JP2020127038A - ナノ構造蛍光体を有する発光装置 - Google Patents
ナノ構造蛍光体を有する発光装置 Download PDFInfo
- Publication number
- JP2020127038A JP2020127038A JP2020076577A JP2020076577A JP2020127038A JP 2020127038 A JP2020127038 A JP 2020127038A JP 2020076577 A JP2020076577 A JP 2020076577A JP 2020076577 A JP2020076577 A JP 2020076577A JP 2020127038 A JP2020127038 A JP 2020127038A
- Authority
- JP
- Japan
- Prior art keywords
- wavelength conversion
- nanostructured
- phosphor
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 25
- 239000000463 material Substances 0.000 claims abstract description 111
- 239000002245 particle Substances 0.000 claims abstract description 46
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims description 111
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000002086 nanomaterial Substances 0.000 claims description 31
- 239000003989 dielectric material Substances 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 230000035515 penetration Effects 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000002223 garnet Substances 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 104
- 229920000642 polymer Polymers 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- -1 rare earth metal ions Chemical class 0.000 description 7
- 239000002114 nanocomposite Substances 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 239000002096 quantum dot Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 239000011257 shell material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 102100032047 Alsin Human genes 0.000 description 1
- 101710187109 Alsin Proteins 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920006055 Durethan® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910004262 HgTe Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000011852 carbon nanoparticle Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000007954 hypoxia Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012802 nanoclay Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001291 polyvinyl halide Polymers 0.000 description 1
- 229920006214 polyvinylidene halide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000005428 wave function Effects 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
出典:IEEE Journal of Selected Topics
in Quantum Electronics, Vol. 10, No. 1, Jan 2004, p. 45.
Claims (27)
- 半導体発光デバイスと、
波長変換領域であり、
ポンプ光を吸収して変換光を放つように構成されたナノ構造波長変換材料であり、長さ100nm以下の少なくとも1つの次元を持つ粒子を有するナノ構造波長変換材料、及び
前記ナノ構造波長変換材料が中に配置された透明マトリックス、
を有する波長変換領域と、
を有し、
前記波長変換領域と前記半導体発光デバイスとの間の間隔が、0nmよりも大きく且つ10mm以下である、
構造体。 - 前記波長変換領域は更に蛍光体を有する、請求項1に記載の構造体。
- 前記蛍光体は、前記ナノ構造波長変換材料と前記半導体発光デバイスとの間に配置されている、請求項2に記載の構造体。
- 前記蛍光体は、前記ナノ構造波長変換材料と直接接触しておらず、前記半導体発光デバイスと直接接触していない、請求項3に記載の構造体。
- 前記蛍光体は、前記ナノ構造波長変換材料と直接接触している、請求項2に記載の構造体。
