CN111822870A - Processing device - Google Patents

Processing device Download PDF

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Publication number
CN111822870A
CN111822870A CN202010303457.5A CN202010303457A CN111822870A CN 111822870 A CN111822870 A CN 111822870A CN 202010303457 A CN202010303457 A CN 202010303457A CN 111822870 A CN111822870 A CN 111822870A
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CN
China
Prior art keywords
processing
unit
linear motor
rail
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010303457.5A
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Chinese (zh)
Inventor
朴恩奎
吉元宏充
外山宏慈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111822870A publication Critical patent/CN111822870A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Units (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a processing device which alleviates the reaction force when a holding unit or a processing unit accelerates and decelerates. The processing device (2) comprises at least: a holding unit (4) for holding a workpiece; a processing unit (6) for processing the workpiece held by the holding unit; and a processing and feeding unit (8) which performs processing and feeding on the holding unit or the processing unit. The processing and feeding unit comprises: a mobile station (30) connected to the holding unit or the processing unit; a base (32) on which a guide rail (32a) that supports the moving table and extends in the machining feed direction is disposed; a linear motor rail (34) which drives the moving table and extends in the machining feed direction; a relaxation rail (32b) which is arranged on the base station, supports the linear motor rail, extends along the processing feeding direction and relaxes the reaction force when the mobile station accelerates and decelerates; and a damper (36) disposed between the linear motor rail and the base.

