JP2020174089A - 樹脂封止装置および樹脂封止方法 - Google Patents
樹脂封止装置および樹脂封止方法 Download PDFInfo
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- JP2020174089A JP2020174089A JP2019074277A JP2019074277A JP2020174089A JP 2020174089 A JP2020174089 A JP 2020174089A JP 2019074277 A JP2019074277 A JP 2019074277A JP 2019074277 A JP2019074277 A JP 2019074277A JP 2020174089 A JP2020174089 A JP 2020174089A
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- 239000011347 resin Substances 0.000 title claims abstract description 134
- 229920005989 resin Polymers 0.000 title claims abstract description 134
- 238000007789 sealing Methods 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 238000000465 moulding Methods 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000007547 defect Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
2 半導体チップ
3 接続電極
4 被成形品
5 上型
6 下型
7 キャビティ凹部
7B アンダーフィル空間
8A ゲート
8B カル
10 貫通孔
11,17,18,19 進退部材
12 基板載置部
13 封止樹脂
14 ポット
15 プランジャー
16 離型フィルム
20 駆動部
21 制御部
22 テーブル
30,31,32,40,41,42 進退部材
Claims (7)
- 基板の表面に半導体チップが接続電極を介してフリップチップ接続された被成形品を第1金型および第2金型によりクランプし、前記基板の表面と前記半導体チップの接続面との隙間部分を含むキャビティ凹部に封止樹脂を注入して樹脂封止成形を行う樹脂封止装置であって、
前記基板の表面に向かって前記キャビティ凹部内に進退する進退部材であり、前記半導体チップの側面全周の少なくとも一部を囲う進退部材と、
前記半導体チップの接続面の位置まで前記進退部材を前記キャビティ凹部内に進出させた状態で前記キャビティ凹部に前記封止樹脂を注入して前記基板の表面と前記半導体チップの接続面との隙間部分および前記基板の表面と前記進退部材との隙間部分に前記封止樹脂を充填したのち、前記進退部材を前記キャビティ凹部内から退避させて前記半導体チップの側面全周に前記封止樹脂を充填する制御部と
を含む樹脂封止装置。 - 前記進退部材の進退方向からみたときの前記進退部材の外周角部と前記キャビティ凹部の内周角部とが曲面である請求項1記載の樹脂封止装置。
- 前記進退部材は、前記基板の表面側からみて前記半導体チップの側面全周の全部を囲う略ロの字型形状である請求項1または2に記載の樹脂封止装置。
- 前記進退部材は、前記基板の表面側からみて前記半導体チップの側面全周のゲート側を除く部分を囲う略コの字型形状である請求項1または2に記載の樹脂封止装置。
- 前記進退部材は、前記基板の表面側からみて前記半導体チップの側面全周のエアベント側を除く部分を囲う略逆コの字型形状である請求項1または2に記載の樹脂封止装置。
- 前記進退部材は、前記基板の表面側からみて複数の部分に分割されたものであり、
前記制御部は、前記進退部材の複数の部分を個別に進退制御するものである
請求項1から5のいずれか1項に記載の樹脂封止装置。 - 基板の表面に半導体チップが接続電極を介してフリップチップ接続された被成形品を第1金型および第2金型によりクランプし、前記基板の表面と前記半導体チップの接続面との隙間部分を含むキャビティ凹部に封止樹脂を注入して樹脂封止成形を行う樹脂封止方法であって、
前記基板の表面に向かって前記キャビティ凹部内に進退する進退部材であり、前記半導体チップの側面全周の少なくとも一部を囲う進退部材を、前記半導体チップの接続面の位置まで前記キャビティ凹部内に進出させ、前記キャビティ凹部に前記封止樹脂を注入して前記基板の表面と前記半導体チップの接続面との隙間部分および前記基板の表面と前記進退部材との隙間部分に前記封止樹脂を充填すること、
前記進退部材を前記キャビティ凹部内から退避させて前記半導体チップの側面全周に前記封止樹脂を充填すること
を含む樹脂封止方法。
Priority Applications (3)
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JP2019074277A JP6678973B1 (ja) | 2019-04-09 | 2019-04-09 | 樹脂封止装置および樹脂封止方法 |
TW109101921A TWI720789B (zh) | 2019-04-09 | 2020-01-20 | 樹脂密封裝置及樹脂密封方法 |
CN202010151886.5A CN111799187B (zh) | 2019-04-09 | 2020-03-06 | 树脂密封装置和树脂密封方法 |
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JP2019074277A JP6678973B1 (ja) | 2019-04-09 | 2019-04-09 | 樹脂封止装置および樹脂封止方法 |
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JP6678973B1 JP6678973B1 (ja) | 2020-04-15 |
JP2020174089A true JP2020174089A (ja) | 2020-10-22 |
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CN (1) | CN111799187B (ja) |
