JP2020061469A - 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器 - Google Patents

基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器 Download PDF

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JP2020061469A
JP2020061469A JP2018191930A JP2018191930A JP2020061469A JP 2020061469 A JP2020061469 A JP 2020061469A JP 2018191930 A JP2018191930 A JP 2018191930A JP 2018191930 A JP2018191930 A JP 2018191930A JP 2020061469 A JP2020061469 A JP 2020061469A
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Prior art keywords
substrate
cleaning
cleaning tool
atomic force
force microscope
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JP2018191930A
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Japanese (ja)
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JP2020061469A5 (enExample
Inventor
昇平 嶋
Shohei Shima
昇平 嶋
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Ebara Corp
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Ebara Corp
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Priority to JP2018191930A priority Critical patent/JP2020061469A/ja
Priority to US16/596,051 priority patent/US20200116480A1/en
Priority to CN201910953017.1A priority patent/CN111029243A/zh
Publication of JP2020061469A publication Critical patent/JP2020061469A/ja
Publication of JP2020061469A5 publication Critical patent/JP2020061469A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
    • G01Q10/04—Fine scanning or positioning
    • G01Q10/06—Circuits or algorithms therefor
    • G01Q10/065—Feedback mechanisms, i.e. wherein the signal for driving the probe is modified by a signal coming from the probe itself
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q30/00—Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
    • G01Q30/04—Display or data processing devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Health & Medical Sciences (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018191930A 2018-10-10 2018-10-10 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器 Withdrawn JP2020061469A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018191930A JP2020061469A (ja) 2018-10-10 2018-10-10 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器
US16/596,051 US20200116480A1 (en) 2018-10-10 2019-10-08 Substrate cleaning method, substrate cleaning apparatus, substrate processing apparatus, substrate processing system, machine learning device, and prediction device
CN201910953017.1A CN111029243A (zh) 2018-10-10 2019-10-09 基板清洗方法、基板清洗装置、基板处理装置、基板处理系统及机器学习器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018191930A JP2020061469A (ja) 2018-10-10 2018-10-10 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器

Publications (2)

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JP2020061469A true JP2020061469A (ja) 2020-04-16
JP2020061469A5 JP2020061469A5 (enExample) 2021-05-06

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JP2018191930A Withdrawn JP2020061469A (ja) 2018-10-10 2018-10-10 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器

Country Status (3)

Country Link
US (1) US20200116480A1 (enExample)
JP (1) JP2020061469A (enExample)
CN (1) CN111029243A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021180274A (ja) * 2020-05-14 2021-11-18 アルバック成膜株式会社 洗浄体、洗浄装置および洗浄方法
WO2022131228A1 (ja) * 2020-12-16 2022-06-23 株式会社荏原製作所 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
WO2023149161A1 (ja) * 2022-02-04 2023-08-10 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2023189170A1 (ja) * 2022-03-30 2023-10-05 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2024135150A1 (ja) * 2022-12-22 2024-06-27 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2025100343A1 (ja) * 2023-11-06 2025-05-15 東京エレクトロン株式会社 情報処理方法、情報処理装置及びコンピュータプログラム
WO2025177658A1 (ja) * 2024-02-20 2025-08-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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* Cited by examiner, † Cited by third party
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CN114659456B (zh) * 2020-12-23 2024-06-18 中国科学院微电子研究所 一种软刷辊轴间距检测装置、调整系统及方法
CN112992733B (zh) * 2021-02-08 2022-03-11 江苏亚电科技有限公司 一种用于晶圆加工的刷洗装置
JP2024034806A (ja) * 2022-09-01 2024-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及びブラシの脱落検知方法
CN118427784B (zh) * 2024-07-02 2024-10-25 深圳市林科超声波洗净设备有限公司 一种超声波清洗机运行多维度监测预警方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021180274A (ja) * 2020-05-14 2021-11-18 アルバック成膜株式会社 洗浄体、洗浄装置および洗浄方法
US12358028B2 (en) 2020-12-16 2025-07-15 Ebara Corporation Cleaning apparatus for cleaning member, cleaning method for cleaning member, and substrate cleaning method
WO2022131228A1 (ja) * 2020-12-16 2022-06-23 株式会社荏原製作所 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
JP2022095360A (ja) * 2020-12-16 2022-06-28 株式会社荏原製作所 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
JP7482768B2 (ja) 2020-12-16 2024-05-14 株式会社荏原製作所 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
WO2023149161A1 (ja) * 2022-02-04 2023-08-10 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2023114126A (ja) * 2022-02-04 2023-08-17 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7753124B2 (ja) 2022-02-04 2025-10-14 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2023148615A (ja) * 2022-03-30 2023-10-13 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2023189170A1 (ja) * 2022-03-30 2023-10-05 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7763140B2 (ja) 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2024135150A1 (ja) * 2022-12-22 2024-06-27 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2025100343A1 (ja) * 2023-11-06 2025-05-15 東京エレクトロン株式会社 情報処理方法、情報処理装置及びコンピュータプログラム
WO2025177658A1 (ja) * 2024-02-20 2025-08-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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