- 前記蛍光体は、前記透明マトリックス内で前記波長変換材料と混ぜ合わされている、請求項5に記載の構造体。
- 前記蛍光体はガーネット系である、請求項2に記載の構造体。
- 前記ナノ構造波長変換材料は、第1の層内で前記透明マトリックス内に配置され、前記蛍光体は第2の層内に配置され、前記第1の層は前記第2の層と直接接触している、請求項2に記載の構造体。
- 前記透明マトリックスは、有機ポリマー及びシリコーンのうちの1つである、請求項1に記載の構造体。
- 前記半導体発光デバイスは、反射容器の中に配置されている、請求項1に記載の構造体。
- 前記ナノ構造波長変換材料は、赤色光を放つように構成されている、請求項1に記載の構造体。
- 前記波長変換領域と前記半導体発光デバイスとの間に配置された誘電材料、を更に有する請求項1に記載の構造体。
- 前記波長変換領域と直接接触した少なくとも1つのワイヤ、を更に有する請求項1に記載の構造体。
- 前記少なくとも1つのワイヤは、ヒートシンクに熱的に接続される、請求項1に記載の構造体。
- 酸素の浸透及び水分の浸透のうち一方を抑制するよう前記波長変換領域上に配置されたコーディング、を更に有する請求項1に記載の構造体。
- 前記コーディングは、アルミナ、シリカ、窒化ケイ素、酸窒化ケイ素からなる群から選択されている、請求項15に記載の構造体。
- 前記コーディングは、パリレンベースの化合物である、請求項15に記載の構造体。
- 前記ナノ構造波長変換材料は、長さ100nm以下の少なくとも1つの次元を持つ粒子を有する、請求項1に記載の構造体。
- 前記ナノ構造波長変換材料は更に、前記ポンプ光の反射がより多く且つ前記変換光の反射がより少ないように構成されたリフレクタを有する、請求項1に記載の構造体。
- 半導体発光デバイスと、
透明マトリックス内に配置されたナノ構造波長変換粒子及び蛍光体材料を有する波長変換領域であり、前記ナノ構造波長変換粒子は、長さ100nm以下の少なくとも1つの次元を持つとともに、ポンプ光を吸収して変換光を放つように構成される、波長変換領域と、
前記ポンプ光の反射がより多く且つ前記変換光の反射がより少ないように構成された、前記波長変換領域上に配置されたリフレクタと、
前記波長変換領域と前記半導体発光デバイスとの間の、0mmよりも大きく且つ10mm以下である間隙と、
を有する構造体。 - 前記間隙は誘電材料を有する、請求項20に記載の構造体。
- 前記波長変換領域と直接接触し且つヒートシンクに熱的に接続された少なくとも1つのワイヤ、を更に有する請求項20に記載の構造体。
- 酸素の浸透及び水分の浸透のうち一方を抑制するよう前記波長変換領域上に配置されたコーディング、を更に有する請求項20に記載の構造体。
- 前記コーディングは、アルミナ、シリカ、窒化ケイ素、酸窒化ケイ素からなる群から選択されている、請求項23に記載の構造体。
- 前記コーディングは、パリレンベースの化合物である、請求項23に記載の構造体。
- 前記蛍光体材料は、前記透明マトリックス内で前記波長変換材料と混ぜ合わされている、請求項20に記載の構造体。
- 前記蛍光体材料はガーネット系蛍光体を有する、請求項20に記載の構造体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261646495P | 2012-05-14 | 2012-05-14 | |
US61/646,495 | 2012-05-14 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018135443A Division JP6697033B2 (ja) | 2012-05-14 | 2018-07-19 | ナノ構造蛍光体を有する発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020127038A true JP2020127038A (ja) | 2020-08-20 |
Family
ID=48628751
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015512153A Pending JP2015516691A (ja) | 2012-05-14 | 2013-05-02 | ナノ構造蛍光体を有する発光装置 |
JP2018135443A Active JP6697033B2 (ja) | 2012-05-14 | 2018-07-19 | ナノ構造蛍光体を有する発光装置 |
JP2020076577A Pending JP2020127038A (ja) | 2012-05-14 | 2020-04-23 | ナノ構造蛍光体を有する発光装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015512153A Pending JP2015516691A (ja) | 2012-05-14 | 2013-05-02 | ナノ構造蛍光体を有する発光装置 |
JP2018135443A Active JP6697033B2 (ja) | 2012-05-14 | 2018-07-19 | ナノ構造蛍光体を有する発光装置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US9634201B2 (ja) |
EP (1) | EP2850666B1 (ja) |
JP (3) | JP2015516691A (ja) |
KR (2) | KR102072769B1 (ja) |
CN (2) | CN104272479A (ja) |
TW (2) | TWI621286B (ja) |
WO (1) | WO2013171610A1 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9276382B2 (en) * | 2014-03-20 | 2016-03-01 | Sandia Corporation | Quantum-size-controlled photoelectrochemical etching of semiconductor nanostructures |
CN104272479A (zh) | 2012-05-14 | 2015-01-07 | 皇家飞利浦有限公司 | 具有远程纳米结构磷光体的发光设备 |
