WO2018018998A1 - 成像方法、成像装置及电子装置 - Google Patents

成像方法、成像装置及电子装置 Download PDF

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Publication number
WO2018018998A1
WO2018018998A1 PCT/CN2017/084217 CN2017084217W WO2018018998A1 WO 2018018998 A1 WO2018018998 A1 WO 2018018998A1 CN 2017084217 W CN2017084217 W CN 2017084217W WO 2018018998 A1 WO2018018998 A1 WO 2018018998A1
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WO
WIPO (PCT)
Prior art keywords
pair
optical image
stabilization system
image stabilization
movable electrode
Prior art date
Application number
PCT/CN2017/084217
Other languages
English (en)
French (fr)
Inventor
韦怡
周奇群
Original Assignee
广东欧珀移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Priority to EP17833303.5A priority Critical patent/EP3454543B1/en
Publication of WO2018018998A1 publication Critical patent/WO2018018998A1/zh
Priority to US16/196,704 priority patent/US10721402B2/en
Priority to US16/436,175 priority patent/US10582128B2/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/683—Vibration or motion blur correction performed by a processor, e.g. controlling the readout of an image memory

Definitions

  • the present invention relates to optical image stabilization technology, and in particular to an optical image stabilization system, an imaging device, and an electronic device.
  • the existing optical image stabilization system uses a voice coil motor as an actuator, which is bulky, which is disadvantageous for miniaturization of an imaging device and an electronic device using an optical image stabilization system.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention is required to provide an optical image stabilization system, an imaging device, and an electronic device.
  • MEMS including:
  • a deformable connector for fixedly connecting the fixed electrode and the movable electrode
  • An image sensor fixedly coupled to the movable electrode
  • the fixed electrode and the movable electrode are configured to generate an electrostatic force under the action of a driving voltage
  • the connecting member is configured to deform in a direction along which the movable electrode moves under the electrostatic force to allow the movable electrode Movement causes the image sensor to move to compensate for jitter.
  • the MEMS size is less than or equal to 88.5 mm * 8.5 mm.
  • the MEMS power consumption is less than 10 mW.
  • the microelectromechanical system has a mechanical frequency of 80-120 Hz.
  • the MEMS includes a plurality of pairs of the fixed electrodes and the movable electrodes, each pair of the fixed electrodes and the movable electrodes for driving the image sensor in different directions in the same plane mobile.
  • the connector includes a deformable wire and a tab attached to both ends of the deformable wire.
  • the deformable wire is a silicon wire.
  • the deformable wire has a rectangular cross section, a width of 10-30 um, a thickness of 1-3 um, and a length of 500-800 um;
  • the width direction of the deformable wire is perpendicular to the moving direction of the movable electrode.
  • a deformable variable of the deformable wire along the moving direction of the movable electrode under the electrostatic force is proportional to the electrostatic force.
  • the deformation variable is less than or equal to 150 um when the electrostatic force is less than the predetermined threshold.
  • the upper surface of the fixed electrode is formed with a plurality of first pads, and the upper surface of the movable electrode is formed with a plurality of second pads;
  • the connecting member includes a plurality of wires, and is fixedly connected to the first pad and the second pad through the connecting piece to fix the fixed electrode and the movable electrode.
  • the optical image stabilization system further includes a circuit board, and the fixed electrode is disposed on the circuit board.
  • the upper surface of the circuit board is formed with a plurality of third pads
  • the upper surface of the fixed electrode is further formed with a plurality of fourth pads
  • the plurality of third pads are connected to the plurality of fourth pads through the first wire;
  • the circuit board applies the driving voltage to the fixed electrode and the movable electrode through the first wire and a part of the connecting member.
  • the upper surface of the image sensor is formed with a plurality of fifth pads, and the plurality of fifth pads are connected to a portion of the second pads by a second wire, and the circuit board passes The first wire, a portion of the connector, and the second wire are electrically connected to the image sensor.
  • the circuit board is formed with a recess, and the MEMS and the image sensor are disposed within the recess.
  • the circuit board is formed with an annular through slot that divides the circuit board into a movable portion and a fixed portion surrounding the movable portion, the fixed electrode being disposed at the fixed portion, The movable electrode is disposed on the movable portion.
  • the movable electrode is formed with a via
  • the image sensor is electrically connected to the movable portion by a conductive paste filled in the via.
  • the fixed electrode and the movable electrode are comb-shaped electrodes that cooperate with each other.
  • the fixed electrode and the movable electrode comprise a first pair, a second pair, a third pair, and a fourth pair, the first pair, the second pair, and the third pair And the fourth pair is distributed in a field shape, the first pair and the third pair are respectively used to drive the image sensor to move in a first direction, and the second pair and the fourth pair are used for simultaneous Belt The image sensor is moved in a second direction that is perpendicular to the first direction.
  • the first pair, the second pair, the third pair, and the fourth pair are further configured to cooperate to drive the image sensor along the first direction and the first The second direction is perpendicular to the third direction of rotation.
  • the MEMS system further comprises:
  • An inner frame wherein the inner frame is fixedly connected to the fixed pair of the first pair, the second pair, the third pair, and the fourth pair;
  • the outer frame is fixedly connected to the movable electrodes of the first pair, the second pair, the third pair, and the fourth pair;
  • the connecting member fixedly connects the fixed electrode and the movable electrode by fixedly connecting the inner frame and the outer frame.
