JPWO2021161976A1 - - Google Patents

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Publication number
JPWO2021161976A1
JPWO2021161976A1 JP2022500412A JP2022500412A JPWO2021161976A1 JP WO2021161976 A1 JPWO2021161976 A1 JP WO2021161976A1 JP 2022500412 A JP2022500412 A JP 2022500412A JP 2022500412 A JP2022500412 A JP 2022500412A JP WO2021161976 A1 JPWO2021161976 A1 JP WO2021161976A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022500412A
Other languages
Japanese (ja)
Other versions
JPWO2021161976A5 (https=
JP7643738B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021161976A1 publication Critical patent/JPWO2021161976A1/ja
Publication of JPWO2021161976A5 publication Critical patent/JPWO2021161976A5/ja
Application granted granted Critical
Publication of JP7643738B2 publication Critical patent/JP7643738B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/035—DC motors; Unipolar motors
    • H02K41/0352—Unipolar motors
    • H02K41/0354—Lorentz force motors, e.g. voice coil motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Studio Devices (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Structure Of Printed Boards (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
JP2022500412A 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置 Active JP7643738B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020021006 2020-02-10
JP2020021006A JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置
PCT/JP2021/004696 WO2021161976A1 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置

Publications (3)

Publication Number Publication Date
JPWO2021161976A1 true JPWO2021161976A1 (https=) 2021-08-19
JPWO2021161976A5 JPWO2021161976A5 (https=) 2023-12-28
JP7643738B2 JP7643738B2 (ja) 2025-03-11

Family

ID=71450821

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020021006A Pending JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置
JP2022500412A Active JP7643738B2 (ja) 2020-02-10 2021-02-09 フレキシブル配線体、駆動システムおよび撮像装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2020021006A Pending JP2020106845A (ja) 2020-02-10 2020-02-10 フレキシブル配線体、駆動システムおよび撮像装置

Country Status (4)

Country Link
US (1) US20230156911A1 (https=)
JP (2) JP2020106845A (https=)
CN (1) CN115461677A (https=)
WO (1) WO2021161976A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112492165B (zh) * 2020-11-30 2022-03-15 维沃移动通信有限公司 摄像头模组、成像方法和电子设备
US12389704B1 (en) * 2021-01-15 2025-08-12 Apple Inc. Image sensor package for camera with sensor shift actuation
EP4300986A1 (en) * 2022-06-30 2024-01-03 Largan Precision Co. Ltd. Shiftable circuit element, shiftable image sensor module, camera module and electronic device
TWI825866B (zh) * 2022-07-12 2023-12-11 大立光電股份有限公司 相機模組與電子裝置
TWI827505B (zh) * 2022-08-03 2023-12-21 大立光電股份有限公司 可移動式電子感光模組、相機模組及電子裝置
WO2024049100A1 (ko) * 2022-09-02 2024-03-07 엘지이노텍(주) 카메라 장치 및 광학 기기
US12231753B1 (en) * 2022-09-07 2025-02-18 Apple Inc. Flexure arm separator for flexure module of camera with moveable image sensor
WO2025015292A2 (en) * 2023-07-12 2025-01-16 MEMS Drive (Nanjing) Co., Ltd. Electromagnetic mems assembly
DE102023211945A1 (de) * 2023-11-29 2025-06-05 Robert Bosch Gesellschaft mit beschränkter Haftung Mikroelektromechanische Haltevorrichtung, Bildsensorvorrichtung und Verfahren zum Herstellen einer mikroelektromechanischen Haltevorrichtung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203402A (ja) * 2007-02-19 2008-09-04 Konica Minolta Opto Inc センサ装置、および撮像装置
JP2009128521A (ja) * 2007-11-21 2009-06-11 Fujifilm Corp フレキシブル配線板及び撮像装置
JP2012521566A (ja) * 2009-03-18 2012-09-13 バイヤー・マテリアルサイエンス・アーゲー ウエハレベル光学システム
JP2013072967A (ja) * 2011-09-27 2013-04-22 Toshiba Corp 手振れ補正装置及び撮像装置
US20160241785A1 (en) * 2015-02-13 2016-08-18 Ue Technology Co., Ltd. Optical Image Stabilizing Device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4958869B2 (ja) * 2008-09-30 2012-06-20 日本電産コパル株式会社 像振れ補正装置、撮像レンズユニット、及びカメラユニット
JP6199398B2 (ja) * 2013-09-27 2017-09-20 シャープ株式会社 カメラモジュール
CN107615160B (zh) * 2015-05-29 2020-06-16 三美电机株式会社 致动器、摄像机模块及摄像机搭载装置
JP6710775B2 (ja) * 2016-03-11 2020-06-17 アップル インコーポレイテッドＡｐｐｌｅ Ｉｎｃ． 画像センサを移動させるボイスコイルモータを有する光学画像安定化
JP6993567B2 (ja) * 2017-09-29 2022-02-03 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール、およびカメラ搭載装置
US11327276B2 (en) * 2018-01-24 2022-05-10 MEMS Drive (Nanjing) Co., Ltd. MEMS actuation system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203402A (ja) * 2007-02-19 2008-09-04 Konica Minolta Opto Inc センサ装置、および撮像装置
JP2009128521A (ja) * 2007-11-21 2009-06-11 Fujifilm Corp フレキシブル配線板及び撮像装置
JP2012521566A (ja) * 2009-03-18 2012-09-13 バイヤー・マテリアルサイエンス・アーゲー ウエハレベル光学システム
JP2013072967A (ja) * 2011-09-27 2013-04-22 Toshiba Corp 手振れ補正装置及び撮像装置
US20160241785A1 (en) * 2015-02-13 2016-08-18 Ue Technology Co., Ltd. Optical Image Stabilizing Device

Also Published As

Publication number Publication date
JP2020106845A (ja) 2020-07-09
CN115461677A (zh) 2022-12-09
WO2021161976A1 (ja) 2021-08-19
JP7643738B2 (ja) 2025-03-11
US20230156911A1 (en) 2023-05-18

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