Description

Processing device
Technical Field
The invention relates to a processing device, comprising at least: a holding unit for holding a workpiece; a processing unit for processing the processed object held by the holding unit; and a processing and feeding unit which processes and feeds the holding unit or the processing unit.
Background
A wafer divided by predetermined dividing lines and having a plurality of devices such as ICs and LSIs formed on the front surface thereof is divided into device chips by a processing device such as a dicing device or a laser processing device, and the divided device chips are applied to electronic devices such as mobile phones and personal computers.
The cutting device and the laser processing device roughly comprise: a holding unit for holding the wafer; a processing unit for processing (cutting processing, laser processing) the wafer held by the holding unit; and a processing and feeding unit that performs processing and feeding by the holding unit or the processing unit, the wafer can be divided into the respective device chips with high accuracy (see, for example, patent documents 1 and 2).
Patent document 1: japanese laid-open patent publication No. 2008-279526
Patent document 1: japanese patent laid-open publication No. 2007-152355
However, when the holding unit or the processing unit is fed by the processing feeding unit, the holding unit or the processing unit is accelerated or decelerated by a reaction force, and the processing device is shaken, thereby causing a problem of hindering high-precision processing.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a machining device capable of relaxing a reaction force when a holding unit or a machining unit accelerates or decelerates.
In order to solve the above problem, the present invention provides the following processing apparatus. Namely, the processing apparatus includes at least: a holding unit for holding a workpiece; a processing unit that processes the workpiece held by the holding unit; and a processing and feeding unit that performs processing and feeding on the holding unit or the processing unit, wherein the processing and feeding unit includes at least: a mobile station connected to the holding unit or the processing unit; a base on which a guide rail is disposed to support the moving table and extend in a machining feed direction; a linear motor rail that drives the moving table and extends in a machining feed direction; a relaxation rail disposed on the base, supporting the linear motor rail, extending in the machining feed direction, and relaxing a reaction force when the moving table is accelerated or decelerated; and a damper disposed between the linear motor rail and the base.
Preferably, a permanent magnet is disposed on the linear motor track, and an electromagnet whose phase changes in opposition to the permanent magnet is disposed on the moving stage. A permanent magnet may be disposed on the moving stage, and an electromagnet whose phase changes relative to the permanent magnet may be disposed on the linear motor track. Preferably, the processing unit performs processing by irradiating the object held by the holding unit with a laser beam.
The processing device provided by the invention at least comprises: a holding unit for holding a workpiece; a processing unit that processes the workpiece held by the holding unit; and a processing and feeding unit that performs processing and feeding on the holding unit or the processing unit, wherein the processing and feeding unit includes at least: a mobile station connected to the holding unit or the processing unit; a base on which a guide rail is disposed to support the moving table and extend in a machining feed direction; a linear motor rail that drives the moving table and extends in a machining feed direction; a relaxation rail disposed on the base, supporting the linear motor rail, extending in the machining feed direction, and relaxing a reaction force when the moving table is accelerated or decelerated; and a damper disposed between the linear motor rail and the base, so that when the moving stage starts moving in the machining feed direction, the linear motor rail moves on the relaxation rail in a direction opposite to the moving direction of the moving stage due to a reaction force generated when the moving stage accelerates, and the reaction force generated when the moving stage accelerates is absorbed and relaxed by damping a kinetic energy of the linear motor rail by the damper.
In the machining device of the present invention, when the moving stage decelerates, the linear motor rail moves in the same direction as the moving direction of the moving stage on the relaxation rail due to the reaction force at the time of deceleration of the moving stage, and the reaction force at the time of deceleration of the moving stage is absorbed and relaxed by damping the kinetic energy of the linear motor rail by the damper. Therefore, according to the processing apparatus of the present invention, it is possible to alleviate the reaction force when the holding means or the processing means accelerates or decelerates, and to eliminate the problem that the processing apparatus rattles and hinders high-precision processing.
Drawings
Fig. 1 is a perspective view of a processing apparatus constructed according to the present invention.
Fig. 2 is an exploded perspective view of the processing feed unit shown in fig. 1.
Fig. 3 is a perspective view of the processing and feeding unit shown in fig. 1.
Fig. 4 is a schematic view of a magnetic damper.
Description of the reference symbols
2: a processing device; 4: a holding unit; 6: a processing unit; 8: a processing feeding unit; 30: a mobile station; 32: a base station; 32 a: a guide rail; 32 b: a mitigation rail; 34: a linear motor track; 36: a damper; 38: a permanent magnet; 48: an electromagnet.
Detailed Description
Hereinafter, preferred embodiments of a machining device according to the present invention will be described in detail with reference to the accompanying drawings.
With reference to fig. 1, a machining device, generally designated by the reference numeral 2, comprises at least: a holding means 4 for holding a workpiece; a processing unit 6 for processing the workpiece held by the holding unit 4; and a processing and feeding unit 8 for processing and feeding the holding unit 4 or the processing unit 6.
As shown in fig. 1, the holding unit 4 includes a base plate 10, a cylindrical support column 12 fixed to the upper surface of the base plate 10, and a cover plate 14 fixed to the upper end of the support column 12. A long hole 14a is formed in the cover plate 14, and a chuck table 16 extending upward through the long hole 14a is rotatably mounted on the upper end of the column 12. The chuck table 16 is rotated by a chuck table motor (not shown) built in the column 12. A porous circular suction chuck 18 connected to a suction unit (not shown) is disposed at an upper end portion of the chuck table 16. In the chuck table 16, suction force is generated on the upper surface of the suction chuck 18 by the suction unit, thereby sucking and holding a workpiece such as a wafer placed on the upper surface of the suction chuck 18. Further, a plurality of jigs 20 are arranged at intervals in the circumferential direction on the periphery of the chuck table 16.
The processing unit 6 of the illustrated embodiment is constituted by a laser beam irradiation unit including: a frame 24 extending upward from the upper surface of the support table 22 of the processing apparatus 2 and then extending substantially horizontally; a pulse laser beam oscillator (not shown) built in the housing 24; and a condenser 26 disposed on the lower surface of the front end of the housing 24. In the processing unit 6, the pulsed laser beam oscillated by the pulsed laser beam oscillator is condensed by the condenser 26, and the workpiece sucked and held by the chuck table 16 is irradiated with the condensed pulsed laser beam, whereby the workpiece is subjected to laser processing. An imaging unit 28 is attached to the lower surface of the front end of the housing 24, and the imaging unit 28 images the workpiece held by the holding unit 4 to detect a region to be laser-processed. The machining unit 6 may be a cutting unit that rotatably includes a cutting tool (not shown) that cuts a workpiece.
The machining and feeding unit 8 may perform machining and feeding on either the holding unit 4 or the machining unit 6, but in the illustrated embodiment, an example in which the machining and feeding unit 8 performs machining and feeding on the holding unit 4 will be described.