  • the inner frame and the outer frame are rectangular, the upper surface of the inner frame is formed with an inner frame pad, and the upper surface of the outer frame is formed with an outer frame pad;
  • the connecting member fixedly connects the inner frame and the outer frame by the inner frame solder pad and the outer frame solder pad fixedly disposed.
  • An imaging apparatus includes the optical image stabilization apparatus.
  • An electronic device of an embodiment of the present invention includes the imaging device.
  • MEMS is a high-tech electromechanical device based on microelectronics (semiconductor manufacturing technology) that combines lithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining and precision machining.
  • microelectronics semiconductor manufacturing technology
  • FIG. 1 is a schematic diagram of an optical image stabilization system in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of an electronic device according to an embodiment of the present invention.
  • FIG 3 is a schematic view of a connector of an embodiment of the present invention.
  • Fig. 4 is a graph showing the force-deformation characteristic of the connecting member according to the embodiment of the present invention.
  • FIG. 5 is a schematic illustration of a MEMS system in accordance with another embodiment of the present invention.
  • Figure 6 is a schematic illustration of an optical image stabilization system in accordance with another embodiment of the present invention.
  • Optical image stabilization system 10 inner frame 11, inner frame pad 112, MEMS 12, fixed electrode 122, upper surface 1222, first pad 1224, fourth pad 1226, movable electrode 124, upper surface 1242, second solder Pad 1244, via 1246, connector 126, deformable wire 1262, tab 1264, first pair X1, second pair Y1, third pair X2, fourth pair Y2, outer frame 13, outer frame pad 132 Image sensor 14, upper surface 142, fifth pad 144, circuit board 16, recess 161, upper surface 162, annular via 163, third pad 164, movable portion 165, first wire 166, fixed portion 167 , the second wire 168 , the conductive adhesive 169 , the reinforcing plate 18 , the imaging device 20 , and the electronic device 30
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • an optical image stabilization system 10 includes a micro electro-mechanical system (MEMS) 12 and an image sensor 14.
  • the MEMS 12 includes a fixed electrode 122, a movable electrode 124, and a deformable connector 126.
  • the movable electrode 124 is mated with the fixed electrode 122.
  • the connecting member 126 is fixedly connected to the fixed electrode 122 and the movable electrode 124.
  • the fixed electrode 122 and the movable electrode 124 are used to generate an electrostatic force under the action of a driving voltage.
  • the connector 126 is configured to deform in a direction in which the movable electrode 124 moves under the action of an electrostatic force to allow the movable electrode 124 to move to drive the image sensor 14 to move to compensate for the shake.
  • MEMS is a high-tech electromechanical device based on microelectronics (semiconductor manufacturing technology) that combines lithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining and precision machining.
  • microelectronics semiconductor manufacturing technology
  • the MEMS 12 can have a lateral dimension of 8.5 mm by 8.5 mm or less, and can be further reduced as needed as semiconductor fabrication techniques evolve.
  • MEMS 12 has a very significant size advantage and can reach millimeters or less in size.
  • the optical image stabilization system 10 of the embodiment of the present invention can be applied to the imaging device 20 of the embodiment of the present invention.
  • the imaging device 20 of the embodiment of the present invention can be applied to the electronic device 30 of the embodiment of the present invention.
  • the electronic device 30 of the embodiment of the present invention may be a mobile phone or a tablet computer
  • the imaging device 20 of the embodiment of the present invention may be a front camera or a rear camera of a mobile phone or a tablet computer.
  • the jitter refers to jitter that occurs during exposure using the electronic device 30, which causes blurring of an image output by the imaging device 20, and the imaging quality of the imaging device 20 can be improved by employing the optical image stabilization system 10.
  • the imaging device 20 and the electronic device 30 of the embodiment of the present invention are advantageously miniaturized.
  • MEMS 12 due to electrostatic force actuation (ie, relying on attraction between electrostatic charges), on the one hand, MEMS 12 has less power consumption relative to existing voice coil motors, such as in certain embodiments, The power consumption of MEMS 12 is less than 10mW. On the other hand, MEMS 12 has low heat generation and there is no problem of heat dissipation.
  • the fixed electrode 122 and the suspended activity can be formed by techniques such as thin film, photolithography, etching, laser cutting, silicon micromachining, non-silicon micromachining, and precision machining on a silicon substrate (not shown).
  • Electrode 124, and live The movable electrode 124 is suspended from the fixed electrode 122 by a connector 126.
  • the MEMS 12 includes a plurality of pairs of fixed electrodes 122 and movable electrodes 124, each pair of fixed electrodes 122 and movable electrodes 124 for driving the image sensor 14 to move in a predetermined direction of the same plane.
  • each pair of fixed electrode 122 and movable electrode 124 can compensate for jitter in different directions. Further, since they are on the same plane, the plurality of pairs of the fixed electrode 122 and the movable electrode 124 can be fitted in the same plane, that is, the plurality of pairs of the fixed electrode 122 and the movable electrode 124 can be in the same plane. As such, the MEMS 12 can have a single-layer electrode structure, which simplifies the structure of the MEMS 12, making the MEMS 12 simple in structure and easy to manufacture.
  • the connector 126 can also be formed by techniques such as thin film, photolithography, etching, laser cutting, silicon micromachining, non-silicon micromachining, and precision machining on a silicon substrate (not shown).
  • the connector 126 can include a deformable wire 1262 and a tab 1264 coupled to both ends of the deformable wire 1262.