JP2015106641A (ja) * | 2013-11-29 | 2015-06-08 | 日亜化学工業株式会社 | 発光装置 |
KR102191211B1 (ko) * | 2014-02-28 | 2020-12-15 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
EP3117267B1 (en) * | 2014-03-11 | 2018-05-02 | Osram Sylvania Inc. | Light converter assemblies with enhanced heat dissipation |
KR20150116986A (ko) * | 2014-04-08 | 2015-10-19 | 삼성디스플레이 주식회사 | 퀀텀 도트 시트 및 이를 포함하는 라이트 유닛과 액정 표시 장치 |
CN111525018B (zh) * | 2014-08-06 | 2023-10-24 | Ns材料株式会社 | 树脂成型品、波长变换部件、以及照明部件 |
JP2016076634A (ja) | 2014-10-08 | 2016-05-12 | エルジー ディスプレイ カンパニー リミテッド | Ledパッケージ、バックライトユニット及び液晶表示装置 |
DE102014116778A1 (de) * | 2014-11-17 | 2016-05-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Konversionselements, Konversionselement sowie optoelektronisches Bauelement mit einem solchen Konversionselement |
DE102015001723A1 (de) | 2015-02-05 | 2016-08-11 | Sergey Dyukin | Die Methode der Verbesserung der Charakteristiken von Leuchtgeräten mit einer Stirnseitenbeleuchtung des Lichtleiters, die den Luminophor beinhalten, der mit Halbleiterstrukturen beleuchtet wird. |
US9728687B2 (en) * | 2015-05-13 | 2017-08-08 | Seoul Semiconductor Co., Ltd. | Quantum platelet converter |
DE102015119817A1 (de) * | 2015-11-17 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement |
CN105485548A (zh) * | 2016-01-13 | 2016-04-13 | 深圳大学 | 一种基于碳纳米粒子的激光白光光源 |
US10230027B2 (en) | 2016-08-05 | 2019-03-12 | Maven Optronics Co., Ltd. | Moisture-resistant chip scale packaging light-emitting device |
TWI599078B (zh) * | 2016-08-05 | 2017-09-11 | 行家光電股份有限公司 | 具濕氣阻隔結構之晶片級封裝發光裝置 |
CN107706281B (zh) * | 2016-08-09 | 2019-07-19 | 行家光电股份有限公司 | 具湿气阻隔结构的晶片级封装发光装置 |
WO2018037775A1 (ja) * | 2016-08-24 | 2018-03-01 | シャープ株式会社 | 光源装置およびそれを備えたバックライト装置、表示装置 |
KR102680862B1 (ko) * | 2016-12-16 | 2024-07-03 | 삼성전자주식회사 | 반도체 발광장치 |
KR20180090002A (ko) * | 2017-02-02 | 2018-08-10 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
CN106876561A (zh) * | 2017-03-14 | 2017-06-20 | 河北利福光电技术有限公司 | 一种远程荧光粉封装结构及其实现方法 |
JP7005916B2 (ja) * | 2017-03-17 | 2022-01-24 | 大日本印刷株式会社 | 光波長変換組成物、光波長変換部材、発光装置、バックライト装置、および画像表示装置 |
CN109494289B (zh) * | 2017-09-11 | 2020-08-11 | 行家光电股份有限公司 | 应用量子点色彩转换的发光装置及其制造方法 |
US10879434B2 (en) | 2017-09-08 | 2020-12-29 | Maven Optronics Co., Ltd. | Quantum dot-based color-converted light emitting device and method for manufacturing the same |
TWI658610B (zh) * | 2017-09-08 | 2019-05-01 | Maven Optronics Co., Ltd. | 應用量子點色彩轉換之發光裝置及其製造方法 |
US10991856B2 (en) * | 2017-12-21 | 2021-04-27 | Lumileds Llc | LED with structured layers and nanophosphors |
US10879431B2 (en) * | 2017-12-22 | 2020-12-29 | Lumileds Llc | Wavelength converting layer patterning for LED arrays |
JP2019186305A (ja) * | 2018-04-04 | 2019-10-24 | シャープ株式会社 | 発光装置および製造方法 |
