JP2020087938A5 - - Google Patents

Download PDF

Info

Publication number
JP2020087938A5
JP2020087938A5 JP2018214108A JP2018214108A JP2020087938A5 JP 2020087938 A5 JP2020087938 A5 JP 2020087938A5 JP 2018214108 A JP2018214108 A JP 2018214108A JP 2018214108 A JP2018214108 A JP 2018214108A JP 2020087938 A5 JP2020087938 A5 JP 2020087938A5
Authority
JP
Japan
Prior art keywords
brittle material
appendix
multilayer substrate
material plate
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018214108A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020087938A (ja
JP7222666B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018214108A priority Critical patent/JP7222666B2/ja
Priority claimed from JP2018214108A external-priority patent/JP7222666B2/ja
Priority to US16/662,440 priority patent/US11152291B2/en
Publication of JP2020087938A publication Critical patent/JP2020087938A/ja
Publication of JP2020087938A5 publication Critical patent/JP2020087938A5/ja
Application granted granted Critical
Publication of JP7222666B2 publication Critical patent/JP7222666B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018214108A 2018-11-14 2018-11-14 多層基板 Active JP7222666B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018214108A JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板
US16/662,440 US11152291B2 (en) 2018-11-14 2019-10-24 Multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018214108A JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板

Publications (3)

Publication Number Publication Date
JP2020087938A JP2020087938A (ja) 2020-06-04
JP2020087938A5 true JP2020087938A5 (enExample) 2021-04-30
JP7222666B2 JP7222666B2 (ja) 2023-02-15

Family

ID=70550829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018214108A Active JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板

Country Status (2)

Country Link
US (1) US11152291B2 (enExample)
JP (1) JP7222666B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12080632B2 (en) 2021-09-29 2024-09-03 Advanced Micro Devices, Inc. Glass core package substrates
US20230207406A1 (en) * 2021-12-24 2023-06-29 Intel Corporation Ultra low loss and high-density routing between cores
US20250254790A1 (en) * 2022-03-30 2025-08-07 Sony Semiconductor Solutions Corporation Glass circuit board and manufacturing method thereof and imaging device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216598A (ja) * 1985-07-15 1987-01-24 富士通株式会社 多層セラミツク回路基板の接続ピン形成方法
JPH02142198A (ja) * 1988-11-22 1990-05-31 Matsushita Electric Works Ltd セラミック多層配線板の製造方法
JP2001267746A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 多層配線基板
WO2011125546A1 (ja) 2010-03-31 2011-10-13 京セラ株式会社 インターポーザー及びそれを用いた電子装置
JPWO2013042750A1 (ja) 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
US20130112459A1 (en) 2011-09-22 2013-05-09 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US20130180769A1 (en) * 2011-09-22 2013-07-18 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
JP2015012013A (ja) * 2013-06-26 2015-01-19 京セラ株式会社 多層配線基板およびそれを備えたプローブカード用基板
JP2017107934A (ja) * 2015-12-08 2017-06-15 富士通株式会社 回路基板、電子機器、及び回路基板の製造方法
JP2018148126A (ja) * 2017-03-08 2018-09-20 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法
JP2019079856A (ja) * 2017-10-20 2019-05-23 トヨタ自動車株式会社 多層基板の製造方法
JP2019140226A (ja) * 2018-02-09 2019-08-22 富士通株式会社 回路基板、回路基板の製造方法及び電子装置

Similar Documents

Publication Publication Date Title
JP2020087938A5 (enExample)
WO2009149951A3 (en) Bullet-resistant transparent laminate composite and protection arrangement having a bullet-resistant transparent laminate composite
JP2017004958A5 (enExample)
TW430831B (en) Multilayer ceramic capacitor
MX391868B (es) Película intermedia para vidrio laminado y vidrio laminado.
JP2015088521A5 (enExample)
JP2015536289A5 (enExample)
RU2017112519A (ru) Система отслаивающегося поверхностного покрытия поверх многосекционной подложки
JP2012009606A5 (enExample)
JP2021506645A5 (enExample)
TWI266396B (en) Semiconductor device
WO2018070801A3 (ko) 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법
MX2016010893A (es) Pelicula de capa intermedia para vidrio laminado, metodo para fabricar pelicula de capa intermedia para vidrio laminado y vidrio laminado.
JP2015114538A5 (enExample)
WO2010045902A8 (de) Latent-reaktiv verklebte tpu/pc-schichtstoffe
JPWO2020217404A5 (enExample)
RU2016102797A (ru) Баллистическая защита с многослойной структурой, включающая в себя множество жестких элементов
DE502006008835D1 (de) Verbundpanzerplatte
JP2020020030A5 (enExample)
JP2005108989A5 (enExample)
JP2017220560A5 (enExample)
KR100921960B1 (ko) 디스플레이용 플라스틱 기판 및 그 제조 방법
WO2009072423A1 (ja) 積層型電子部品
MY168623A (en) Transfer film
EP1675192A3 (en) Piezoelectric/electrostrictive body, piezoelectric/electrostrictive laminate, and piezoelectric/electrostrictive actuator