  • the deformable wire 1262 can provide good mechanical connection and deformation characteristics, and the tab 1264 can increase the connection area with the fixed electrode 122 or the movable electrode 124, thereby improving the joint strength.
  • the deformable wire 1262 can be a silicon wire.
  • the deformable wire 1262 can be fabricated by semiconductor fabrication techniques.
  • the shape and size of the deformable wire 1262 can be determined according to material properties such that the deformable wire 1262 can both suspend the movable electrode 124 on the fixed electrode 122 and can deform along the moving direction of the movable electrode 124. the goal of.
  • the deformable wire 1262 employs a silicon wire and has a rectangular cross section.
  • the deformable wire 1262 has a width of 10-30 um, a thickness of 1-3 um, and a length of 500-800 um.
  • the width direction is perpendicular to the moving direction of the movable electrode 124.
  • the deformable wire 1262 has a width of 25 um, a thickness of 1.5 um, and a length of 600 um.
  • the deformable wire 1262 can only be deformed along the moving direction of the movable electrode 124 under the action of an external force, and within a certain external force range (less than a predetermined threshold).
  • the deformation of the deformable wire 1262 is proportional to the magnitude of the external force, while in other directions, the deformable wire 1262 remains rigid and is not easily deformable.
  • the electrostatic force F is less than the predetermined threshold
  • the deformable wire 1262 is proportional to the electrostatic force F (vertical axis) along the direction of movement D (horizontal axis) of the moving electrode 124 under the action of the electrostatic force F.
  • the MEMS 12 has a very high moving precision compared to the existing voice coil motor, and can even reach the pixel level (ie, the distance accuracy of the MEMS 12 moving the image sensor 14 each time can be compared with the image sensor 14 The size of the pixel is quite).
  • an adjustment between two adjacent electrostatic forces may result in a deformation variable D (ie, a change in amplitude) that is less than or equal to 150 um.
  • the MEMS 12 can drive the image sensor 14 to move 150 um, or the compensation capability/range of the optical image stabilization system 10 can be 150 um (compensation accuracy), compared to the existing voice coil motor, MEMS 12 compensation strong ability.
  • the MEMS 12 can be made to have a higher mechanical frequency due to the materials, shapes and dimensions of the above embodiments.
  • the mechanical frequency of MEMS 12 is typically between 80-120 Hz, such as 100 Hz. Therefore, due to the high mechanical frequency, the MEMS 12 can reduce the sensitivity of sound or vibration compared to the mechanical frequency of the existing voice coil motor (about 20 Hz).
  • the upper surface 1222 of the fixed electrode 122 is formed with a plurality of first pads 1224
  • the upper surface 1242 of the movable electrode 124 is formed with a plurality of second pads 1244.
  • the connecting member 126 includes a plurality of pieces, and is fixedly connected to the first pad 1224 and the second pad 1244 via the connecting piece 1264 to fixedly connect the fixed electrode 122 and the movable electrode 124.
  • a plurality of first pads 1224 may be formed on the fixed electrode 122 by osmosis and photolithography, and a plurality of second pads 1244 may be formed on the movable electrode 124, and then the connecting piece is connected by wire bonding. 1264 is fixedly connected to the first pad 1224 and the second pad 1244, respectively.
  • the fixed connection of the connecting member 126 to the fixed electrode 122 and the movable electrode 124 can be ensured.
  • the fixed electrode 122 and the movable electrode 124 are fixedly connected by a plurality of connecting members 126, that is, there is a redundant connection. In this way, the partial connector 126 is broken or the like, and the fixed electrode 122 and the movable electrode 124 can still be fixedly connected through the remaining connectors 126.
  • image sensor 14 can be secured to movable electrode 124 by glue.
  • optical image stabilization system 10 includes a circuit board 16 on which fixed electrodes 122 are disposed.
  • a plurality of third pads 164 are disposed on the upper surface 162 of the circuit board 16.
  • the upper surface 1222 of the fixed electrode 122 is provided with a plurality of fourth pads 1226.
  • a plurality of third pads 164 are connected to the plurality of fourth pads 1226 by the first wires 166.
  • the circuit board 16 applies a driving voltage to the fixed electrode 122 and the movable electrode 124 through the first wire 166 and the partial connecting member 126.
  • the connecting member 126 not only functions as a mechanical connection, but also can realize electrical connection and realize multiplexing, which can simplify the structure while reducing components and reducing costs.
  • the upper surface 142 of the image sensor 14 is formed with a plurality of fifth pads 144, and the plurality of fifth pads 144 are connected to the portion of the second pads 1244 by the second wires 168.
  • the circuit board 16 is electrically coupled to the image sensor 14 by a first wire 166, a partial connector 126, and a second wire 168.
  • the connecting member 126 not only functions as a mechanical connection, but also can realize electrical connection and realize multiplexing, which can simplify the structure while reducing components and reducing costs.
  • the circuit board 16 is a flexible circuit board, and the optical image stabilization system 10 further includes an attached circuit
  • the plate 16 is reinforced by a reinforcing plate 18 on the side opposite to the MEMS 12.
  • the reinforcing plate 18 is used to increase the mechanical strength of the circuit board 16.
  • circuit board 16 may not be limited to the embodiments discussed above, but a rigid circuit board may be employed.
  • the circuit board 16 is formed with a recess 161 in which the MEMS 12 and the image sensor 14 are disposed.