WO2019216333A1 (ja) * | 2018-05-08 | 2019-11-14 | Jnc株式会社 | 発光デバイス及び発光デバイスの製造方法 |
KR102555238B1 (ko) * | 2018-09-13 | 2023-07-14 | 주식회사 루멘스 | 퀀텀닷 엘이디 패키지 및 이를 포함하는 퀀텀닷 엘이디 모듈 |
WO2021075394A1 (ja) * | 2019-10-15 | 2021-04-22 | Nsマテリアルズ株式会社 | 発光装置 |
EP4180498B1 (en) | 2022-06-15 | 2024-06-05 | Avantama AG | A color conversion film comprising inorganic separation layer |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005125764A (ja) * | 2003-09-30 | 2005-05-19 | Agfa Gevaert Nv | 耐スクラッチ性湿分保護パリレン層 |
JP2005311170A (ja) * | 2004-04-23 | 2005-11-04 | Stanley Electric Co Ltd | 半導体発光装置 |
JP2006083219A (ja) * | 2004-09-14 | 2006-03-30 | Sharp Corp | 蛍光体およびこれを用いた発光装置 |
JP2006108661A (ja) * | 2004-09-30 | 2006-04-20 | Agilent Technol Inc | 波長変換材料を利用した光源 |
JP2006517346A (ja) * | 2003-01-27 | 2006-07-20 | スリーエム イノベイティブ プロパティズ カンパニー | 非平面ロングパスリフレクターを備えた蛍燐光体系光源 |
US20070012928A1 (en) * | 2005-07-13 | 2007-01-18 | Zouyan Peng | Light emitting diode comprising semiconductor nanocrystal complexes and powdered phosphors |
JP2007035885A (ja) * | 2005-07-26 | 2007-02-08 | Kyocera Corp | 発光装置およびそれを用いた照明装置 |
US20070182299A1 (en) * | 2003-01-27 | 2007-08-09 | 3M Innovative Properties Company | Phosphor based light source component |
JP2008283180A (ja) * | 2007-05-09 | 2008-11-20 | Samsung Electronics Co Ltd | ナノ結晶−金属酸化物複合体を用いる発光ダイオード素子およびその製造方法 |
US20090322205A1 (en) * | 2008-06-30 | 2009-12-31 | Chris Lowery | Methods and apparatuses for enhancing heat dissipation from a light emitting device |
JP2010528118A (ja) * | 2007-03-19 | 2010-08-19 | ナノシス・インコーポレイテッド | ナノ結晶を被包するための方法 |
JP2010219212A (ja) * | 2009-03-16 | 2010-09-30 | Konica Minolta Holdings Inc | 有機エレクトロニクス素子、有機光電変換素子、及び有機エレクトロルミネッセンス素子 |
WO2011004795A1 (ja) * | 2009-07-07 | 2011-01-13 | シーシーエス株式会社 | 発光装置 |
JP2011107508A (ja) * | 2009-11-19 | 2011-06-02 | Showa Denko Kk | 蛍光体フィルタ、蛍光体フィルタの製造方法およびランプ |
JP2011198800A (ja) * | 2010-03-17 | 2011-10-06 | Mitsubishi Chemicals Corp | 半導体発光素子 |
US20110309390A1 (en) * | 2009-03-11 | 2011-12-22 | SemiLEDs Optoelectronics Co., Ltd. | Lighting Device Comprising Leds With Phosphor Layers |
JP2012036265A (ja) * | 2010-08-05 | 2012-02-23 | Sharp Corp | 照明装置 |
US20120104437A1 (en) * | 2010-11-01 | 2012-05-03 | Tyco Electronics Corporation | Optic assembly utilizing quantum dots |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040159900A1 (en) * | 2003-01-27 | 2004-08-19 | 3M Innovative Properties Company | Phosphor based light sources having front illumination |
US7091661B2 (en) * | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a reflective polarizer |
JP4231418B2 (ja) * | 2004-01-07 | 2009-02-25 | 株式会社小糸製作所 | 発光モジュール及び車両用灯具 |
US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
JP2006186022A (ja) * | 2004-12-27 | 2006-07-13 | Toyoda Gosei Co Ltd | 発光装置 |