Referring to fig. 2 and 3, the machining feed unit 8 includes at least: a mobile station 30 to which the holding unit 4 is connected; a base 32 on which a guide rail 32a that supports the moving table 30 and extends in a machining feed direction (a direction indicated by an arrow X in fig. 2 and 3) is disposed; a linear motor rail 34 that drives the moving stage 30 and extends in the machining feed direction X; a relaxation rail 32b which is disposed on the base 32, supports the linear motor rail 34, extends in the machining feed direction X, and relaxes a reaction force when the moving stage 30 is accelerated or decelerated; and a damper 36 disposed between the linear motor rail 34 and the base 32.
The rectangular moving table 30 is supported on a guide rail 32a so as to be movable in the machining feed direction X. A plurality of permanent magnets 38 (see fig. 2) are disposed on the lower surface of the moving table 30, and N poles and S poles are alternately present along the machining feed direction X. Either the holding unit 4 or the processing unit 6 is connected to the moving table 30, and in the illustrated embodiment, as shown in fig. 1, an index feeding unit 40 is mounted on the upper surface of the moving table 30, and the substrate 10 of the holding unit 4 is mounted on the index feeding unit 40 so as to be movable in an index feeding direction indicated by an arrow Y in fig. 1, and the substrate 10 is index-fed in the index feeding direction Y. The indexing direction Y is a direction perpendicular to the machining direction X, and a plane defined by the machining direction X and the indexing direction Y is substantially horizontal.
As shown in fig. 1, the index unit 40 on the moving stage 30 includes a ball screw 42 coupled to the base plate 10 and extending in the index direction Y, and a motor 44 for rotating the ball screw 42. The index-feed unit 40 converts the rotational motion of the motor 44 into linear motion by the ball screw 42 and transmits the linear motion to the base plate 10, and indexes the holding unit 4 in the index-feed direction Y along the pair of guide rails 30a fixed to the upper surface of the moving table 30.
As shown in fig. 1 and 2, the base 32 of the machining feed unit 8 of the illustrated embodiment includes a rectangular main plate 32c fixed to the upper surface of the support table 22, and the main plate 32c extends in the machining feed direction X. The guide rails 32a extending in the machining feed direction X are provided at both ends of the main plate 32c in the short side direction (the indexing feed direction Y), and a pair of the guide rails 32a is provided. A pair of the relief rails 32b extending in the machine feed direction X are provided on the upper surface of the main plate 32c at intervals in the index feed direction Y. As shown in fig. 2, the base 32 includes a pair of rectangular spring receiving plates 32d, and the pair of spring receiving plates 32d are fixed to the upper surface of the main plate 32c with a gap therebetween in the machine feeding direction X. The pair of spring receiving plates 32d of the illustrated embodiment are disposed between the one guide rail 32a and the one relief guide rail 32 b.
As shown in fig. 2, the linear motor track 34 includes: a rectangular movable plate 46 supported movably in the machining feed direction X on the relief rail 32b of the base 32; and a plurality of electromagnets 48 disposed on the upper surface of the movable plate 46. The longitudinal direction of the movable plate 46 coincides with the machining feed direction X, and the plurality of electromagnets 48 are arranged in the machining feed direction X. The plurality of electromagnets 48 change in phase relative to the permanent magnets 38 of the mobile station 30.
In the linear motor rail 34, the plurality of electromagnets 48 generate magnetic thrust by interaction with the permanent magnets 38 of the moving stage 30, and the moving stage 30 is moved in the machining feed direction X along the guide rail 32 a. Thereby, the holding unit 4 on the movable table 30 is fed in the machining feed direction X. When the moving stage 30 is moved, the linear motor rail 34 moves on the relaxation rail 32b by a reaction force generated when the moving stage 30 accelerates or decelerates. In contrast to the illustrated embodiment, a plurality of permanent magnets may be disposed on the linear motor track 34, and a plurality of electromagnets, the phase of which changes relative to the permanent magnets of the linear motor track 34, may be disposed on the moving stage 30.
As shown in fig. 2 and 3, the damper 36 of the illustrated embodiment includes: a guide bar 50 extending in the machine feed direction X; a spring receiving piece 52 slidably inserted into an intermediate portion of the guide rod 50; and a pair of coil springs 54 inserted into the guide rods 50. Both end portions of the guide rod 50 are supported by the pair of spring support plates 32d of the base 32. The spring support 52 is fixed to the side of the linear motor track 34. As shown in fig. 3, one coil spring 54 is positioned between the spring receiving piece 52 and one spring receiving plate 32d of the base 32, and the other coil spring 54 is positioned between the spring receiving piece 52 and the other spring receiving plate 32d of the base 32. In the damper 36, when the linear motor rail 34 moves on the relaxing guide rail 32b, the spring receiving piece 52 that moves together with the linear motor rail 34 contracts the coil spring 54 in cooperation with the spring receiving plate 32d, thereby damping the kinetic energy of the linear motor rail 34.
When a workpiece such as a wafer is processed using the processing apparatus 2 as described above, the workpiece is first held by the chuck table 16 of the holding unit 4, and the holding unit 4 holding the workpiece is moved to a position below the imaging unit 28 by the processing feed unit 8, thereby imaging the workpiece. Next, an area to be laser-processed is detected from the image of the workpiece captured by the imaging unit 28. Next, while the holding means 4 holding the workpiece is being processed and fed by the processing and feeding means 8, the workpiece is irradiated with a laser beam by the processing means 6 to be subjected to laser processing.
When the holding unit 4 is moved in the machining feed direction X by the machining feed unit 8, the moving table 30 is moved in the machining feed direction X by the linear motor rail 34. When the moving table 30 starts moving in the machining feed direction, the linear motor rail 34 moves on the relief guide rail 32b in the direction opposite to the direction in which the moving table 30 moves due to the reaction force when the moving table 30 accelerates. When the linear motor rail 34 moves on the relaxing guide rail 32b, the spring support piece 52 moves together with the linear motor rail 34, the coil spring 54 contracts, and the kinetic energy of the linear motor rail 34 is attenuated by the damper 36. In this way, in the machining device 2, the linear motor rail 34 moves in the direction opposite to the moving direction of the moving table 30, and the kinetic energy of the linear motor rail 34 is attenuated by the damper 36, thereby absorbing and relaxing the reaction force when the moving table 30 accelerates.
In the machining device 2, when the moving stage 30 decelerates, the linear motor rail 34 moves in the same direction as the moving direction of the moving stage 30 due to the reaction force generated when the moving stage 30 decelerates, and the spring support piece 52 moves to contract the coil spring 54, so that the kinetic energy of the linear motor rail 34 is attenuated by the damper 36. In this way, in the machining device 2, the linear motor rail 34 moves in the same direction as the moving direction of the moving table 30, and the kinetic energy of the linear motor rail 34 is attenuated by the damper 36, so that the reaction force at the time of deceleration of the moving table 30 is absorbed and relaxed. Therefore, according to the machining device 2, the reaction force generated when the holding unit 4 or the machining unit 6 accelerates or decelerates can be alleviated, and the problem that the machining device 2 rattles and hinders high-precision machining can be solved.
In the illustrated embodiment, the damper 36 has been described as having the pair of coil springs 54, but may be a magnetic damper having a magnet. For example, as shown in fig. 4, the following magnetic damper 36' may be used: the linear motor includes a movable magnet piece 56 slidably inserted into an intermediate portion of the guide rod 50 and attached to the linear motor rail 34, and a pair of fixed magnet pieces 58 fixed to the base 32. In this case, the movable magnet piece 56 and the pair of fixed magnet pieces 58 may be arranged such that the S pole of the movable magnet piece 56 faces the S pole of one of the fixed magnet pieces 58 and the N pole of the movable magnet piece 56 faces the N pole of the other of the fixed magnet pieces 58.

