JP7283964B2 - processing equipment - Google Patents

processing equipment Download PDF

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JP7283964B2
JP7283964B2 JP2019080848A JP2019080848A JP7283964B2 JP 7283964 B2 JP7283964 B2 JP 7283964B2 JP 2019080848 A JP2019080848 A JP 2019080848A JP 2019080848 A JP2019080848 A JP 2019080848A JP 7283964 B2 JP7283964 B2 JP 7283964B2
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processing
linear motor
moving table
pair
rail
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JP2020175490A (en
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恩奎 朴
宏充 吉元
宏慈 外山
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Disco Corp
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Disco Corp
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Priority to JP2019080848A priority Critical patent/JP7283964B2/en
Priority to KR1020200034183A priority patent/KR20200123737A/en
Priority to CN202010303457.5A priority patent/CN111822870A/en
Priority to TW109112889A priority patent/TW202039133A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Combustion & Propulsion (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Units (AREA)

Description

本発明は、被加工物を保持する保持手段と、保持手段に保持された被加工物を加工する加工手段と、保持手段または加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置に関する。 The present invention is a machining system comprising at least holding means for holding a workpiece, machining means for machining the workpiece held by the holding means, and machining feed means for machining and feeding the holding means or the machining means. Regarding the device.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、ダイシング装置、レーザー加工装置等の加工装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer having a plurality of devices such as ICs and LSIs partitioned by division lines and formed on the surface thereof is divided into individual device chips by a processing apparatus such as a dicing apparatus and a laser processing apparatus, and each divided device chip is carried. It is used in electrical equipment such as telephones and personal computers.

ダイシング装置、レーザー加工装置は、ウエーハを保持する保持手段と、保持手段に保持されたウエーハを加工（ダイシング加工、レーザー加工）する加工手段と、保持手段または加工手段を加工送りする加工送り手段と、から概ね構成されていてウエーハを高精度に個々のデバイスチップに分割することができる（たとえば特許文献１および２参照）。 A dicing apparatus and a laser processing apparatus comprise holding means for holding a wafer, processing means for processing (dicing, laser processing) the wafer held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. , and can divide the wafer into individual device chips with high precision (see Patent Documents 1 and 2, for example).

特開２００８－２７９５２６号公報JP 2008-279526 A 特開２００７－１５２３５５号公報JP 2007-152355 A

しかし、保持手段または加工手段を加工送り手段によって加工送りすると、保持手段または加工手段が加速および減速する際の反力によって加工装置に揺れが生じて高精度な加工に支障をきたすという問題がある。 However, when the holding means or the processing means is processed and fed by the processing feeding means, there is a problem that the reaction force generated when the holding means or the processing means accelerates and decelerates causes the processing apparatus to shake, which hinders high-precision processing. .

上記事実に鑑みてなされた本発明の課題は、保持手段または加工手段が加速および減速する際の反力を緩和することができる加工装置を提供することである。 SUMMARY OF THE INVENTION An object of the present invention, which has been made in view of the above facts, is to provide a processing apparatus capable of reducing the reaction force when the holding means or processing means accelerates and decelerates.

上記課題を解決するために本発明が提供するのは以下の加工装置である。すなわち、被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対のばね受け部を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、該ダンパーは、両端部が該基台の該一対のばね受け部に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに固定されたばね受け片と、該ガイド棒に挿入された一対のコイルばねとを含み、該一対のコイルばねの一方は、該ばね受け片と該一対のばね受け部の一方との間に位置づけられ、該一対のコイルばねの他方は、該ばね受け片と該一対のばね受け部の他方との間に位置づけられている加工装置である。
また、本発明によれば、以下の加工装置も提供される。すなわち、被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対の固定磁石を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、該ダンパーは、両端部が該基台の該一対の固定磁石に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに装着された可動磁石とを含み、該可動磁石のＳ極と該一対の固定磁石の一方のＳ極とが対面し、該可動磁石のＮ極と該一対の固定磁石の他方のＮ極とが対面している加工装置が提供される。 In order to solve the above problems, the present invention provides the following processing apparatus. That is, it is composed of at least holding means for holding a workpiece, processing means for processing the workpiece held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. In the processing apparatus, the processing feed means includes a moving table to which the holding means or the processing means is connected, and a guide rail that supports the moving table and extends in the processing feed direction. a base having a pair of spring receiving portions spaced apart in a direction , a linear motor rail that drives the moving table and extends in the processing feed direction, and the linear motor rail that is disposed on the base and includes: At least a damping rail that supports and extends in the processing feed direction and dampens the reaction force when the moving table accelerates and decelerates, and a damper disposed between the linear motor rail and the base. The damper includes a guide rod whose both ends are supported by the pair of spring receiving portions of the base and extends along the processing feed direction; It includes a fixed spring receiving piece and a pair of coil springs inserted into the guide rod, one of the pair of coil springs positioned between the spring receiving piece and one of the pair of spring receiving portions. , the other of the pair of coil springs is a processing device positioned between the spring receiving piece and the other of the pair of spring receiving portions.
Moreover, according to this invention, the following processing apparatuses are also provided. That is, it is composed of at least holding means for holding a workpiece, processing means for processing the workpiece held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. In the processing apparatus, the processing feed means includes a moving table to which the holding means or the processing means is connected, and a guide rail that supports the moving table and extends in the processing feed direction. a base having a pair of fixed magnets spaced apart in the direction, a linear motor rail driving the moving table and extending in the processing feed direction, and a linear motor rail disposed on the base supporting the linear motor rail and a damper disposed between the linear motor rail and the base. The damper includes a guide bar whose both ends are supported by the pair of fixed magnets of the base and extends along the processing feed direction, and is slidably inserted into the guide bar and mounted on the linear motor rail. the S pole of the movable magnet faces the S pole of one of the pair of fixed magnets, and the N pole of the movable magnet faces the other N pole of the pair of fixed magnets. A processing apparatus is provided.