KR100682874B1 (ko) | 2005-05-02 | 2007-02-15 | 삼성전기주식회사 | 백색 led |
KR20080049011A (ko) * | 2005-08-05 | 2008-06-03 | 마쯔시다덴기산교 가부시키가이샤 | 반도체 발광장치 |
CN101208811A (zh) * | 2005-08-05 | 2008-06-25 | 松下电器产业株式会社 | 半导体发光装置 |
US7518160B2 (en) * | 2005-10-31 | 2009-04-14 | Kyocera Corporation | Wavelength converter, lighting system, and lighting system assembly |
JP4771837B2 (ja) * | 2005-11-28 | 2011-09-14 | 京セラ株式会社 | 波長変換器および発光装置 |
JP2007273562A (ja) | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体発光装置 |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
US8704254B2 (en) * | 2006-12-22 | 2014-04-22 | Philips Lumileds Lighting Company, Llc | Light emitting device including a filter |
KR100826396B1 (ko) * | 2007-01-18 | 2008-05-02 | 삼성전기주식회사 | Led 칩 패키지 |
US20100110728A1 (en) | 2007-03-19 | 2010-05-06 | Nanosys, Inc. | Light-emitting diode (led) devices comprising nanocrystals |
KR101442146B1 (ko) * | 2008-02-25 | 2014-09-23 | 삼성디스플레이 주식회사 | 광원 유닛, 이를 포함하는 액정 표시 장치 및 이의 제조방법 |
EP2277207A1 (en) | 2008-05-07 | 2011-01-26 | Koninklijke Philips Electronics N.V. | Illumination device with led with a self-supporting grid containing luminescent material and method of making the self-supporting grid |
US7845825B2 (en) | 2009-12-02 | 2010-12-07 | Abl Ip Holding Llc | Light fixture using near UV solid state device and remote semiconductor nanophosphors to produce white light |
US8140704B2 (en) | 2008-07-02 | 2012-03-20 | International Busniess Machines Corporation | Pacing network traffic among a plurality of compute nodes connected using a data communications network |
KR100982991B1 (ko) * | 2008-09-03 | 2010-09-17 | 삼성엘이디 주식회사 | 양자점 파장변환체, 양자점 파장변환체의 제조방법 및 양자점 파장변환체를 포함하는 발광장치 |
KR101577300B1 (ko) * | 2008-10-28 | 2015-12-15 | 삼성디스플레이 주식회사 | 양자점을 이용한 백색광 발광다이오드 구조 및 이를 포함하는 백라이트 어셈블리 |
CN102356480B (zh) * | 2009-03-19 | 2015-06-17 | 皇家飞利浦电子股份有限公司 | 颜色调节装置 |
TW201114070A (en) | 2009-10-15 | 2011-04-16 | Aurotek Corp | Light-emitting device |
US20110127555A1 (en) | 2009-12-02 | 2011-06-02 | Renaissance Lighting, Inc. | Solid state light emitter with phosphors dispersed in a liquid or gas for producing high cri white light |
WO2011079900A1 (de) | 2009-12-30 | 2011-07-07 | Merck Patent Gmbh | Vergussmasse als diffusionsbarriere für wassermoleküle |
EP2528990B1 (en) * | 2010-01-28 | 2017-04-26 | Yissum Research Development Company of the Hebrew University of Jerusalem Ltd. | Lighting devices with prescribed colour emission |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
TW201142214A (en) | 2010-03-03 | 2011-12-01 | Cree Inc | Enhanced color rendering index emitter through phosphor separation |
JP2011238811A (ja) * | 2010-05-12 | 2011-11-24 | Konica Minolta Opto Inc | 波長変換素子および発光装置 |
US20110303940A1 (en) | 2010-06-14 | 2011-12-15 | Hyo Jin Lee | Light emitting device package using quantum dot, illumination apparatus and display apparatus |
