JP2020172699A - 半田マスク - Google Patents
半田マスク Download PDFInfo
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- JP2020172699A JP2020172699A JP2020038046A JP2020038046A JP2020172699A JP 2020172699 A JP2020172699 A JP 2020172699A JP 2020038046 A JP2020038046 A JP 2020038046A JP 2020038046 A JP2020038046 A JP 2020038046A JP 2020172699 A JP2020172699 A JP 2020172699A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 78
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- 229910052742 iron Inorganic materials 0.000 description 1
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- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
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- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- ZTILUDNICMILKJ-UHFFFAOYSA-N niobium(v) ethoxide Chemical compound CCO[Nb](OCC)(OCC)(OCC)OCC ZTILUDNICMILKJ-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
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- 239000000047 product Substances 0.000 description 1
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- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 238000006557 surface reaction Methods 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1338—Chemical vapour deposition
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
・基板11を得ることと、
・任意に乾燥後に、水溶性リフトオフ材料21を当該基板の上に塗布してリフトオフパターンを作り出すことと、
・無機マスク層10を化学気相蒸着、好ましくは原子層堆積により水溶性リフトオフ21が予め供給された基板11に堆積させることと、
・リフトオフ21を除去してマスクされていない領域を露出させることと、
・任意に部品をマスクされていない領域に半田付けすることと、
・任意に保護無機層を化学気相蒸着、好ましくは原子層堆積により構造全体の上に塗布することと、
を含む。
Claims (15)
- パターニングされた半田マスク層(10)を化学気相蒸着プロセスにより開口部および/または非平坦な表面を含む基板(11)に形成するための方法であって、マスクパターニングは水溶性リフトオフ材料(21)を用いるリフトオフパターニングにより実施される、方法。
- 前記リフトオフ材料(21)は水溶性重合体である、請求項1に記載の方法。
- 前記リフトオフ材料はポリビニルアルコール(PVA)である、請求項1または2の何れか一項に記載の方法。
- 前記マスク(10)は無機材料からなる、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は金属酸化物からなる、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は本質的に光透過性である、何れかの先行する請求項に記載の方法。
- 前記水溶性リフトオフ材料(21)を予め供給された前記基板(11)は所定の水分レベルが達成されるまで脱気される、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は原子層堆積プロセスによって堆積される、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は光支援原子層堆積プロセスによって堆積される、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は150℃以下の温度で堆積される、何れかの先行する請求項に記載の方法。
- 前記マスク(10)は10〜500nmの範囲内の厚さを有する層である、何れかの先行する請求項に記載の方法。
- 前記基板(11)は印刷回路基板および/または電気部品である、何れかの先行する請求項に記載の方法。
- パターニングされた半田マスク層(10)を化学気相蒸着プロセスにより下層の基板(11)、任意に導電体(2)に堆積させることを含む、印刷回路基板および/または電気部品を製造するための方法であって、前記基板は開口部および/または非平坦な表面を含み、パターニングは水溶性リフトオフ材料(21)を用いるリフトオフパターニングにより実施される、方法。
- 化学気相蒸着プロセス、好ましくは原子層堆積プロセスにより保護層を製造された印刷回路基板および/または前記電気部品の表面に堆積させることをさらに含む、請求項13に記載の方法。
- パターニングされた半田マスク(10)を含む物品であって、前記物品は印刷回路基板および/または電気部品として構成され、かつ少なくとも部分的に導電体(2)が配設された少なくとも1つのベース層(1)と、化学気相蒸着プロセスにより前記基板(11)、任意に導電体(2)に堆積されたパターニングされた半田マスク(10)とを含む基板(11)を含み、パターニングは水溶性リフトオフ材料(21)を用いるリフトオフパターニングにより実施され、前記基板は開口部および/または非平坦な表面を含む、物品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20195173A FI130166B (en) | 2019-03-08 | 2019-03-08 | Solder mask |
FI20195173 | 2019-03-08 |
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DE2400665C3 (de) * | 1974-01-08 | 1979-04-05 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung eines lotabweisenden Schutzes auf Leiterplatten mit durchgehenden Lochern |
EP0195106B1 (de) | 1985-03-22 | 1989-06-21 | Ibm Deutschland Gmbh | Herstellung einer Abhebemaske und ihre Anwendung |
CN85103290A (zh) * | 1985-04-30 | 1986-10-29 | 美国电解材料有限公司 | 可剥离的焊料掩膜层 |
JPH02206195A (ja) | 1989-02-06 | 1990-08-15 | Alps Electric Co Ltd | プリント配線板およびその製造方法 |
CA2017720C (en) * | 1990-05-29 | 1999-01-19 | Luc Ouellet | Sog with moisture-resistant protective capping layer |
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EP1510861A1 (en) | 2003-08-26 | 2005-03-02 | Sony International (Europe) GmbH | Method for patterning organic materials or combinations of organic and inorganic materials |
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JP2008536699A (ja) | 2005-04-14 | 2008-09-11 | プレジデント・アンド・フエローズ・オブ・ハーバード・カレツジ | マイクロ加工のための犠牲層における調節可能な溶解度 |
EP2377376B1 (en) * | 2008-10-21 | 2019-08-07 | ATOTECH Deutschland GmbH | Method to form solder deposits on substrates |
JP5296590B2 (ja) * | 2009-03-30 | 2013-09-25 | 新光電気工業株式会社 | 半導体パッケージの製造方法 |
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KR20140030196A (ko) * | 2011-05-20 | 2014-03-11 | 스미토모 쇼지 가부시키가이샤 | 패턴 구조체의 제조방법 |
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