好ましくは、該リニアモータレールには永久磁石が配設され、該移動テーブルには該永久磁石に対向して位相が変化する電磁石が配設される。該移動テーブルには永久磁石が配設され、該リニアモータレールには該永久磁石に対向して位相が変化する電磁石が配設されていてもよい。該加工手段は該保持手段に保持された被加工物にレーザー光線を照射して加工を施すのが好都合である。 Preferably, the linear motor rail is provided with a permanent magnet, and the moving table is provided with an electromagnet whose phase changes in opposition to the permanent magnet. A permanent magnet may be arranged on the moving table, and an electromagnet whose phase changes in opposition to the permanent magnet may be arranged on the linear motor rail. It is convenient for the processing means to process the workpiece held by the holding means by irradiating it with a laser beam.

本発明が提供する加工装置は、被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対のばね受け部を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、該ダンパーは、両端部が該基台の該一対のばね受け部に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに固定されたばね受け片と、該ガイド棒に挿入された一対のコイルばねとを含み、該一対のコイルばねの一方は、該ばね受け片と該一対のばね受け部の一方との間に位置づけられ、該一対のコイルばねの他方は、該ばね受け片と該一対のばね受け部の他方との間に位置づけられているので、移動テーブルが加工送り方向への移動を開始すると、移動テーブルが加速する際の反力で、移動テーブルが移動する方向とは反対方向にリニアモータレールが緩和レール上を移動すると共に、リニアモータレールの運動エネルギーをダンパーで減衰させることにより、移動テーブルが加速する際の反力を吸収して緩和する。
また、本発明の加工装置は、被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対の固定磁石を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、該ダンパーは、両端部が該基台の該一対の固定磁石に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに装着された可動磁石とを含み、該可動磁石のＳ極と該一対の固定磁石の一方のＳ極とが対面し、該可動磁石のＮ極と該一対の固定磁石の他方のＮ極とが対面しているので、移動テーブルが加工送り方向への移動を開始すると、移動テーブルが加速する際の反力で、移動テーブルが移動する方向とは反対方向にリニアモータレールが緩和レール上を移動すると共に、リニアモータレールの運動エネルギーをダンパーで減衰させることにより、移動テーブルが加速する際の反力を吸収して緩和する。 A processing apparatus provided by the present invention includes holding means for holding a workpiece, processing means for processing the workpiece held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. and wherein the processing feed means comprises a moving table to which the holding means or the processing means is connected, and a guide rail supporting the moving table and extending in the processing feed direction. A base having a pair of spring receiving portions arranged at intervals in the processing feed direction , a linear motor rail for driving the moving table and extending in the processing feed direction, and arranged on the base a relaxation rail that supports the linear motor rail, extends in the processing feed direction, and relieves reaction force when the moving table accelerates and decelerates; a damper having both ends supported by the pair of spring receiving portions of the base and extending along the processing feed direction; and a guide rod slidably inserted into the guide rod. a spring receiving piece fixed to the linear motor rail and a pair of coil springs inserted into the guide rod, one of the pair of coil springs being one of the spring receiving piece and the pair of spring receiving portions and the other of the pair of coil springs is positioned between the spring receiving piece and the other of the pair of spring receiving portions. is started, the linear motor rail moves on the relaxation rail in the direction opposite to the direction in which the moving table moves due to the reaction force when the moving table accelerates, and the kinetic energy of the linear motor rail is attenuated by the damper. This absorbs and mitigates the reaction force when the moving table accelerates.
Further, the processing apparatus of the present invention comprises holding means for holding a workpiece, machining means for machining the workpiece held by the holding means, and machining feed means for machining and feeding the holding means or the machining means. and wherein the processing feed means comprises a moving table to which the holding means or the processing means is connected, and a guide rail supporting the moving table and extending in the processing feed direction. A base having a pair of fixed magnets arranged and spaced apart in the processing feed direction, a linear motor rail for driving the moving table and extending in the processing feed direction, and disposed on the base a relaxation rail that supports the linear motor rail, extends in the direction of processing feed, and relieves reaction force when the moving table accelerates and decelerates, and is disposed between the linear motor rail and the base. a damper, the damper being slidably inserted into the guide rod whose both ends are supported by the pair of fixed magnets of the base and which extends along the processing feed direction; a movable magnet mounted on the linear motor rail, the S pole of the movable magnet and the S pole of one of the pair of fixed magnets facing each other, and the N pole of the movable magnet and the other of the pair of fixed magnets When the moving table starts moving in the processing feed direction, the reaction force when the moving table accelerates causes the linear motor rail to move in the direction opposite to the moving direction of the moving table. By moving on the relief rail and attenuating the kinetic energy of the linear motor rail with a damper, the reaction force when the moving table accelerates is absorbed and mitigated.