KR20110136676A (ko) * | 2010-06-14 | 2011-12-21 | 삼성엘이디 주식회사 | 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치 |
US20110317397A1 (en) * | 2010-06-23 | 2011-12-29 | Soraa, Inc. | Quantum dot wavelength conversion for hermetically sealed optical devices |
US9412905B2 (en) * | 2011-04-01 | 2016-08-09 | Najing Technology Corporation Limited | White light emitting device |
TWM427646U (en) | 2011-08-30 | 2012-04-21 | Guan-Hua Wang | Improved structure for media playing |
CN104272479A (zh) | 2012-05-14 | 2015-01-07 | 皇家飞利浦有限公司 | 具有远程纳米结构磷光体的发光设备 |
-
2013
- 2013-05-02 CN CN201380025286.2A patent/CN104272479A/zh active Pending
- 2013-05-02 KR KR1020147035049A patent/KR102072769B1/ko active IP Right Grant
- 2013-05-02 EP EP13729453.4A patent/EP2850666B1/en active Active
- 2013-05-02 JP JP2015512153A patent/JP2015516691A/ja active Pending
- 2013-05-02 KR KR1020207002650A patent/KR20200013093A/ko not_active Application Discontinuation
- 2013-05-02 WO PCT/IB2013/053491 patent/WO2013171610A1/en active Application Filing
- 2013-05-02 CN CN202010391208.6A patent/CN111540822B/zh active Active
- 2013-05-02 US US14/398,764 patent/US9634201B2/en active Active
- 2013-05-14 TW TW106122133A patent/TWI621286B/zh active
- 2013-05-14 TW TW102117087A patent/TWI596804B/zh active
-
2017
- 2017-02-23 US US15/441,176 patent/US10347800B2/en active Active
-
2018
- 2018-07-19 JP JP2018135443A patent/JP6697033B2/ja active Active
-
2019
- 2019-07-05 US US16/504,153 patent/US11031530B2/en active Active
-
2020
- 2020-04-23 JP JP2020076577A patent/JP2020127038A/ja active Pending
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006517346A (ja) * | 2003-01-27 | 2006-07-20 | スリーエム イノベイティブ プロパティズ カンパニー | 非平面ロングパスリフレクターを備えた蛍燐光体系光源 |
US20070182299A1 (en) * | 2003-01-27 | 2007-08-09 | 3M Innovative Properties Company | Phosphor based light source component |
JP2005125764A (ja) * | 2003-09-30 | 2005-05-19 | Agfa Gevaert Nv | 耐スクラッチ性湿分保護パリレン層 |
JP2005311170A (ja) * | 2004-04-23 | 2005-11-04 | Stanley Electric Co Ltd | 半導体発光装置 |
JP2006083219A (ja) * | 2004-09-14 | 2006-03-30 | Sharp Corp | 蛍光体およびこれを用いた発光装置 |
JP2006108661A (ja) * | 2004-09-30 | 2006-04-20 | Agilent Technol Inc | 波長変換材料を利用した光源 |
US20070012928A1 (en) * | 2005-07-13 | 2007-01-18 | Zouyan Peng | Light emitting diode comprising semiconductor nanocrystal complexes and powdered phosphors |
JP2007035885A (ja) * | 2005-07-26 | 2007-02-08 | Kyocera Corp | 発光装置およびそれを用いた照明装置 |
JP2010528118A (ja) * | 2007-03-19 | 2010-08-19 | ナノシス・インコーポレイテッド | ナノ結晶を被包するための方法 |
JP2008283180A (ja) * | 2007-05-09 | 2008-11-20 | Samsung Electronics Co Ltd | ナノ結晶−金属酸化物複合体を用いる発光ダイオード素子およびその製造方法 |
