JP2020141010A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2020141010A
JP2020141010A JP2019034234A JP2019034234A JP2020141010A JP 2020141010 A JP2020141010 A JP 2020141010A JP 2019034234 A JP2019034234 A JP 2019034234A JP 2019034234 A JP2019034234 A JP 2019034234A JP 2020141010 A JP2020141010 A JP 2020141010A
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Japan
Prior art keywords
straight line
lead frame
substrate
line portion
tip
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Pending
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JP2019034234A
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English (en)
Japanese (ja)
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JP2020141010A5 (enExample
Inventor
洋史 湯口
Hiroshi Yuguchi
洋史 湯口
篤人 木村
Atsuto Kimura
篤人 木村
音部　優里
Yuri Otobe
優里 音部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
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Toyota Industries Corp
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Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Priority to JP2019034234A priority Critical patent/JP2020141010A/ja
Publication of JP2020141010A publication Critical patent/JP2020141010A/ja
Publication of JP2020141010A5 publication Critical patent/JP2020141010A5/ja
Pending legal-status Critical Current

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JP2019034234A 2019-02-27 2019-02-27 半導体装置 Pending JP2020141010A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019034234A JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019034234A JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

Publications (2)

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JP2020141010A true JP2020141010A (ja) 2020-09-03
JP2020141010A5 JP2020141010A5 (enExample) 2021-08-05

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ID=72265118

Family Applications (1)

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JP2019034234A Pending JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

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JP (1) JP2020141010A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024062498A (ja) * 2022-10-25 2024-05-10 三菱電機株式会社 電力用半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073782A (ja) * 2005-09-08 2007-03-22 Nippon Inter Electronics Corp 大電力用半導体装置
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2011149017A1 (ja) * 2010-05-27 2011-12-01 京セラ株式会社 半導体モジュール基板および半導体モジュール
US20120098138A1 (en) * 2010-10-20 2012-04-26 Mitsubishi Electric Corporation Power semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073782A (ja) * 2005-09-08 2007-03-22 Nippon Inter Electronics Corp 大電力用半導体装置
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2011149017A1 (ja) * 2010-05-27 2011-12-01 京セラ株式会社 半導体モジュール基板および半導体モジュール
US20120098138A1 (en) * 2010-10-20 2012-04-26 Mitsubishi Electric Corporation Power semiconductor device
JP2012089681A (ja) * 2010-10-20 2012-05-10 Mitsubishi Electric Corp パワー半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024062498A (ja) * 2022-10-25 2024-05-10 三菱電機株式会社 電力用半導体装置

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