また、本発明の加工装置においては、移動テーブルが減速すると、移動テーブルが減速する際の反力で、移動テーブルが移動している方向と同じ方向にリニアモータレールが緩和レール上を移動すると共に、リニアモータレールの運動エネルギーをダンパーで減衰させることにより、移動テーブルが減速する際の反力を吸収して緩和する。したがって、本発明の加工装置によれば、保持手段または加工手段が加速および減速する際の反力を緩和することができ、加工装置に揺れが生じて高精度な加工に支障をきたすという問題が解消する。 In addition, in the processing apparatus of the present invention, when the moving table decelerates, the linear motor rail moves on the relief rail in the same direction as the moving table due to the reaction force when the moving table decelerates. By attenuating the kinetic energy of the linear motor rail with a damper, the reaction force when the moving table decelerates is absorbed and alleviated. Therefore, according to the processing apparatus of the present invention, the reaction force when the holding means or the processing means accelerates and decelerates can be alleviated, and there is no problem that the processing apparatus shakes and interferes with high-precision processing. cancel.

本発明に従って構成された加工装置の斜視図。1 is a perspective view of a processing apparatus constructed in accordance with the present invention; FIG. 図１に示す加工送り手段の分解斜視図。FIG. 2 is an exploded perspective view of the processing feed means shown in FIG. 1; 図１に示す加工送り手段の斜視図。FIG. 2 is a perspective view of the processing feed means shown in FIG. 1; 磁気ダンパーの模式図。Schematic diagram of a magnetic damper.

以下、本発明に従って構成された加工装置の好適実施形態について図面を参照しつつ説明する。 A preferred embodiment of a processing apparatus constructed according to the present invention will be described below with reference to the drawings.

図１を参照して説明すると、全体を符号２で示す加工装置は、被加工物を保持する保持手段４と、保持手段４に保持された被加工物を加工する加工手段６と、保持手段４または加工手段６を加工送りする加工送り手段８と、から少なくとも構成される。 Referring to FIG. 1, a processing apparatus generally indicated by reference numeral 2 includes holding means 4 for holding a workpiece, processing means 6 for machining the workpiece held by the holding means 4, and holding means. 4 or a processing feed means 8 for feeding the processing means 6 for processing.

図１に示すとおり、保持手段４は、基板１０と、基板１０の上面に固定された円筒状の支柱１２と、支柱１２の上端に固定されたカバー板１４とを含む。カバー板１４には長穴１４ａが形成されていて、長穴１４ａを通って上方に延びるチャックテーブル１６が支柱１２の上端に回転自在に搭載されている。チャックテーブル１６は、支柱１２に内蔵されたチャックテーブル用モータ（図示していない。）によって回転される。チャックテーブル１６の上端部分には、吸引手段（図示していない。）に接続された多孔質の円形の吸着チャック１８が配置されている。チャックテーブル１６においては、吸引手段で吸着チャック１８の上面に吸引力を生成することにより、吸着チャック１８の上面に載せられたウエーハ等の被加工物を吸引保持するようになっている。また、チャックテーブル１６の周縁には、周方向に間隔をおいて複数のクランプ２０が配置されている。 As shown in FIG. 1, the holding means 4 includes a substrate 10, a cylindrical support 12 fixed to the upper surface of the substrate 10, and a cover plate 14 fixed to the upper end of the support 12. As shown in FIG. A long hole 14a is formed in the cover plate 14, and a chuck table 16 extending upward through the long hole 14a is rotatably mounted on the upper end of the column 12. As shown in FIG. The chuck table 16 is rotated by a chuck table motor (not shown) incorporated in the column 12 . A porous circular suction chuck 18 connected to suction means (not shown) is arranged on the upper end portion of the chuck table 16 . In the chuck table 16, an object to be processed such as a wafer placed on the upper surface of the suction chuck 18 is sucked and held by generating a suction force on the upper surface of the suction chuck 18 with a suction means. In addition, a plurality of clamps 20 are arranged along the periphery of the chuck table 16 at intervals in the circumferential direction.