  • the overall height of the optical image stabilization system 10 can be reduced, which is advantageous for miniaturization.
  • the fixed electrode 122 is secured to the circuit board 16 by glue.
  • the circuit board 16 is formed with an annular through slot 163 that divides the circuit board 16 into a movable portion 165 and a fixed portion 167 surrounding the movable portion 165.
  • the fixed electrode 122 is disposed at the fixed portion 167, active
  • the electrode 124 is disposed on the movable portion 165.
  • the movable electrode 124 can still move while being fixedly coupled to the circuit board 16.
  • the movable electrode 124 can also be fixed to the movable portion 165 by glue.
  • the movable electrode 124 is formed with a via 1246, and the image sensor 14 is electrically coupled to the active portion 165 by a conductive paste 169 that is filled in the via 1246.
  • the fixed electrode 122 and the movable electrode 124 are comb-shaped electrodes that cooperate with each other.
  • the comb electrode With the comb electrode, the area between the fixed electrode 122 and the movable electrode 124 is more matched, and the driving voltage is converted into an electrostatic force with high efficiency, which can further reduce the power consumption of the power consumption optical image stabilization system 10.
  • the fixed electrode 122 and the movable electrode 124 include a first pair X1, a second pair Y1, a third pair X2, and a fourth pair Y2, and the first pair X1, the second pair Y1, the third pair X2, and the fourth pair Y2 are in the shape of a field.
  • the first pair of X1 and the third pair of X2 are respectively used to drive the image sensor 14 to move in a first direction (for example, the X direction), and the second pair of Y1 and the fourth pair of Y2 are used to simultaneously drive the image sensor 14 along the first direction.
  • the second direction (for example, the Y direction) moves vertically (for example, the X direction).
  • motion compensation in the first direction (for example, the X direction) and the second direction (for example, the Y direction) can be realized, and by controlling the first pair X1 and the third pair X2 to move in opposite directions, the vertical and the Rotation compensation in a third direction (eg, the Z direction) in one direction (eg, the X direction) and the second direction (eg, the Y direction).
  • a third direction eg, the Z direction
  • the MEMS 12 further includes an inner frame 11 and an outer frame 13 that are fixedly coupled to the fixed electrodes 122 of the first pair X1, the second pair Y1, the third pair X2, and the fourth pair Y2.
  • the outer frame 13 is fixedly coupled to the movable electrodes 124 of the first pair X1, the second pair Y1, the third pair X2, and the fourth pair Y2.
