JP2020141137A5 - - Google Patents
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- JP2020141137A5 JP2020141137A5 JP2020032056A JP2020032056A JP2020141137A5 JP 2020141137 A5 JP2020141137 A5 JP 2020141137A5 JP 2020032056 A JP2020032056 A JP 2020032056A JP 2020032056 A JP2020032056 A JP 2020032056A JP 2020141137 A5 JP2020141137 A5 JP 2020141137A5
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- JP
- Japan
- Prior art keywords
- group
- alanine
- combinations
- acid
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962811874P | 2019-02-28 | 2019-02-28 | |
| US62/811,874 | 2019-02-28 | ||
| US16/752,116 US20200277514A1 (en) | 2019-02-28 | 2020-01-24 | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications |
| US16/752,116 | 2020-01-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020141137A JP2020141137A (ja) | 2020-09-03 |
| JP2020141137A5 true JP2020141137A5 (https=) | 2022-11-21 |
| JP7240346B2 JP7240346B2 (ja) | 2023-03-15 |
Family
ID=69742787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020032056A Active JP7240346B2 (ja) | 2019-02-28 | 2020-02-27 | 銅及びスルーシリコンビア用途のための化学機械研磨 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20200277514A1 (https=) |
| EP (1) | EP3702425A1 (https=) |
| JP (1) | JP7240346B2 (https=) |
| KR (1) | KR20200105431A (https=) |
| CN (1) | CN111732897A (https=) |
| IL (1) | IL272585B2 (https=) |
| SG (1) | SG10202001386VA (https=) |
| TW (1) | TW202039775A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102878529B1 (ko) * | 2020-01-28 | 2025-10-30 | 후지필름 가부시키가이샤 | 조성물, 기판의 처리 방법 |
| EP4259736A4 (en) * | 2020-12-14 | 2024-11-20 | Versum Materials US, LLC | Chemical mechanical planarization (cmp) for copper and through-silicon via (tsv) |
| KR20230160334A (ko) * | 2021-03-29 | 2023-11-23 | 엔테그리스, 아이엔씨. | 화학적 기계적 평탄화(cmp)를 위한 현탁액 및 이를 사용하는 방법 |
| CN115959779A (zh) * | 2021-10-12 | 2023-04-14 | 中国石油化工股份有限公司 | 循环水系统预膜用组合物及其应用以及循环水系统预膜处理方法 |
| CN113789127B (zh) * | 2021-10-20 | 2023-07-28 | 博力思(天津)电子科技有限公司 | 一种硅通孔铜膜抛光液 |
| TW202546158A (zh) | 2024-02-16 | 2025-12-01 | 美商慧盛材料美國責任有限公司 | 用於金屬化學機械平坦化(cmp)研磨組合物的腐蝕抑制劑 |
| CN118406439B (zh) * | 2024-07-01 | 2024-10-18 | 万华化学集团电子材料有限公司 | 化学机械抛光组合物及其在钨化学机械抛光中的应用 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG144688A1 (en) | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| US7300601B2 (en) | 2002-12-10 | 2007-11-27 | Advanced Technology Materials, Inc. | Passivative chemical mechanical polishing composition for copper film planarization |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| KR20070104479A (ko) * | 2003-06-06 | 2007-10-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 전도성 물질을 폴리싱하기 위한 폴리싱 조성물 및 방법 |
| KR20080033514A (ko) | 2005-08-05 | 2008-04-16 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 금속막 평탄화를 위한 고 처리량의 화학적 기계적 연마조성물 |
| TWI385226B (zh) | 2005-09-08 | 2013-02-11 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 用於移除聚合物阻障之研磨漿液 |
| TWI343945B (en) | 2005-12-27 | 2011-06-21 | Hitachi Chemical Co Ltd | Slurry for metal polishing and polishing method of polished film |
| JP2010512657A (ja) | 2006-12-22 | 2010-04-22 | テクノ セミケム シーオー．， エルティーディー． | ゼオライトを含有する銅化学機械的研磨組成物 |
| WO2009020625A1 (en) | 2007-08-09 | 2009-02-12 | Planar Solutions, Llc | Copper polishing slurry |
| JPWO2009031389A1 (ja) | 2007-09-03 | 2010-12-09 | Jsr株式会社 | 化学機械研磨用水系分散体およびその調製方法、化学機械研磨用水系分散体を調製するためのキット、ならびに半導体装置の化学機械研磨方法 |
| US7955520B2 (en) | 2007-11-27 | 2011-06-07 | Cabot Microelectronics Corporation | Copper-passivating CMP compositions and methods |
| US8435421B2 (en) | 2007-11-27 | 2013-05-07 | Cabot Microelectronics Corporation | Metal-passivating CMP compositions and methods |
| KR101104369B1 (ko) | 2009-04-22 | 2012-01-16 | 주식회사 엘지화학 | 화학적 기계적 연마용 슬러리 |
| WO2010127937A1 (en) | 2009-05-06 | 2010-11-11 | Basf Se | An aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a cmp process |
| JP5646862B2 (ja) | 2009-09-18 | 2014-12-24 | 長興開発科技股▲ふん▼有限公司 | シリコン貫通ビア構造を有する半導体ウェハーの研磨方法、及びそれに使用する研磨組成物 |
| WO2011152966A2 (en) | 2010-06-01 | 2011-12-08 | Applied Materials, Inc. | Chemical planarization of copper wafer polishing |
| US8980122B2 (en) | 2011-07-08 | 2015-03-17 | General Engineering & Research, L.L.C. | Contact release capsule useful for chemical mechanical planarization slurry |
| US9057004B2 (en) | 2011-09-23 | 2015-06-16 | International Business Machines Corporation | Slurry for chemical-mechanical polishing of metals and use thereof |
| US8734665B2 (en) | 2011-10-12 | 2014-05-27 | International Business Machines Corporation | Slurry for chemical-mechanical polishing of copper and use thereof |
| US8974692B2 (en) * | 2013-06-27 | 2015-03-10 | Air Products And Chemicals, Inc. | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| KR101854499B1 (ko) | 2015-04-24 | 2018-05-04 | 삼성에스디아이 주식회사 | 구리 배선 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마방법 |
| US9978609B2 (en) | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| WO2016195997A1 (en) | 2015-05-29 | 2016-12-08 | Weatherby Michael T | Automated helmet gas bladder maintenance system and method |
| US10253216B2 (en) * | 2016-07-01 | 2019-04-09 | Versum Materials Us, Llc | Additives for barrier chemical mechanical planarization |
| EP3540761B1 (en) * | 2016-11-09 | 2022-01-05 | Fujimi Incorporated | Polishing composition and method for polishing silicon wafer |
| US11401441B2 (en) * | 2017-08-17 | 2022-08-02 | Versum Materials Us, Llc | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications |
-
2020
- 2020-01-24 US US16/752,116 patent/US20200277514A1/en not_active Abandoned
- 2020-02-10 IL IL272585A patent/IL272585B2/en unknown
- 2020-02-14 SG SG10202001386VA patent/SG10202001386VA/en unknown
- 2020-02-25 TW TW109105985A patent/TW202039775A/zh unknown
- 2020-02-27 KR KR1020200024405A patent/KR20200105431A/ko not_active Ceased
- 2020-02-27 CN CN202010125856.7A patent/CN111732897A/zh active Pending
- 2020-02-27 EP EP20159825.7A patent/EP3702425A1/en not_active Withdrawn
- 2020-02-27 JP JP2020032056A patent/JP7240346B2/ja active Active
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