図示の実施形態の加工手段６は、加工装置２の支持台２２の上面から上方に延び次いで実質上水平に延びる枠体２４と、枠体２４に内蔵されたパルスレーザー光線発振器（図示していない。）と、枠体２４の先端下面に配置された集光器２６とを含むレーザー光線照射手段から構成されている。そして、加工手段６においては、パルスレーザー光線発振器が発振したパルスレーザー光線を集光器２６で集光して、チャックテーブル１６に吸引保持された被加工物に照射することによって、被加工物にレーザー加工を施すようになっている。また、枠体２４の先端下面には、保持手段４に保持された被加工物を撮像してレーザー加工すべき領域を検出するための撮像手段２８が装着されている。なお、加工手段６は、被加工物を切削する切削ブレード（図示していない。）を回転可能に備えた切削手段から構成されていてもよい。 The processing means 6 of the illustrated embodiment includes a frame 24 that extends upward from the upper surface of the support base 22 of the processing device 2 and then extends substantially horizontally, and a pulsed laser beam oscillator (not shown) incorporated in the frame 24. ) and a condenser 26 arranged on the lower surface of the tip of the frame 24 . In the processing means 6, the pulsed laser beam oscillated by the pulsed laser beam oscillator is condensed by the condenser 26 and irradiated onto the workpiece sucked and held on the chuck table 16, thereby performing laser processing on the workpiece. is to be applied. Further, an imaging means 28 is attached to the lower surface of the tip of the frame 24 for detecting an area to be laser-processed by imaging the workpiece held by the holding means 4 . The processing means 6 may be composed of cutting means having a rotatable cutting blade (not shown) for cutting the workpiece.

加工送り手段８は保持手段４または加工手段６のどちらを加工送りするようになっていてもよいが、図示の実施形態では加工送り手段８が保持手段４を加工送りする例について説明する。 The processing-feeding means 8 may work-feed either the holding means 4 or the processing means 6, but in the illustrated embodiment, an example in which the processing-feeding means 8 feeds the holding means 4 will be described.

図２および図３を参照して説明すると、加工送り手段８は、保持手段４が連結される移動テーブル３０と、移動テーブル３０を支持し加工送り方向（図２および図３に矢印Ｘで示す方向）に延在する案内レール３２ａが配設された基台３２と、移動テーブル３０を駆動し加工送り方向Ｘに延在するリニアモータレール３４と、基台３２に配設されリニアモータレール３４を支持し加工送り方向Ｘに延在し移動テーブル３０が加速および減速する際の反力を緩和する緩和レール３２ｂと、リニアモータレール３４と基台３２との間に配設されたダンパー３６と、から少なくとも構成される。 2 and 3, the processing feeding means 8 includes a moving table 30 to which the holding means 4 is connected, and a moving table 30 that supports the processing feeding direction (indicated by arrow X in FIGS. 2 and 3). direction), a linear motor rail 34 that drives the moving table 30 and extends in the processing feed direction X, and a linear motor rail 34 that is disposed on the base 32 and a damper 36 disposed between the linear motor rail 34 and the base 32; , consisting at least of

矩形状の移動テーブル３０は、加工送り方向Ｘに移動自在に案内レール３２ａに支持されている。移動テーブル３０の下面には複数の永久磁石３８（図２参照）が配設されており、加工送り方向Ｘに沿ってＮ極およびＳ極が交互に現れるようになっている。移動テーブル３０には、保持手段４または加工手段６のどちらかが連結されるが、図示の実施形態では図１に示すとおり、移動テーブル３０の上面には、保持手段４の基板１０が図１に矢印Ｙで示す割り出し送り方向に移動自在に搭載されていると共に、割り出し送り方向Ｙに基板１０を割り出し送りする割り出し送り手段４０が搭載されている。なお、割り出し送り方向Ｙは加工送り方向Ｘに直交する方向であり、加工送り方向Ｘおよび割り出し送り方向Ｙが規定する平面は実質上水平である。 A rectangular moving table 30 is supported by guide rails 32a so as to be movable in the processing feed direction X. As shown in FIG. A plurality of permanent magnets 38 (see FIG. 2) are arranged on the lower surface of the moving table 30 so that N poles and S poles appear alternately along the feed direction X for processing. Either the holding means 4 or the processing means 6 is connected to the moving table 30. In the illustrated embodiment, as shown in FIG. , and an indexing means 40 for indexing and feeding the substrate 10 in the indexing direction Y is mounted. The indexing feed direction Y is a direction orthogonal to the machining feed direction X, and the plane defined by the machining feed direction X and the indexing feed direction Y is substantially horizontal.