  • the connecting member 126 fixedly connects the fixed electrode 122 and the movable electrode 124 by fixedly connecting the inner frame 11 and the outer frame 13.
  • the structure is simple and easy to manufacture.
  • the inner frame 11 and the outer frame 13 are substantially rectangular, and the upper surface of the inner frame 11 is formed with an inner frame pad 112.
  • An outer frame pad 132 is formed on the upper surface of the outer frame 13.
  • the connecting member 126 is fixedly connected to the inner frame 11 and the outer frame 13 by the inner frame pad 114 and the outer frame pad 134 fixedly disposed.
  • the structure is simple and easy to manufacture.

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Abstract

一种光学图像稳定系统(10)，其包括微机电系统(12)及图像传感器(14)。微机电系统包括固定电极(122)、与所述固定电极配合的活动电极(124)及固定连接所述固定电极及所述活动电极的可形变连接件(126)。所述图像传感器与所述活动电极固定连接。所述固定电极及所述活动电极用于在驱动电压的作用下产生静电力，所述连接件用于在所述静电力的作用下沿所述活动电极移动的方向形变以允许所述活动电极移动从而带动所述图像传感器移动以补偿抖动。由于所述微机电系统采用半导体制造技术制造，尺寸小，因此有利于所述光学图像稳定系统的小型化。一种成像装置及电子装置。

Description

成像方法、成像装置及电子装置
优先权信息
本申请请求2016年7月29日向中国国家知识产权局提交的、专利申请号为201610616350.X的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及光学图像稳定技术，特别涉及一种光学图像稳定系统、成像装置及电子装置。
背景技术
现有的光学图像稳定系统采用音圈马达作为致动器，体积大，不利于采用光学图像稳定系统的成像装置及电子装置的小型化。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明需要提供一种光学图像稳定系统、成像装置及电子装置。
本发明实施方式的光学图像稳定系统，包括：
微机电系统，包括：
固定电极；
与所述固定电极配合的活动电极；及
固定连接所述固定电极及所述活动电极的可形变连接件；及
与所述活动电极固定连接的图像传感器；
所述固定电极及所述活动电极用于在驱动电压的作用下产生静电力，所述连接件用于在所述静电力的作用下沿所述活动电极移动的方向形变以允许所述活动电极移动从而带动所述图像传感器移动以补偿抖动。
在某些实施方式中，所述微机电系统的尺寸小于或等于88.5mm*8.5mm。
在某些实施方式中，所述微机电系统的功耗小于10mW。
在某些实施方式中，所述微机电系统的机械频率为80-120Hz。
在某些实施方式中，所述微机电系统包括多对所述固定电极及所述活动电极，每对所述固定电极及所述活动电极用于带动所述图像传感器在同样平面内沿不同方向移动。
在某些实施方式中，所述连接件包括可形变线材及与所述可形变线材两端连接的连接片。
在某些实施方式中，所述可形变线材为硅线。
在某些实施方式中，所述可形变线材具有矩形横截面，宽度为10-30um，厚度为1-3um，而长度为500-800um；
所述可形变线材的宽度方向垂直于所述活动电极的移动方向。
在某些实施方式中，在所述静电力小于预定阈值时，所述可形变线材在所述静电力的作用下沿所述活动电极的移动方向的形变量与所述静电力成正比。
在某些实施方式中，在所述静电力小于所述预定阈值时，所述形变量小于或等于150um。
在某些实施方式中，所述固定电极的上表面形成有多个第一焊垫，所述活动电极的上表面形成有多个第二焊垫；
所述连接件包括多个，并分别通过所述连接片与所述第一焊垫及所述第二焊垫固定连接从而固定连接所述固定电极及所述活动电极。
在某些实施方式中，所述光学图像稳定系统还包括有电路板，所述固定电极设置在所述电路板上，
所述电路板的上表面形成有多个第三焊垫；
所述固定电极的上表面还形成有多个第四焊垫；
所述多个第三焊垫通过第一线材与所述多个第四焊垫连接；
所述电路板通过所述第一线材及部分所述连接件向所述固定电极及所述活动电极施加所述驱动电压。
在某些实施方式中，所述图像传感器的上表面形成有多个第五焊垫，所述多个第五焊垫通过第二线材与部分所述第二焊垫连接，所述电路板通过所述第一线材、部分所述连接件、及所述第二线材与所述图像传感器电气连接。
在某些实施方式中，所述电路板形成有凹槽，所述微机电系统及所述图像传感器设置在所述凹槽内。
在某些实施方式中，所述电路板形成有环形通槽，所述环形通槽将所述电路板分割成活动部分及环绕所述活动部分的固定部分，所述固定电极设置在固定部分，所述活动电极设置在活动部分上。
在某些实施方式中，所述活动电极形成有过孔，所述图像传感器通过填充于所述过孔的导电胶与活动部分电气连接。
在某些实施方式中，所述固定电极及所述活动电极为相互配合的梳状电极。
在某些实施方式中，所述固定电极及所述活动电极包括第一对、第二对、第三对及第四对，所述第一对、所述第二对、所述第三对及所述第四对呈田字形分布，所述第一对及所述第三对用于分别带动所述图像传感器沿第一方向移动，所述第二对及所述第四对用于同时带 动所述图像传感器沿与所述第一方向垂直的第二方向移动。
在某些实施方式中，所述第一对、所述第二对、所述第三对及所述第四对还用于配合带动所述图像传感器沿与所述第一方向及所述第二方向垂直的第三方向转动。
在某些实施方式中，所述微机电系统还包括：
