JP2020106845A - フレキシブル配線体、駆動システムおよび撮像装置 - Google Patents

フレキシブル配線体、駆動システムおよび撮像装置 Download PDF

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Publication number
JP2020106845A
JP2020106845A JP2020021006A JP2020021006A JP2020106845A JP 2020106845 A JP2020106845 A JP 2020106845A JP 2020021006 A JP2020021006 A JP 2020021006A JP 2020021006 A JP2020021006 A JP 2020021006A JP 2020106845 A JP2020106845 A JP 2020106845A
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JP
Japan
Prior art keywords
movable
actuator
flexible wiring
wiring body
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020021006A
Other languages
English (en)
Japanese (ja)
Inventor
田中　秀治
Shuji Tanaka
秀治 田中
貴城 塚本
Takagi Tsukamoto
貴城 塚本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University NUC
Original Assignee
Tohoku University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University NUC filed Critical Tohoku University NUC
Priority to JP2020021006A priority Critical patent/JP2020106845A/ja
Publication of JP2020106845A publication Critical patent/JP2020106845A/ja
Priority to PCT/JP2021/004696 priority patent/WO2021161976A1/ja
Priority to US17/798,866 priority patent/US20230156911A1/en
Priority to CN202180026741.5A priority patent/CN115461677A/zh
Priority to JP2022500412A priority patent/JP7643738B2/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/035—DC motors; Unipolar motors
    • H02K41/0352—Unipolar motors
    • H02K41/0354—Lorentz force motors, e.g. voice coil motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Studio Devices (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Structure Of Printed Boards (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
JP2020021006A 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置 Pending JP2020106845A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020021006A JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置
PCT/JP2021/004696 WO2021161976A1 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置
US17/798,866 US20230156911A1 (en) 2020-02-10 2021-02-09 Flexible wiring body, driving system, and imaging device
CN202180026741.5A CN115461677A (zh) 2020-02-10 2021-02-09 柔性布线体、驱动系统以及摄像装置
JP2022500412A JP7643738B2 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020021006A JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置

Publications (1)

Publication Number Publication Date
JP2020106845A true JP2020106845A (ja) 2020-07-09

Family

ID=71450821

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020021006A Pending JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置
JP2022500412A Active JP7643738B2 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022500412A Active JP7643738B2 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置

Country Status (4)

Country Link
US (1) US20230156911A1 (https=)
JP (2) JP2020106845A (https=)
CN (1) CN115461677A (https=)
WO (1) WO2021161976A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023549924A (ja) * 2020-11-30 2023-11-29 維沃移動通信有限公司 カメラモジュール、結像方法、電子機器、可読記憶媒体及びチップ
WO2024049100A1 (ko) * 2022-09-02 2024-03-07 엘지이노텍(주) 카메라 장치 및 광학 기기

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US12389704B1 (en) * 2021-01-15 2025-08-12 Apple Inc. Image sensor package for camera with sensor shift actuation
EP4300986A1 (en) * 2022-06-30 2024-01-03 Largan Precision Co. Ltd. Shiftable circuit element, shiftable image sensor module, camera module and electronic device
TWI825866B (zh) * 2022-07-12 2023-12-11 大立光電股份有限公司 相機模組與電子裝置
TWI827505B (zh) * 2022-08-03 2023-12-21 大立光電股份有限公司 可移動式電子感光模組、相機模組及電子裝置
US12231753B1 (en) * 2022-09-07 2025-02-18 Apple Inc. Flexure arm separator for flexure module of camera with moveable image sensor
WO2025015292A2 (en) * 2023-07-12 2025-01-16 MEMS Drive (Nanjing) Co., Ltd. Electromagnetic mems assembly
DE102023211945A1 (de) * 2023-11-29 2025-06-05 Robert Bosch Gesellschaft mit beschränkter Haftung Mikroelektromechanische Haltevorrichtung, Bildsensorvorrichtung und Verfahren zum Herstellen einer mikroelektromechanischen Haltevorrichtung

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JP2008203402A (ja) * 2007-02-19 2008-09-04 Konica Minolta Opto Inc センサ装置、および撮像装置
JP2009128521A (ja) 2007-11-21 2009-06-11 Fujifilm Corp フレキシブル配線板及び撮像装置
JP4958869B2 (ja) * 2008-09-30 2012-06-20 日本電産コパル株式会社 像振れ補正装置、撮像レンズユニット、及びカメラユニット
CN102422627A (zh) * 2009-03-18 2012-04-18 拜耳材料科技公司 晶片级光学系统
JP5624529B2 (ja) * 2011-09-27 2014-11-12 株式会社東芝 手振れ補正装置及び撮像装置
JP6199398B2 (ja) * 2013-09-27 2017-09-20 シャープ株式会社 カメラモジュール
TW201630407A (zh) 2015-02-13 2016-08-16 Ue Technology Co Ltd 具有影像穩定功能之影像感測器系統晶片及其製法
CN107615160B (zh) * 2015-05-29 2020-06-16 三美电机株式会社 致动器、摄像机模块及摄像机搭载装置
JP6710775B2 (ja) * 2016-03-11 2020-06-17 アップル インコーポレイテッドＡｐｐｌｅ Ｉｎｃ． 画像センサを移動させるボイスコイルモータを有する光学画像安定化
JP6993567B2 (ja) * 2017-09-29 2022-02-03 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール、およびカメラ搭載装置
US11327276B2 (en) * 2018-01-24 2022-05-10 MEMS Drive (Nanjing) Co., Ltd. MEMS actuation system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023549924A (ja) * 2020-11-30 2023-11-29 維沃移動通信有限公司 カメラモジュール、結像方法、電子機器、可読記憶媒体及びチップ
JP7659631B2 (ja) 2020-11-30 2025-04-09 維沃移動通信有限公司 カメラモジュール、結像方法、電子機器、可読記憶媒体及びチップ
WO2024049100A1 (ko) * 2022-09-02 2024-03-07 엘지이노텍(주) 카메라 장치 및 광학 기기

Also Published As

Publication number Publication date
CN115461677A (zh) 2022-12-09
WO2021161976A1 (ja) 2021-08-19
JP7643738B2 (ja) 2025-03-11
US20230156911A1 (en) 2023-05-18
JPWO2021161976A1 (https=) 2021-08-19

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