TW (1) | TWI720789B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2022097392A1 (ja) * | 2020-11-04 | 2022-05-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
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JP6845903B1 (ja) | 2019-09-18 | 2021-03-24 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124242A (ja) * | 1998-01-23 | 2000-04-28 | Apic Yamada Corp | 半導体装置の樹脂封止方法、樹脂封止装置および半導体装置 |
JP2002009096A (ja) * | 2000-06-20 | 2002-01-11 | Apic Yamada Corp | 樹脂封止方法及び樹脂封止装置 |
WO2015159743A1 (ja) * | 2014-04-18 | 2015-10-22 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド方法 |
JP2015226014A (ja) * | 2014-05-29 | 2015-12-14 | Towa株式会社 | 電子部品の樹脂封止方法及び樹脂封止装置 |
JP2018014412A (ja) * | 2016-07-21 | 2018-01-25 | アピックヤマダ株式会社 | 樹脂モールド装置 |
Family Cites Families (5)
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JP3497744B2 (ja) * | 1998-10-12 | 2004-02-16 | 松下電器産業株式会社 | 樹脂封止型半導体装置及びその製造方法 |
JP2002118130A (ja) * | 2000-10-06 | 2002-04-19 | Apic Yamada Corp | マトリクスパッケージの樹脂封止方法 |
JP2008047573A (ja) * | 2006-08-11 | 2008-02-28 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置の製造装置、樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置 |
JP5202016B2 (ja) * | 2008-02-14 | 2013-06-05 | シャープ株式会社 | 樹脂封止方法および樹脂封止装置 |
JP2011029471A (ja) * | 2009-07-28 | 2011-02-10 | Renesas Electronics Corp | 半導体装置の製造方法および半導体製造装置 |
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- 2019-04-09 JP JP2019074277A patent/JP6678973B1/ja active Active
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- 2020-01-20 TW TW109101921A patent/TWI720789B/zh active
- 2020-03-06 CN CN202010151886.5A patent/CN111799187B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124242A (ja) * | 1998-01-23 | 2000-04-28 | Apic Yamada Corp | 半導体装置の樹脂封止方法、樹脂封止装置および半導体装置 |
JP2002009096A (ja) * | 2000-06-20 | 2002-01-11 | Apic Yamada Corp | 樹脂封止方法及び樹脂封止装置 |
WO2015159743A1 (ja) * | 2014-04-18 | 2015-10-22 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド方法 |
JP2015226014A (ja) * | 2014-05-29 | 2015-12-14 | Towa株式会社 | 電子部品の樹脂封止方法及び樹脂封止装置 |
JP2018014412A (ja) * | 2016-07-21 | 2018-01-25 | アピックヤマダ株式会社 | 樹脂モールド装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022097392A1 (ja) * | 2020-11-04 | 2022-05-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP2022074514A (ja) * | 2020-11-04 | 2022-05-18 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7360374B2 (ja) | 2020-11-04 | 2023-10-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
Also Published As
Publication number | Publication date |
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JP6678973B1 (ja) | 2020-04-15 |
TW202038349A (zh) | 2020-10-16 |
CN111799187A (zh) | 2020-10-20 |
CN111799187B (zh) | 2024-08-23 |
TWI720789B (zh) | 2021-03-01 |
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