内框，所述内框与所述第一对、所述第二对、所述第三对及所述第四对的所述固定电极固定连接；
所述外框与所述第一对、所述第二对、所述第三对及所述第四对的所述活动电极固定连接；
所述连接件通过固定连接所述内框及所述外框从而固定连接所述固定电极及所述活动电极。
在某些实施方式中，所述内框及所述外框呈矩形，所述内框的上表面形成有内框焊垫，所述外框的上表面形成有外框焊垫；
所述连接件通过固定设置在所述内框焊垫及所述外框焊垫固定连接所述内框及所述外框。
本发明实施方式的成像装置包括所述光学图像稳定装置。
本发明实施方式的电子装置包括所述成像装置。
MEMS是在微电子技术(半导体制造技术)基础上发展起来的，融合了光刻、腐蚀、薄膜、LIGA、硅微加工、非硅微加工和精密机械加工等技术制造的高科技电子机械器件，相较于现有的音圈马达具有较小的尺寸，有利于采用所述光学图像稳定系统的小型化，因此也有利于采用所述光学图像稳定系统的成像装置及采用所述成像装置的电子装置的小型化。
本发明的附加方面的优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明实施方式的光学图像稳定系统的示意图。
图2是本发明实施方式的电子装置的示意图。
图3是本发明实施方式的连接件的示意图。
图4是本发明实施方式的连接件的受力-形变特征曲线图。
图5是本发明另一实施方式的微机电系统的示意图。
图6是本发明另一实施方式的光学图像稳定系统的示意图。
主要元件符号说明：
光学图像稳定系统10、内框11、内框焊垫112、MEMS 12、固定电极122、上表面1222、第一焊垫1224、第四焊垫1226、活动电极124、上表面1242、第二焊垫1244、过孔1246、连接件126、可形变线材1262、连接片1264、第一对X1、第二对Y1、第三对X2、第四对Y2、外框13、有外框焊垫132、图像传感器14、上表面142、第五焊垫144、电路板16、凹槽161、上表面162、环形通槽163、第三焊垫164、活动部分165、第一线材166、固定部分167、第二线材168、导电胶169、补强板18、成像装置20、电子装置30
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本发明实施方式的光学图像稳定系统10包括微机电系统(micro electro-mechanical system,MEMS)12及图像传感器14。MEMS 12包括固定电极122、活动电极124及可形变连接件126。活动电极124与固定电极122配合。连接件126固定连接固定电极122及活动电极124。固定电极122及活动电极124用于在驱动电压的作用下产生静电力。连接件126用于在静电力的作用下沿活动电极124移动的方向形变以允许活动电极124移动从而带动图像传感器14移动以补偿抖动。
MEMS是在微电子技术(半导体制造技术)基础上发展起来的，融合了光刻、腐蚀、薄膜、LIGA、硅微加工、非硅微加工和精密机械加工等技术制造的高科技电子机械器件，相较于现有的音圈马达具有较小的尺寸，有利于采用光学图像稳定系统10的小型化。
例如，在某些实施方式中，MEMS 12的横向尺寸可以达到8.5mm*8.5mm或以下，而且随着半导体制造技术的发展，还可以根据需要进一步缩小。
因此，相较于现有的音圈马达，MEMS 12具有非常明显的尺寸优势，尺寸可到达毫米级或以下。
请一并参阅图2，本发明实施方式的光学图像稳定系统10可应用于本发明实施方式的成像装置20，本发明实施方式的成像装置20可以应用于本发明实施方式的电子装置30。例如，本发明实施方式的电子装置30可为手机或平板电脑，而本发明实施方式的成像装置20可为手机或平板电脑的前置相机或者后置相机。
抖动是指用于在使用电子装置30拍照的曝光过程中发生的抖动，会导致成像装置20输出的图像模糊，通过采用光学图像稳定系统10可以改善成像装置20的成像质量。
另外，通过采用本发明实施方式的光学图像稳定系统10，有利于本发明实施方式的成像装置20及电子装置30的小型化。
另外，由于是静电力致动(即依靠静电荷之间的吸引力致动)，一方面使得MEMS 12相对于现有的音圈马达具有较小的功耗，例如在某些实施方式中，MEMS 12的功耗小于10mW，另一方面使得MEMS 12发热量低，不存在散热的问题。
在某些实施方式中，可以通过在硅基底(图未示)通过薄膜，光刻、腐蚀、激光切割、硅微加工、非硅微加工和精密机械加工等技术形成固定电极122及悬空的活动电极124，而活 动电极124通过连接件126悬挂在固定电极122上。
在某些实施方式中，MEMS 12包括多对固定电极122及活动电极124，每对固定电极122及活动电极124用于带动图像传感器14在同一平面的预定方向移动。
如此，每对固定电极122及活动电极124可以补偿不同方向的抖动。另外，由于在同一平面，因此，多对固定电极122及活动电极124可以在同一平面内进行配合，也即是说，多对固定电极122及活动电极124可以处于同一平面内。如此，MEMS 12可以具有单层电极结构，可以简化MEMS 12的结构，使得MEMS 12结构简单，易于制造。
在某些实施方式中，连接件126也可以通过在硅基底(图未示)上通过薄膜，光刻、腐蚀、激光切割、硅微加工、非硅微加工和精密机械加工等技术形成。
请一并参阅图3，在某些实施方式中，连接件126可以包括可形变线材1262及与可形变线材1262两端连接的连接片1264。
如此，可形变线材1262可以提供良好的机械连接及形变特性，而连接片1264可以增加与固定电极122或活动电极124的连接面积，从而可以提高连接强度。
在某些实施方式中，可形变线材1262可以是硅线。
如此，可以通过半导体制造技术制造可形变线材1262。
在某些实施方式中，可以根据材料特性确定可形变线材1262形状及尺寸以使得可形变线材1262既可实现将活动电极124悬挂在固定电极122上又可实现沿着活动电极124的移动方向形变的目的。
例如，在某些实施方式中，可形变线材1262采用硅线，且具有矩形横截面。可形变线材1262的宽度为10-30um，厚度为1-3um，而长度为500-800um，连接固定电极122及活动电极124时，宽度方向垂直于活动电极124的移动方向设置。
作为一个例子，可形变线材1262的宽度为25um，厚度为1.5um，长度为600um。
请一并参阅图4，如此，在形状及尺寸的设置下，可以使得可形变线材1262在外力作用下仅可以沿着活动电极124的移动方向形变，且在一定的外力范围内(小于预定阈值)，可形变线材1262的形变量与外力大小成正比，而在其他方向，可形变线材1262保持刚性，不易形变。如此，在静电力F小于预定阈值时，可形变线材1262在静电力F的作用下沿活动电极124的移动方向的形变量D(横轴)与静电力F(纵轴)成正比。