図１に示すとおり、移動テーブル３０上の割り出し送り手段４０は、基板１０に連結され割り出し送り方向Ｙに延びるボールねじ４２と、ボールねじ４２を回転させるモータ４４とを有する。そして、割り出し送り手段４０は、ボールねじ４２によりモータ４４の回転運動を直線運動に変換して基板１０に伝達し、移動テーブル３０の上面に固定された一対の案内レール３０ａに沿って割り出し送り方向Ｙに保持手段４を割り出し送りするようになっている。 As shown in FIG. 1, the indexing means 40 on the moving table 30 has a ball screw 42 connected to the substrate 10 and extending in the indexing direction Y, and a motor 44 for rotating the ball screw 42 . The indexing feed means 40 converts the rotary motion of the motor 44 into linear motion by means of the ball screw 42 and transmits it to the substrate 10. Y is adapted to index and feed the holding means 4 .

図１および図２に示すとおり、図示の実施形態の加工送り手段８の基台３２は、支持台２２の上面に固定された長方形状のメインプレート３２ｃを有し、メインプレート３２ｃは加工送り方向Ｘに延在している。メインプレート３２ｃの短手方向（割り出し送り方向Ｙ）の両端部には加工送り方向Ｘに延在する上記案内レール３２ａが設けられており、上記案内レール３２ａは一対設けられている。メインプレート３２ｃの上面には加工送り方向Ｘに延在する上記緩和レール３２ｂが割り出し送り方向Ｙに間隔をおいて一対設けられている。また、図２に示すとおり、基台３２は、加工送り方向Ｘに間隔をおいてメインプレート３２ｃの上面に固定された矩形状の一対のばね受け板３２ｄを含む。図示の実施形態の一対のばね受け板３２ｄは、一方の案内レール３２ａと一方の緩和レール３２ｂとの間に配置されている。 As shown in FIGS. 1 and 2, the base 32 of the processing feed means 8 of the illustrated embodiment has a rectangular main plate 32c fixed to the upper surface of the support table 22, and the main plate 32c extends in the processing feed direction. Extends to X. The guide rails 32a extending in the processing feed direction X are provided at both ends of the main plate 32c in the lateral direction (indexing feed direction Y), and a pair of the guide rails 32a are provided. A pair of relaxation rails 32b extending in the processing feed direction X are provided on the upper surface of the main plate 32c at intervals in the indexing feed direction Y. As shown in FIG. Further, as shown in FIG. 2, the base 32 includes a pair of rectangular spring bearing plates 32d fixed to the upper surface of the main plate 32c with a space therebetween in the feed direction X. As shown in FIG. A pair of spring bearing plates 32d in the illustrated embodiment are positioned between one guide rail 32a and one relief rail 32b.

図２に示すとおり、リニアモータレール３４は、加工送り方向Ｘに移動自在に基台３２の緩和レール３２ｂに支持された長方形状の可動板４６と、可動板４６の上面に配設された複数の電磁石４８とを含む。可動板４６の長手方向は加工送り方向Ｘに整合しており、複数の電磁石４８は加工送り方向Ｘに整列している。複数の電磁石４８は、移動テーブル３０の永久磁石３８に対向して位相が変化するようになっている。 As shown in FIG. 2, the linear motor rail 34 includes a rectangular movable plate 46 supported by the relaxation rails 32b of the base 32 so as to be movable in the processing feed direction X, and a plurality of movable plates 46 arranged on the upper surface of the movable plate 46. and an electromagnet 48 of . The longitudinal direction of the movable plate 46 is aligned with the processing feed direction X, and the plurality of electromagnets 48 are aligned with the processing feed direction X. As shown in FIG. The plurality of electromagnets 48 face the permanent magnets 38 of the moving table 30 and change their phases.

