2 (ja) | 2019-04-22 | 2019-04-22 | 加工装置 |
KR1020200034183A KR20200123737A (ko) | 2019-04-22 | 2020-03-20 | 가공 장치 |
CN202010303457.5A CN111822870A (zh) | 2019-04-22 | 2020-04-17 | 加工装置 |
TW109112889A TW202039133A (zh) | 2019-04-22 | 2020-04-17 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019080848A JP7283964B2 (ja) | 2019-04-22 | 2019-04-22 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020175490A true JP2020175490A (ja) | 2020-10-29 |
JP7283964B2 JP7283964B2 (ja) | 2023-05-30 |
Family
ID=72913594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019080848A Active JP7283964B2 (ja) | 2019-04-22 | 2019-04-22 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7283964B2 (ja) |
KR (1) | KR20200123737A (ja) |
CN (1) | CN111822870A (ja) |
TW (1) | TW202039133A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113500508B (zh) * | 2021-06-29 | 2023-01-20 | 吉安职业技术学院 | 一种磨床的工件智能夹持系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001071160A (ja) * | 1999-09-07 | 2001-03-21 | Mitsubishi Heavy Ind Ltd | 高速レーザ加工装置 |
US20020145398A1 (en) * | 2001-04-06 | 2002-10-10 | Markus Knorr | Momentum-decoupled drive train |
JP2004088844A (ja) * | 2002-08-23 | 2004-03-18 | Nikon Corp | リニアモータ装置、ステージ装置、及び露光装置 |
JP2005527392A (ja) * | 2002-05-24 | 2005-09-15 | コルモーゲン コーポレイション | 反力移動システム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT233063Y1 (it) * | 1993-12-14 | 2000-01-26 | Iemca Spa | Dispositivo per il supporto elastico smorzato di barre in rotazione in particolare per caricatori di barre |
CN2575367Y (zh) * | 2002-08-13 | 2003-09-24 | 经玉凤 | 稀土永磁减振器 |
JP4734101B2 (ja) | 2005-11-30 | 2011-07-27 | 株式会社ディスコ | レーザー加工装置 |
JP5001064B2 (ja) | 2007-05-08 | 2012-08-15 | 株式会社ディスコ | チャックテーブル機構 |
ES2460393B1 (es) * | 2012-11-09 | 2015-06-02 | Bsh Electrodomésticos España, S.A. | Amortiguador de oscilaciones para un aparato doméstico con tambor giratorio, y aparato doméstico que comprende el amortiguador |
CN203808277U (zh) * | 2014-03-07 | 2014-09-03 | 福建巨岸建设工程有限公司 | 一种建筑防震钢构件 |
CN107290930B (zh) * | 2016-03-30 | 2019-05-31 | 上海微电子装备(集团)股份有限公司 | 光刻机系统和运动台直线电机定子自动复位装置和方法 |
CN105971357B (zh) * | 2016-06-02 | 2018-05-01 | 燕山大学 | 活塞式sma-压电复合变摩擦阻尼器 |
CN207648044U (zh) * | 2017-12-06 | 2018-07-24 | 广东铭恒信息科技有限公司 | 一种安全防震监控摄像机 |
CN207504993U (zh) * | 2017-12-07 | 2018-06-15 | 广州恒威电子科技有限公司 | 一种船用红外摄像机 |
CN207867901U (zh) * | 2018-03-21 | 2018-09-14 | 漳州市红酷橙网络科技有限公司 | 一种计算机硬盘防震保护装置 |
CN208605534U (zh) * | 2018-07-16 | 2019-03-15 | 杭州航验环境技术有限公司 | 一种弹性阻尼器 |
-
2019
- 2019-04-22 JP JP2019080848A patent/JP7283964B2/ja active Active
-
2020
- 2020-03-20 KR KR1020200034183A patent/KR20200123737A/ko not_active Application Discontinuation
- 2020-04-17 TW TW109112889A patent/TW202039133A/zh unknown
- 2020-04-17 CN CN202010303457.5A patent/CN111822870A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001071160A (ja) * | 1999-09-07 | 2001-03-21 | Mitsubishi Heavy Ind Ltd | 高速レーザ加工装置 |
US20020145398A1 (en) * | 2001-04-06 | 2002-10-10 | Markus Knorr | Momentum-decoupled drive train |
JP2005527392A (ja) * | 2002-05-24 | 2005-09-15 | コルモーゲン コーポレイション | 反力移動システム |
JP2004088844A (ja) * | 2002-08-23 | 2004-03-18 | Nikon Corp | リニアモータ装置、ステージ装置、及び露光装置 |
Also Published As
Publication number | Publication date |
---|---|
TW202039133A (zh) | 2020-11-01 |
CN111822870A (zh) | 2020-10-27 |
JP7283964B2 (ja) | 2023-05-30 |
KR20200123737A (ko) | 2020-10-30 |
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