如此，通过精准控制驱动电压，MEMS 12相较于现有的音圈马达具有非常高的移动精度，甚至可达到像素级别(即MEMS 12每次带动图像传感器14移动的距离精度可以与图像传感器14像素的尺寸相当)。
在某些实施方式中，在静电力F小于预定阈值时，相邻两个静电力之间的调整可导致形变量D(即幅度变化)小于或等于150um。
也即是说，MEMS 12可以带动图像传感器14移动150um，或者说，光学图像稳定系统10的补偿能力/范围可为150um(补偿精度)，相较于现有的音圈马达，MEMS 12的补偿能力强。
另外，由于采用上述实施方式的材料、形状及尺寸，可以使得MEMS 12具有较高的机械频率。例如在某些实施方式中，MEMS 12的机械频率通常在80-120Hz之间，例如为100Hz。因此，由于具有较高的机械频率，MEMS 12相较于现有的音圈马达的机械频率(20Hz左右)可以降低声音或震动的敏感度。
在某些实施方式中，固定电极122的上表面1222形成有多个第一焊垫1224，活动电极124的上表面1242形成有多个第二焊垫1244。连接件126包括多个，并通过连接片1264与第一焊垫1224及第二焊垫1244固定连接从而固定连接固定电极122及活动电极124。
在某些实施方式中，可以通过渗透及光蚀刻方式在固定电极122上形成多个第一焊垫1224及在活动电极124上形成多个第二焊垫1244，然后通过打线方式将连接片1264分别与第一焊垫1224及第二焊垫1244固定连接。如此，可以保证连接件126与固定电极122及活动电极124的固定连接。而且由于固定电极122及活动电极124之间通过多个连接件126固定连接，即，存在冗余连接。如此，即是部分连接件126出现断裂等现象，固定电极122及活动电极124仍可通过剩余的连接件126实现固定连接。
在某些实施方式中，图像传感器14可以通过胶水固定在活动电极124上。
如此，工艺简单，易于制造。
在某些实施方式中，光学图像稳定系统10包括电路板16，固定电极122设置在电路板16上。电路板16的上表面162上设置有多个第三焊垫164。固定电极122的上表面1222设置有多个第四焊垫1226。多个第三焊垫164通过第一线材166与多个第四焊垫1226连接。电路板16通过第一线材166及部分连接件126向固定电极122及活动电极124施加驱动电压。
也即是说，部分连接件126用于传输驱动电压到固定电极122及活动电极124上。连接件126不但起到机械连接的作用，而且可以实现电气连接，实现复用，可以简化结构的同时减少元件，降低成本。
图像传感器14的上表面142形成有多个第五焊垫144，多个第五焊垫144通过第二线材168与部分第二焊垫1244连接。电路板16通过第一线材166、部分连接件126、及第二线材168与图像传感器14电气连接。
也即是说，部分连接件126用于传输控制信号及图像信号。连接件126不但起到机械连接的作用，而且可以实现电气连接，实现复用，可以简化结构的同时减少元件，降低成本。
在某些实施方式中，电路板16为柔性电路板，光学图像稳定系统10还包括附设在电路 板16与MEMS 12相背一侧的补强板18。补强板18用于增加电路板16的机械强度。
当然，在其他实施方式中，电路板16可以不限于上面讨论的实施方式，而可以采用刚性电路板。
在某些实施方式，电路板16形成有凹槽161，MEMS 12及图像传感器14设置于凹槽161内。
如此，可以降低光学图像稳定系统10的整体高度，有利于小型化。
在某些实施方式中，固定电极122通过胶水固定在电路板16上。
如此，工艺简单，易于制造。
在某些实施方式中，电路板16形成有环形通槽163，环形通槽163将电路板16分割成活动部分165及环绕活动部分165的固定部分167，固定电极122设置在固定部分167，活动电极124设置在活动部分165上。
如此，活动电极124在与电路板16固定连接的情况下仍可以移动。
活动电极124也可以通过胶水固定在活动部分165上。
在某些实施方式中，活动电极124形成有过孔1246，图像传感器14通过填充于过孔1246的导电胶169与活动部分165电气连接。
请参阅图5及图6，在某些实施方式中，固定电极122及活动电极124为相互配合的梳状电极。
采用梳状电极，固定电极122及活动电极124之间的面积配合更多，驱动电压转化成静电力的效率高，可以进一步降低功耗光学图像稳定系统10的功耗。
固定电极122及活动电极124包括第一对X1、第二对Y1、第三对X2及第四对Y2，第一对X1、第二对Y1、第三对X2及第四对Y2呈田字形分布，第一对X1及第三对X2用于分别带动图像传感器14沿第一方向(例如X方向)移动，第二对Y1及第四对Y2用于同时带动图像传感器14沿与第一方向(例如X方向)垂直的第二方向(例如Y方向)移动。
如此，可以实现第一方向(例如X方向)及第二方向(例如Y方向)的移动补偿，而且，通过控制第一对X1及第三对X2沿相反方向移动，还可以实现沿垂直与第一方向(例如X方向)及第二方向(例如Y方向)的第三方向(例如Z方向)的转动补偿。
在某些实施方式中，MEMS 12还包括内框11及外框13，内框11与第一对X1、第二对Y1、第三对X2及第四对Y2的固定电极122固定连接。外框13与第一对X1、第二对Y1、第三对X2及第四对Y2的活动电极124固定连接。连接件126通过固定连接内框11及外框13从而固定连接固定电极122及活动电极124。
如此，结构简单，易于制造。
在某些实施方式中内框11及外框13基本呈矩形，内框11的上表面形成有内框焊垫112， 外框13的上表面形成有外框焊垫132。连接件126通过固定设置在内框焊垫114及外框焊垫134固定连接内框11及外框13。
如此，结构简单，易于制造。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (23)

  1. 一种光学图像稳定系统，其特征在于，包括：
    微机电系统，包括：
    固定电极；
    与所述固定电极配合的活动电极；及
    固定连接所述固定电极及所述活动电极的可形变连接件；及
    与所述活动电极固定连接的图像传感器；
    所述固定电极及所述活动电极用于在驱动电压的作用下产生静电力，所述连接件用于在所述静电力的作用下沿所述活动电极移动的方向形变以允许所述活动电极移动从而带动所述图像传感器移动以补偿抖动。