そして、リニアモータレール３４においては、複数の電磁石４８と移動テーブル３０の永久磁石３８との相互作用により磁気的な推進力を生成し、案内レール３２ａに沿って移動テーブル３０を加工送り方向Ｘに移動させるようになっている。これによって、移動テーブル３０上の保持手段４が加工送り方向Ｘに加工送りされる。また、リニアモータレール３４は、移動テーブル３０を移動させると、移動テーブル３０が加速および減速する際の反力によって、緩和レール３２ｂ上を移動するようになっている。なお、図示の実施形態とは逆にリニアモータレール３４に複数の永久磁石が配設され、移動テーブル３０にリニアモータレール３４の永久磁石に対向して位相が変化する複数の電磁石が配設されていてもよい。 In the linear motor rail 34, interaction between the plurality of electromagnets 48 and the permanent magnet 38 of the moving table 30 generates a magnetic driving force to move the moving table 30 in the processing feed direction X along the guide rail 32a. It is designed to be moved. As a result, the holding means 4 on the moving table 30 is fed in the processing feed direction X. As shown in FIG. Further, when the moving table 30 is moved, the linear motor rail 34 moves on the relief rail 32b by the reaction force when the moving table 30 is accelerated and decelerated. Contrary to the illustrated embodiment, a plurality of permanent magnets are arranged on the linear motor rail 34, and a plurality of electromagnets whose phases are changed facing the permanent magnets of the linear motor rail 34 are arranged on the moving table 30. may be

図示の実施形態のダンパー３６は、図２および図３に示すとおり、加工送り方向Ｘに沿って延びるガイド棒５０と、ガイド棒５０の中間部に摺動自在に挿入されたばね受け片５２と、ガイド棒５０に挿入された一対のコイルばね５４とを含む。ガイド棒５０の両端部は基台３２の一対のばね受け板３２ｄに支持されている。ばね受け片５２はリニアモータレール３４の側面に固定されている。図３に示すとおり、一方のコイルばね５４は、ばね受け片５２と基台３２の一方のばね受け板３２ｄとの間に位置づけられ、他方のコイルばね５４は、ばね受け片５２と基台３２の他方のばね受け板３２ｄとの間に位置づけられている。そして、ダンパー３６においては、リニアモータレール３４が緩和レール３２ｂ上を移動した際、リニアモータレール３４と共に移動したばね受け片５２が、ばね受け板３２ｄと協働してコイルばね５４を収縮させることによって、リニアモータレール３４の運動エネルギーを減衰させる。 As shown in FIGS. 2 and 3, the damper 36 of the illustrated embodiment includes a guide rod 50 extending along the processing feed direction X, a spring receiving piece 52 slidably inserted in the intermediate portion of the guide rod 50, and a pair of coil springs 54 inserted into the guide rod 50 . Both ends of the guide rod 50 are supported by a pair of spring receiving plates 32d of the base 32. As shown in FIG. The spring receiving piece 52 is fixed to the side surface of the linear motor rail 34. As shown in FIG. As shown in FIG. 3, one coil spring 54 is positioned between the spring receiving piece 52 and one spring receiving plate 32d of the base 32, and the other coil spring 54 is positioned between the spring receiving piece 52 and the base 32. and the other spring receiving plate 32d. In the damper 36, when the linear motor rail 34 moves on the relief rail 32b, the spring receiving piece 52 moved together with the linear motor rail 34 cooperates with the spring receiving plate 32d to contract the coil spring 54. Attenuates the kinetic energy of the linear motor rail 34 by .

上述したとおりの加工装置２を用いてウエーハ等の被加工物に加工を施す際は、まず、被加工物を保持手段４のチャックテーブル１６で保持し、被加工物を保持した保持手段４を加工送り手段８で撮像手段２８の下方に移動させて被加工物を撮像する。次いで、撮像手段２８で撮像した被加工物の画像に基づいて、レーザー加工すべき領域を検出する。次いで、被加工物を保持した保持手段４を加工送り手段８で加工送りしながら、加工手段６によって被加工物にレーザー光線を照射してレーザー加工を施す。 When processing a workpiece such as a wafer using the processing apparatus 2 as described above, first, the workpiece is held by the chuck table 16 of the holding means 4, and the holding means 4 holding the workpiece is moved. The processing feed means 8 moves the imaging means 28 downward to take an image of the workpiece. Next, based on the image of the workpiece picked up by the imaging means 28, the area to be laser-processed is detected. Next, while the holding means 4 holding the workpiece is fed by the processing feed means 8, the workpiece is irradiated with a laser beam by the processing means 6 to perform laser processing.

