CN111822870A - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
CN111822870A
CN111822870A CN202010303457.5A CN202010303457A CN111822870A CN 111822870 A CN111822870 A CN 111822870A CN 202010303457 A CN202010303457 A CN 202010303457A CN 111822870 A CN111822870 A CN 111822870A
Authority
CN
China
Prior art keywords
unit
processing
linear motor
holding unit
rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010303457.5A
Other languages
English (en)
Chinese (zh)
Inventor
朴恩奎
吉元宏充
外山宏慈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111822870A publication Critical patent/CN111822870A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Dicing (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN202010303457.5A 2019-04-22 2020-04-17 加工装置 Pending CN111822870A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019080848A JP7283964B2 (ja) 2019-04-22 2019-04-22 加工装置
JP2019-080848 2019-04-22

Publications (1)

Publication Number Publication Date
CN111822870A true CN111822870A (zh) 2020-10-27

Family

ID=72913594

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010303457.5A Pending CN111822870A (zh) 2019-04-22 2020-04-17 加工装置

Country Status (4)

Country Link
JP (1) JP7283964B2 (ja)
KR (1) KR102799439B1 (ja)
CN (1) CN111822870A (ja)
TW (1) TWI850369B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113500508A (zh) * 2021-06-29 2021-10-15 吉安职业技术学院 一种磨床的工件智能夹持系统

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0658388A1 (en) * 1993-12-14 1995-06-21 I.E.M.C.A. S.p.a. Industria Elettromeccanica Complessi Automatici Device for the damped elastic support of rotating bars, particularly for bar feeders
JP2001071160A (ja) * 1999-09-07 2001-03-21 Mitsubishi Heavy Ind Ltd 高速レーザ加工装置
CN2575367Y (zh) * 2002-08-13 2003-09-24 经玉凤 稀土永磁减振器
JP2004088844A (ja) * 2002-08-23 2004-03-18 Nikon Corp リニアモータ装置、ステージ装置、及び露光装置
CN1675023A (zh) * 2002-05-24 2005-09-28 科尔摩根公司 反作用力转移系统
CN203808277U (zh) * 2014-03-07 2014-09-03 福建巨岸建设工程有限公司 一种建筑防震钢构件
CN104769177A (zh) * 2012-11-09 2015-07-08 Bsh家用电器有限公司 用于带有旋转滚筒的家用器具的振荡阻尼器以及包括该阻尼器的家用器具
CN105971357A (zh) * 2016-06-02 2016-09-28 燕山大学 活塞式sma-压电复合变摩擦阻尼器
CN107290930A (zh) * 2016-03-30 2017-10-24 上海微电子装备（集团）股份有限公司 光刻机系统和运动台直线电机定子自动复位装置和方法
CN207504993U (zh) * 2017-12-07 2018-06-15 广州恒威电子科技有限公司 一种船用红外摄像机
CN207648044U (zh) * 2017-12-06 2018-07-24 广东铭恒信息科技有限公司 一种安全防震监控摄像机
CN207867901U (zh) * 2018-03-21 2018-09-14 漳州市红酷橙网络科技有限公司 一种计算机硬盘防震保护装置
CN208605534U (zh) * 2018-07-16 2019-03-15 杭州航验环境技术有限公司 一种弹性阻尼器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117460A1 (de) * 2001-04-06 2002-11-07 Siemens Ag Impulsgekoppelter Transmissionsantrieb
JP4734101B2 (ja) 2005-11-30 2011-07-27 株式会社ディスコ レーザー加工装置
JP5001064B2 (ja) 2007-05-08 2012-08-15 株式会社ディスコ チャックテーブル機構
DE112008001412B4 (de) * 2007-05-30 2015-03-12 Thk Co., Ltd. X-Y-Koordinatentisch-Stelleinrichtung
US9030057B2 (en) * 2011-06-24 2015-05-12 Nikon Corporation Method and apparatus to allow a plurality of stages to operate in close proximity

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0658388A1 (en) * 1993-12-14 1995-06-21 I.E.M.C.A. S.p.a. Industria Elettromeccanica Complessi Automatici Device for the damped elastic support of rotating bars, particularly for bar feeders
JP2001071160A (ja) * 1999-09-07 2001-03-21 Mitsubishi Heavy Ind Ltd 高速レーザ加工装置
CN1675023A (zh) * 2002-05-24 2005-09-28 科尔摩根公司 反作用力转移系统
CN2575367Y (zh) * 2002-08-13 2003-09-24 经玉凤 稀土永磁减振器
JP2004088844A (ja) * 2002-08-23 2004-03-18 Nikon Corp リニアモータ装置、ステージ装置、及び露光装置
CN104769177A (zh) * 2012-11-09 2015-07-08 Bsh家用电器有限公司 用于带有旋转滚筒的家用器具的振荡阻尼器以及包括该阻尼器的家用器具
CN203808277U (zh) * 2014-03-07 2014-09-03 福建巨岸建设工程有限公司 一种建筑防震钢构件
CN107290930A (zh) * 2016-03-30 2017-10-24 上海微电子装备（集团）股份有限公司 光刻机系统和运动台直线电机定子自动复位装置和方法
CN105971357A (zh) * 2016-06-02 2016-09-28 燕山大学 活塞式sma-压电复合变摩擦阻尼器
CN207648044U (zh) * 2017-12-06 2018-07-24 广东铭恒信息科技有限公司 一种安全防震监控摄像机
CN207504993U (zh) * 2017-12-07 2018-06-15 广州恒威电子科技有限公司 一种船用红外摄像机
CN207867901U (zh) * 2018-03-21 2018-09-14 漳州市红酷橙网络科技有限公司 一种计算机硬盘防震保护装置
CN208605534U (zh) * 2018-07-16 2019-03-15 杭州航验环境技术有限公司 一种弹性阻尼器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113500508A (zh) * 2021-06-29 2021-10-15 吉安职业技术学院 一种磨床的工件智能夹持系统

Also Published As

Publication number Publication date
TW202039133A (zh) 2020-11-01
KR20200123737A (ko) 2020-10-30
JP2020175490A (ja) 2020-10-29
JP7283964B2 (ja) 2023-05-30
KR102799439B1 (ko) 2025-04-22
TWI850369B (zh) 2024-08-01

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Application publication date: 20201027

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