WO2009072423A1 - 積層型電子部品 - Google Patents

積層型電子部品 Download PDF

Info

Publication number
WO2009072423A1
WO2009072423A1 PCT/JP2008/071421 JP2008071421W WO2009072423A1 WO 2009072423 A1 WO2009072423 A1 WO 2009072423A1 JP 2008071421 W JP2008071421 W JP 2008071421W WO 2009072423 A1 WO2009072423 A1 WO 2009072423A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic material
material layer
layers
partial
electronic component
Prior art date
Application number
PCT/JP2008/071421
Other languages
English (en)
French (fr)
Inventor
Toshio Kawabata
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to KR1020107011089A priority Critical patent/KR101105651B1/ko
Priority to CN2008801189244A priority patent/CN101884076B/zh
Priority to JP2009544640A priority patent/JP4780232B2/ja
Publication of WO2009072423A1 publication Critical patent/WO2009072423A1/ja
Priority to US12/795,441 priority patent/US8207810B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

　異なる材料からなる層同士が接合された積層型電子部品であって、異なる材料からなる層同士の接合部において層間剥離が発生することを抑制できる積層型電子部品を提供する。 　磁性体層（４）は、相対的に高い透磁率を有する材料からなる。磁性体層（５）は、相対的に低い透磁率を有する材料からなる。磁性体層（７ａ，７ｂ）は、磁性体層（４）と磁性体層（５）との間に設けられ、かつ、磁性体層（４）と同じ材料からなる部分磁性体層（４０）及び磁性体層（５）と同じ材料からなる部分磁性体層（５０）により構成されている。部分磁性体層（４０）と部分磁性体層（５０）とは、磁性体層（７ａ，７ｂ）内において隣接するように設けられている。
PCT/JP2008/071421 2007-12-07 2008-11-26 積層型電子部品 WO2009072423A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107011089A KR101105651B1 (ko) 2007-12-07 2008-11-26 적층형 전자 부품
CN2008801189244A CN101884076B (zh) 2007-12-07 2008-11-26 叠层型电子部件
JP2009544640A JP4780232B2 (ja) 2007-12-07 2008-11-26 積層型電子部品
US12/795,441 US8207810B2 (en) 2007-12-07 2010-06-07 Multilayer electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007316997 2007-12-07
JP2007-316997 2007-12-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/795,441 Continuation US8207810B2 (en) 2007-12-07 2010-06-07 Multilayer electronic component

Publications (1)

Publication Number Publication Date
WO2009072423A1 true WO2009072423A1 (ja) 2009-06-11

Family

ID=40717605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071421 WO2009072423A1 (ja) 2007-12-07 2008-11-26 積層型電子部品

Country Status (5)

Country Link
US (1) US8207810B2 (ja)
JP (1) JP4780232B2 (ja)
KR (1) KR101105651B1 (ja)
CN (1) CN101884076B (ja)
WO (1) WO2009072423A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019220862A1 (ja) * 2018-05-18 2019-11-21 株式会社村田製作所 インダクタおよびその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101973410B1 (ko) * 2013-08-14 2019-09-02 삼성전기주식회사 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법
KR101693749B1 (ko) 2015-04-06 2017-01-06 삼성전기주식회사 인덕터 소자 및 그 제조방법
KR101883082B1 (ko) * 2016-12-26 2018-07-27 삼성전기주식회사 파워 증폭기의 임피던스 매칭 회로
JP7092070B2 (ja) * 2019-03-04 2022-06-28 株式会社村田製作所 積層型コイル部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196113A (ja) * 1988-02-01 1989-08-07 Murata Mfg Co Ltd 複合電子部品用焼結体
JPH04284612A (ja) * 1991-03-13 1992-10-09 Tdk Corp 複合積層部品
JPH0982568A (ja) * 1995-09-19 1997-03-28 Murata Mfg Co Ltd セラミック電子部品
JP3251370B2 (ja) * 1992-03-31 2002-01-28 ティーディーケイ株式会社 複合積層部品用非磁性フェライトおよび複合積層部品とその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03251370A (ja) 1990-03-01 1991-11-08 Mitsubishi Materials Corp 超精密研削用ダイヤモンド砥石およびその製造法
JP3114323B2 (ja) * 1992-01-10 2000-12-04 株式会社村田製作所 積層チップコモンモードチョークコイル
US5476728A (en) * 1992-03-31 1995-12-19 Tdk Corporation Composite multilayer parts
JP3243292B2 (ja) 1992-07-16 2002-01-07 ティーディーケイ株式会社 多層セラミック部品用フェライト磁性塗料の製造方法
JP3621300B2 (ja) * 1999-08-03 2005-02-16 太陽誘電株式会社 電源回路用積層インダクタ
JP3460683B2 (ja) * 2000-07-21 2003-10-27 株式会社村田製作所 チップ型電子部品及びその製造方法
JP3818030B2 (ja) * 2000-07-21 2006-09-06 株式会社村田製作所 多層基板の製造方法
JP2002208515A (ja) 2001-01-09 2002-07-26 Murata Mfg Co Ltd 積層型インダクタ
KR100479625B1 (ko) 2002-11-30 2005-03-31 주식회사 쎄라텍 칩타입 파워인덕터 및 그 제조방법
JP2005093971A (ja) * 2003-08-08 2005-04-07 Murata Mfg Co Ltd 積層セラミック電子部品
JP2005123450A (ja) 2003-10-17 2005-05-12 Murata Mfg Co Ltd 積層セラミック電子部品
JP2006093511A (ja) 2004-09-27 2006-04-06 Tdk Corp 多層セラミック基板の製造方法及び多層セラミック基板
JP4475076B2 (ja) 2004-09-27 2010-06-09 Ｔｄｋ株式会社 多層セラミック基板の製造方法
JP4522892B2 (ja) 2005-03-09 2010-08-11 東京エレクトロン株式会社 微細パターン形成方法
US7994889B2 (en) * 2006-06-01 2011-08-09 Taiyo Yuden Co., Ltd. Multilayer inductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196113A (ja) * 1988-02-01 1989-08-07 Murata Mfg Co Ltd 複合電子部品用焼結体
JPH04284612A (ja) * 1991-03-13 1992-10-09 Tdk Corp 複合積層部品
JP3251370B2 (ja) * 1992-03-31 2002-01-28 ティーディーケイ株式会社 複合積層部品用非磁性フェライトおよび複合積層部品とその製造方法
JPH0982568A (ja) * 1995-09-19 1997-03-28 Murata Mfg Co Ltd セラミック電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019220862A1 (ja) * 2018-05-18 2019-11-21 株式会社村田製作所 インダクタおよびその製造方法

Also Published As

Publication number Publication date
KR20100074295A (ko) 2010-07-01
JP4780232B2 (ja) 2011-09-28
CN101884076A (zh) 2010-11-10
US20100245013A1 (en) 2010-09-30
CN101884076B (zh) 2012-09-19
KR101105651B1 (ko) 2012-01-18
US8207810B2 (en) 2012-06-26
JPWO2009072423A1 (ja) 2011-04-21

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