加工送り手段８で保持手段４を加工送り方向Ｘに移動させるときは、リニアモータレール３４によって移動テーブル３０を加工送り方向Ｘに移動させる。移動テーブル３０が加工送り方向への移動を開始すると、移動テーブル３０が加速する際の反力によって、移動テーブル３０が移動する方向とは反対方向にリニアモータレール３４が緩和レール３２ｂ上を移動する。また、リニアモータレール３４が緩和レール３２ｂ上を移動すると、リニアモータレール３４と共にばね受け片５２が移動してコイルばね５４を収縮させ、リニアモータレール３４の運動エネルギーがダンパー３６によって減衰される。このように、加工装置２においては、移動テーブル３０の移動方向と反対方向にリニアモータレール３４が移動すると共に、リニアモータレール３４の運動エネルギーをダンパー３６で減衰させることにより、移動テーブル３０が加速する際の反力を吸収して緩和する。 When the holding means 4 is moved in the work feed direction X by the work feed means 8 , the moving table 30 is moved in the work feed direction X by the linear motor rail 34 . When the moving table 30 starts to move in the processing feed direction, the linear motor rail 34 moves on the relaxation rail 32b in the direction opposite to the moving direction of the moving table 30 due to the reaction force when the moving table 30 accelerates. . Further, when the linear motor rail 34 moves on the relief rail 32 b , the spring receiving piece 52 moves together with the linear motor rail 34 to contract the coil spring 54 , and the kinetic energy of the linear motor rail 34 is damped by the damper 36 . As described above, in the processing apparatus 2, the linear motor rail 34 moves in the direction opposite to the moving direction of the moving table 30, and the kinetic energy of the linear motor rail 34 is attenuated by the damper 36, thereby accelerating the moving table 30. Absorbs and mitigates the reaction force when doing.

また、加工装置２においては、移動テーブル３０が減速すると、移動テーブル３０が減速する際の反力によって、移動テーブル３０が移動している方向と同じ方向にリニアモータレール３４が移動し、また、ばね受け片５２が移動してコイルばね５４を収縮させ、リニアモータレール３４の運動エネルギーをダンパー３６によって減衰させる。このように、加工装置２においては、移動テーブル３０の移動方向と同じ方向にリニアモータレール３４が移動すると共に、リニアモータレール３４の運動エネルギーをダンパー３６で減衰させることにより、移動テーブル３０が減速する際の反力を吸収して緩和する。したがって、加工装置に２よれば、保持手段４または加工手段６が加速および減速する際の反力を緩和することができ、加工装置２に揺れが生じて高精度な加工に支障をきたすという問題が解消する。 Further, in the processing device 2, when the moving table 30 decelerates, the linear motor rail 34 moves in the same direction as the moving table 30 due to the reaction force when the moving table 30 decelerates. The spring receiving piece 52 moves to contract the coil spring 54 and the kinetic energy of the linear motor rail 34 is damped by the damper 36 . As described above, in the processing device 2, the linear motor rail 34 moves in the same direction as the moving direction of the moving table 30, and the kinetic energy of the linear motor rail 34 is attenuated by the damper 36, thereby decelerating the moving table 30. Absorbs and mitigates the reaction force when doing. Therefore, according to the processing device 2, the reaction force when the holding means 4 or the processing device 6 accelerates and decelerates can be alleviated, and the processing device 2 shakes, which hinders high-precision processing. is resolved.

なお、ダンパー３６については、図示の実施形態では一対のコイルばね５４を備える例を説明したが、磁石を備える磁気ダンパーであってもよい。たとえば、図４に示すとおり、ガイド棒５０の中間部に摺動自在に挿入されると共にリニアモータレール３４に装着された可動磁石片５６と、基台３２に固定された一対の固定磁石片５８とを含む磁気ダンパー３６’であってもよい。この場合には、可動磁石片５６のＳ極と一方の固定磁石片５８のＳ極とが対面し、可動磁石片５６のＮ極と他方の固定磁石片５８のＮ極とが対面するように、可動磁石片５６および一対の固定磁石片５８が配置され得る。 In the illustrated embodiment, the damper 36 includes a pair of coil springs 54, but may be a magnetic damper including a magnet. For example, as shown in FIG. 4, a movable magnet piece 56 slidably inserted in the middle portion of the guide bar 50 and mounted on the linear motor rail 34 and a pair of fixed magnet pieces 58 fixed to the base 32. and a magnetic damper 36'. In this case, the S pole of the movable magnet piece 56 and the S pole of one fixed magnet piece 58 face each other, and the N pole of the movable magnet piece 56 and the N pole of the other fixed magnet piece 58 face each other. , a movable magnet piece 56 and a pair of fixed magnet pieces 58 may be arranged.