  2. 如权利要求1所述的光学图像稳定系统，其特征在于，所述微机电系统的尺寸小于或等于88.5mm*8.5mm。
  3. 如权利要求1所述的光学图像稳定系统，其特征在于，所述微机电系统的功耗小于10mW。
  4. 如权利要求1所述的光学图像稳定系统，其特征在于，所述微机电系统的机械频率为80-120Hz。
  5. 如权利要求1所述的光学图像稳定系统，其特征在于，所述微机电系统包括多对所述固定电极及所述活动电极，每对所述固定电极及所述活动电极用于带动所述图像传感器在同样平面内沿不同方向移动。
  6. 如权利要求1所述的光学图像稳定系统，其特征在于，所述连接件包括可形变线材及与所述可形变线材两端连接的连接片。
  7. 如权利要求6所述的光学图像稳定系统，其特征在于，所述可形变线材为硅线。
  8. 如权利要求7所述的光学图像稳定系统，其特征在于，所述可形变线材具有矩形横截面，宽度为10-30um，厚度为1-3um，而长度为500-800um；
    所述可形变线材的宽度方向垂直于所述活动电极的移动方向。
  9. 如权利要求7所述的光学图像稳定系统，其特征在于，在所述静电力小于预定阈值时，所述可形变线材在所述静电力的作用下沿所述活动电极的移动方向的形变量与所述静电力成正比。
  10. 如权利要求9所述的光学图像稳定系统，其特征在于，在所述静电力小于所述预定阈值时，所述形变量小于或等于150um。
  11. 如权利要求6所述的光学图像稳定系统，其特征在于，所述固定电极的上表面形成有多个第一焊垫，所述活动电极的上表面形成有多个第二焊垫；
    所述连接件包括多个，并分别通过所述连接片与所述第一焊垫及所述第二焊垫固定连接从而固定连接所述固定电极及所述活动电极。
  12. 如权利要求6所述的光学图像稳定系统，其特征在于，所述光学图像稳定系统还包括有电路板，所述固定电极设置在所述电路板上，
    所述电路板的上表面形成有多个第三焊垫；
    所述固定电极的上表面还形成有多个第四焊垫；
    所述多个第三焊垫通过第一线材与所述多个第四焊垫连接；
    所述电路板通过所述第一线材及部分所述连接件向所述固定电极及所述活动电极施加所述驱动电压。
  13. 如权利要求12所述的光学图像稳定系统，其特征在于，所述图像传感器的上表面形成有多个第五焊垫，所述多个第五焊垫通过第二线材与部分所述第二焊垫连接，所述电路板通过所述第一线材、部分所述连接件、及所述第二线材与所述图像传感器电气连接。
  14. 如权利要求12所述的光学图像稳定系统，其特征在于，所述电路板形成有凹槽，所述微机电系统及所述图像传感器设置在所述凹槽内。
  15. 如权利要求14所述的光学图像稳定系统，其特征在于，所述电路板形成有环形通槽，所述环形通槽将所述电路板分割成活动部分及环绕所述活动部分的固定部分，所述固定电极设置在固定部分，所述活动电极设置在活动部分上。
  16. 如权利要求15所述的光学图像稳定系统，其特征在于，所述活动电极形成有过孔，所述图像传感器通过填充于所述过孔的导电胶与活动部分电气连接。
  17. 如权利要求1所述的光学图像稳定系统，其特征在于，所述固定电极及所述活动电极为相互配合的梳状电极。
  18. 如权利要求17所述的光学图像稳定系统，其特征在于，所述固定电极及所述活动电极包括第一对、第二对、第三对及第四对，所述第一对、所述第二对、所述第三对及所述第四对呈田字形分布，所述第一对及所述第三对用于分别带动所述图像传感器沿第一方向移动，所述第二对及所述第四对用于同时带动所述图像传感器沿与所述第一方向垂直的第二方向移动。
  19. 如权利要求18所述的光学图像稳定系统，其特征在于，所述第一对、所述第二对、所述第三对及所述第四对还用于配合带动所述图像传感器沿与所述第一方向及所述第二方向垂直的第三方向转动。
  20. 如权利要求18所述的光学图像稳定系统，其特征在于，所述微机电系统还包括：
    内框，所述内框与所述第一对、所述第二对、所述第三对及所述第四对的所述固定电极固定连接；
    所述外框与所述第一对、所述第二对、所述第三对及所述第四对的所述活动电极固定连接；
    所述连接件通过固定连接所述内框及所述外框从而固定连接所述固定电极及所述活动电极。
  21. 如权利要求20所述的光学图像稳定系统，其特征在于，所述内框及所述外框呈矩形，所述内框的上表面形成有内框焊垫，所述外框的上表面形成有外框焊垫；
    所述连接件通过固定设置在所述内框焊垫及所述外框焊垫固定连接所述内框及所述外框。
  22. 一种成像装置，其特征在于包括如权利要求1-21任意一项所述的光学图像稳定装置。
  23. 一种电子装置，其特征在于包括如权利要求22所述的成像装置。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220232165A1 (en) * 2021-01-20 2022-07-21 Largan Digital Co., Ltd. Optical image stabilizer, camera module and electronic device
US11601596B2 (en) * 2021-01-20 2023-03-07 Largan Digital Co., Ltd. Optical image stabilizer, camera module and electronic device for improved signal transmission and image quality

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CN107948532A (zh) 2018-04-20
US20190089902A1 (en) 2019-03-21
CN107948532B (zh) 2019-08-20
US10582128B2 (en) 2020-03-03
US10721402B2 (en) 2020-07-21
EP3454543A4 (en) 2019-04-24
EP3454543A1 (en) 2019-03-13
CN106254773A (zh) 2016-12-21
US20190297261A1 (en) 2019-09-26
EP3454543B1 (en) 2022-12-28
CN106254773B (zh) 2018-01-23

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