JP2020141010A5 - - Google Patents

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Publication number
JP2020141010A5
JP2020141010A5 JP2019034234A JP2019034234A JP2020141010A5 JP 2020141010 A5 JP2020141010 A5 JP 2020141010A5 JP 2019034234 A JP2019034234 A JP 2019034234A JP 2019034234 A JP2019034234 A JP 2019034234A JP 2020141010 A5 JP2020141010 A5 JP 2020141010A5
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JP
Japan
Prior art keywords
width
wide portion
joint
intermediate wide
wide
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Pending
Application number
JP2019034234A
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English (en)
Japanese (ja)
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JP2020141010A (ja
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Priority to JP2019034234A priority Critical patent/JP2020141010A/ja
Priority claimed from JP2019034234A external-priority patent/JP2020141010A/ja
Publication of JP2020141010A publication Critical patent/JP2020141010A/ja
Publication of JP2020141010A5 publication Critical patent/JP2020141010A5/ja
Pending legal-status Critical Current

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JP2019034234A 2019-02-27 2019-02-27 半導体装置 Pending JP2020141010A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019034234A JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019034234A JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

Publications (2)

Publication Number Publication Date
JP2020141010A JP2020141010A (ja) 2020-09-03
JP2020141010A5 true JP2020141010A5 (enExample) 2021-08-05

Family

ID=72265118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019034234A Pending JP2020141010A (ja) 2019-02-27 2019-02-27 半導体装置

Country Status (1)

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JP (1) JP2020141010A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7822300B2 (ja) * 2022-10-25 2026-03-02 三菱電機株式会社 電力用半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526125B2 (ja) * 2005-09-08 2010-08-18 日本インター株式会社 大電力用半導体装置
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2011149017A1 (ja) * 2010-05-27 2011-12-01 京セラ株式会社 半導体モジュール基板および半導体モジュール
JP5383621B2 (ja) * 2010-10-20 2014-01-08 三菱電機株式会社 パワー半導体装置

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