US20090322205A1 (en) * | 2008-06-30 | 2009-12-31 | Chris Lowery | Methods and apparatuses for enhancing heat dissipation from a light emitting device |
US20110309390A1 (en) * | 2009-03-11 | 2011-12-22 | SemiLEDs Optoelectronics Co., Ltd. | Lighting Device Comprising Leds With Phosphor Layers |
JP2010219212A (ja) * | 2009-03-16 | 2010-09-30 | Konica Minolta Holdings Inc | 有機エレクトロニクス素子、有機光電変換素子、及び有機エレクトロルミネッセンス素子 |
WO2011004795A1 (ja) * | 2009-07-07 | 2011-01-13 | シーシーエス株式会社 | 発光装置 |
JP2011107508A (ja) * | 2009-11-19 | 2011-06-02 | Showa Denko Kk | 蛍光体フィルタ、蛍光体フィルタの製造方法およびランプ |
JP2011198800A (ja) * | 2010-03-17 | 2011-10-06 | Mitsubishi Chemicals Corp | 半導体発光素子 |
JP2012036265A (ja) * | 2010-08-05 | 2012-02-23 | Sharp Corp | 照明装置 |
US20120104437A1 (en) * | 2010-11-01 | 2012-05-03 | Tyco Electronics Corporation | Optic assembly utilizing quantum dots |
Also Published As
Publication number | Publication date |
---|---|
CN111540822A (zh) | 2020-08-14 |
US20150129916A1 (en) | 2015-05-14 |
JP2018186293A (ja) | 2018-11-22 |
TWI596804B (zh) | 2017-08-21 |
WO2013171610A1 (en) | 2013-11-21 |
US20170162761A1 (en) | 2017-06-08 |
EP2850666B1 (en) | 2021-11-03 |
KR20150016962A (ko) | 2015-02-13 |
TW201735404A (zh) | 2017-10-01 |
TWI621286B (zh) | 2018-04-11 |
JP6697033B2 (ja) | 2020-05-20 |
KR20200013093A (ko) | 2020-02-05 |
US11031530B2 (en) | 2021-06-08 |
TW201403881A (zh) | 2014-01-16 |
US10347800B2 (en) | 2019-07-09 |
CN104272479A (zh) | 2015-01-07 |
CN111540822B (zh) | 2024-04-26 |
US9634201B2 (en) | 2017-04-25 |
JP2015516691A (ja) | 2015-06-11 |
US20190326483A1 (en) | 2019-10-24 |
KR102072769B1 (ko) | 2020-02-03 |
EP2850666A1 (en) | 2015-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6697033B2 (ja) | ナノ構造蛍光体を有する発光装置 | |
US11171265B2 (en) | Light emitting device having an optically pumped semiconductor wavelength converting element | |
JP6631973B2 (ja) | 量子ドット複合材料ならびにその製造方法および用途 | |
RU2550753C2 (ru) | Полупроводниковый светоизлучающий диод с конверсией длины волны | |
JP6435258B2 (ja) | 波長変換側面被覆を具備する発光装置 | |
US20110317397A1 (en) | Quantum dot wavelength conversion for hermetically sealed optical devices | |
KR102706821B1 (ko) | 발광 디바이스 및 발광 디바이스를 제조하기 위한 방법 | |
US9941443B2 (en) | Semiconductor light emitting device | |
JP2004095941A (ja) | 発光装置 | |
KR101723540B1 (ko) | 발광 소자 및 이를 갖는 발광 소자 패키지 | |
KR20120011198A (ko) | 발광 소자, 발광 소자 패키지 및 발광 소자의 제조방법 | |
JP2007335799A (ja) | 発光装置 | |
TW200536155A (en) | Compound semiconductor light-emitting diode |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200423 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210331 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210406 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210630 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220224 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20220621 |