２：加工装置
４：保持手段
６：加工手段
８：加工送り手段
３０：移動テーブル
３２：基台
３２ａ：案内レール
３２ｂ：緩和レール
３４：リニアモータレール
３６：ダンパー
３８：永久磁石
４８：電磁石 2: processing device 4: holding means 6: processing means 8: processing feeding means 30: moving table 32: base 32a: guide rail 32b: relaxation rail 34: linear motor rail 36: damper 38: permanent magnet 48: electromagnet

Claims (5)

被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、
該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対のばね受け部を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、
該ダンパーは、両端部が該基台の該一対のばね受け部に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに固定されたばね受け片と、該ガイド棒に挿入された一対のコイルばねとを含み、該一対のコイルばねの一方は、該ばね受け片と該一対のばね受け部の一方との間に位置づけられ、該一対のコイルばねの他方は、該ばね受け片と該一対のばね受け部の他方との間に位置づけられている加工装置。 A processing apparatus comprising at least holding means for holding a workpiece, processing means for processing the workpiece held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. and
The processing feed means includes a moving table to which the holding means or the processing means is connected, and a guide rail that supports the moving table and extends in the processing feed direction. A base having a pair of spring receiving portions arranged thereon , a linear motor rail that drives the moving table and extends in the processing feed direction, and a linear motor rail that is disposed on the base and supports the linear motor rail in the processing feed direction. comprising at least a relaxation rail that extends to relieve reaction force when the moving table accelerates and decelerates, and a damper disposed between the linear motor rail and the base ,
The damper includes a guide bar supported at both ends by the pair of spring receiving portions of the base and extending along the direction of processing feed, and a guide bar slidably inserted into the guide bar and fixed to the linear motor rail. a spring receiving piece and a pair of coil springs inserted into the guide rod, one of the pair of coil springs positioned between the spring receiving piece and one of the pair of spring receiving portions; The processing device , wherein the other of the pair of coil springs is positioned between the spring receiving piece and the other of the pair of spring receiving portions . 被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段と、該保持手段または該加工手段を加工送りする加工送り手段と、から少なくとも構成された加工装置であって、
該加工送り手段は、該保持手段または該加工手段が連結される移動テーブルと、該移動テーブルを支持し加工送り方向に延在する案内レールが配設されるとともに加工送り方向に間隔をおいて配置された一対の固定磁石を有する基台と、該移動テーブルを駆動し加工送り方向に延在するリニアモータレールと、該基台に配設され該リニアモータレールを支持し加工送り方向に延在し該移動テーブルが加速および減速する際の反力を緩和する緩和レールと、該リニアモータレールと該基台との間に配設されたダンパーと、から少なくとも構成され、
該ダンパーは、両端部が該基台の該一対の固定磁石に支持され加工送り方向に沿って延びるガイド棒と、該ガイド棒に摺動自在に挿入されるとともに該リニアモータレールに装着された可動磁石とを含み、該可動磁石のＳ極と該一対の固定磁石の一方のＳ極とが対面し、該可動磁石のＮ極と該一対の固定磁石の他方のＮ極とが対面している加工装置。 A processing apparatus comprising at least holding means for holding a workpiece, processing means for processing the workpiece held by the holding means, and processing and feeding means for processing and feeding the holding means or the processing means. and
The processing feed means includes a moving table to which the holding means or the processing means is connected, and a guide rail that supports the moving table and extends in the processing feed direction. A base having a pair of fixed magnets arranged thereon , a linear motor rail that drives the moving table and extends in the processing feed direction, and a linear motor rail that is disposed on the base and supports the linear motor rail and extends in the processing feed direction. at least a damping rail that is present and relieves the reaction force when the moving table accelerates and decelerates, and a damper disposed between the linear motor rail and the base ,
The damper has a guide bar supported at both ends by the pair of fixed magnets of the base and extending along the direction of processing feed, and is slidably inserted into the guide bar and mounted on the linear motor rail. a movable magnet, the S pole of the movable magnet faces the S pole of one of the pair of fixed magnets, and the N pole of the movable magnet faces the other N pole of the pair of fixed magnets. processing equipment. 該リニアモータレールには永久磁石が配設され、該移動テーブルには該永久磁石に対向して位相が変化する電磁石が配設される請求項１または２記載の加工装置。 3. A processing apparatus according to claim 1, wherein a permanent magnet is arranged on said linear motor rail, and an electromagnet whose phase changes facing said permanent magnet is arranged on said moving table. 該移動テーブルには永久磁石が配設され、該リニアモータレールには該永久磁石に対向して位相が変化する電磁石が配設される請求項１または２記載の加工装置。 3. The processing apparatus according to claim 1, wherein a permanent magnet is arranged on said moving table, and an electromagnet whose phase changes facing said permanent magnet is arranged on said linear motor rail. 該加工手段は該保持手段に保持された被加工物にレーザー光線を照射して加工を施す請求項１または２記載の加工装置。 3. A processing apparatus according to claim 1, wherein said processing means applies a laser beam to the workpiece held by said holding means for machining.
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