Claims (4)

1. A processing apparatus, comprising:
a holding unit for holding a workpiece;
a processing unit that processes the workpiece held by the holding unit; and
a processing feeding unit that performs processing feeding of the holding unit or the processing unit,
it is characterized in that the preparation method is characterized in that,
the processing and feeding unit at least comprises:
a mobile station connected to the holding unit or the processing unit;
a base on which a guide rail is disposed to support the moving table and extend in a machining feed direction;
a linear motor rail that drives the moving table and extends in a machining feed direction;
a relaxation rail disposed on the base, supporting the linear motor rail, extending in the machining feed direction, and relaxing a reaction force when the moving table is accelerated or decelerated; and
and a damper disposed between the linear motor rail and the base.
2. The processing device according to claim 1,
a permanent magnet is disposed on the linear motor track, and an electromagnet whose phase changes in opposition to the permanent magnet is disposed on the moving stage.
3. The processing device according to claim 1,
a permanent magnet is disposed on the movable stage, and an electromagnet whose phase changes in opposition to the permanent magnet is disposed on the linear motor track.
4. The processing device according to claim 1,
the processing unit applies a laser beam to the workpiece held by the holding unit to perform processing.
CN202010303457.5A 2019-04-22 2020-04-17 Processing device Pending CN111822870A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-080848 2019-04-22
JP2019080848A JP7283964B2 (en) 2019-04-22 2019-04-22 processing equipment

Publications (1)

Publication Number Publication Date
CN111822870A true CN111822870A (en) 2020-10-27

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ID=72913594

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Application Number Title Priority Date Filing Date
CN202010303457.5A Pending CN111822870A (en) 2019-04-22 2020-04-17 Processing device

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Country Link
JP (1) JP7283964B2 (en)
KR (1) KR20200123737A (en)
CN (1) CN111822870A (en)

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CN113500508A (en) * 2021-06-29 2021-10-15 吉安职业技术学院 Intelligent workpiece clamping system of grinding machine

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Publication number Priority date Publication date Assignee Title
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