JP2020007575A5 - - Google Patents

Download PDF

Info

Publication number
JP2020007575A5
JP2020007575A5 JP2018126321A JP2018126321A JP2020007575A5 JP 2020007575 A5 JP2020007575 A5 JP 2020007575A5 JP 2018126321 A JP2018126321 A JP 2018126321A JP 2018126321 A JP2018126321 A JP 2018126321A JP 2020007575 A5 JP2020007575 A5 JP 2020007575A5
Authority
JP
Japan
Prior art keywords
axis
base material
film forming
cathode
forming apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018126321A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020007575A (ja
JP7171270B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018126321A priority Critical patent/JP7171270B2/ja
Priority claimed from JP2018126321A external-priority patent/JP7171270B2/ja
Priority to US16/453,730 priority patent/US11414746B2/en
Priority to CN201910599227.5A priority patent/CN110735122B/zh
Publication of JP2020007575A publication Critical patent/JP2020007575A/ja
Publication of JP2020007575A5 publication Critical patent/JP2020007575A5/ja
Application granted granted Critical
Publication of JP7171270B2 publication Critical patent/JP7171270B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018126321A 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法 Active JP7171270B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018126321A JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法
US16/453,730 US11414746B2 (en) 2018-07-02 2019-06-26 Film forming apparatus and film forming method using the same
CN201910599227.5A CN110735122B (zh) 2018-07-02 2019-07-02 成膜设备和使用该成膜设备的成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018126321A JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法

Publications (3)

Publication Number Publication Date
JP2020007575A JP2020007575A (ja) 2020-01-16
JP2020007575A5 true JP2020007575A5 (enExample) 2021-08-05
JP7171270B2 JP7171270B2 (ja) 2022-11-15

Family

ID=69007942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018126321A Active JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法

Country Status (3)

Country Link
US (1) US11414746B2 (enExample)
JP (1) JP7171270B2 (enExample)
CN (1) CN110735122B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020112986A1 (de) 2020-05-13 2021-11-18 VON ARDENNE Asset GmbH & Co. KG Magnetronanordnung
WO2022069050A1 (en) * 2020-10-01 2022-04-07 Applied Materials, Inc. Method of depositing a material on a substrate
KR102828506B1 (ko) * 2020-10-08 2025-07-03 가부시키가이샤 알박 회전식 캐소드 유닛용 구동 블록
CN112251727B (zh) * 2020-10-22 2022-08-26 凯盛信息显示材料(黄山)有限公司 磁控溅射镀膜设备及ito玻璃的制备方法
EP4270444A1 (en) * 2022-04-27 2023-11-01 Bühler Alzenau GmbH Magnetron sputtering system with tubular sputter cathode and method for controlling a layer thickness

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
JPH0835064A (ja) * 1994-07-20 1996-02-06 Matsushita Electric Ind Co Ltd スパッタリング装置
JP2002220664A (ja) 2000-11-24 2002-08-09 Murata Mfg Co Ltd スパッタ粒子の放出角度分布計測方法、膜厚分布シミュレーション方法及びスパッタ装置
DE10145201C1 (de) 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
CN2656432Y (zh) 2003-09-11 2004-11-17 深圳豪威真空光电子股份有限公司 旋转式磁控溅射靶
JP2005133110A (ja) 2003-10-28 2005-05-26 Konica Minolta Opto Inc スパッタリング装置
ATE459092T1 (de) * 2004-05-05 2010-03-15 Applied Materials Gmbh & Co Kg Beschichtungsvorrichtung mit grossflächiger anordnung von drehbaren magnetronkathoden
US9175383B2 (en) * 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
US8057649B2 (en) 2008-05-06 2011-11-15 Applied Materials, Inc. Microwave rotatable sputtering deposition
US20120164051A1 (en) 2009-05-07 2012-06-28 Stefan Bruns Method for the production of oxide and nitride coatings and its use
EP2855729B1 (en) 2012-05-29 2019-05-08 Applied Materials, Inc. Method for coating a substrate and coater
KR20150023263A (ko) * 2012-05-31 2015-03-05 도쿄엘렉트론가부시키가이샤 마그네트론 스퍼터 장치
JP5921351B2 (ja) 2012-06-14 2016-05-24 キヤノン株式会社 成膜装置
CN107250427A (zh) 2015-02-24 2017-10-13 株式会社爱发科 磁控管溅射装置用旋转式阴极单元
CN104878356B (zh) 2015-06-08 2017-11-24 光驰科技(上海)有限公司 一种磁控溅射靶材磁铁放置角度的确定方法
US20180312964A1 (en) 2015-06-16 2018-11-01 Schneider Gmbh & Co. Kg Device, method and use for the coating of lenses
CN108884556B (zh) 2016-04-21 2020-11-03 应用材料公司 用于涂布基板的方法及涂布机

Similar Documents

Publication Publication Date Title
JP2020007575A5 (enExample)
JP6611666B2 (ja) 載置台システム、基板処理装置及び温度制御方法
JP6258883B2 (ja) スパッタされた材料の層を形成するシステムおよび方法
JP2013504159A5 (enExample)
JP2006500766A5 (enExample)
JP2014090168A5 (enExample)
MX385877B (es) Dispositivo de procesamiento de disparo y proyector.
JP6778275B2 (ja) 基板のコーティング方法および基板のコーティング装置
CN105112880A (zh) 镜片镀膜方法
JP2018534903A5 (enExample)
CN102576642A (zh) 纳米粒子的产生
CN102789938A (zh) 一种磁控管、磁控管的制造方法及物理沉积室
JP6357669B2 (ja) 蒸着装置及び蒸着装置用光学基板保持部材
WO2018218978A1 (zh) 3d打印产品的uv固化装置
CN101031989A (zh) 用于制造磁控管涂覆的衬底的方法以及磁控管溅射源
KR102669903B1 (ko) 기판 처리 장치
JP2020527240A5 (enExample)
CN100552246C (zh) 轴承单元的制造方法以及其上装载有该轴承单元的电机
CN105200387A (zh) 加热控制装置及物理气相沉积设备
CN103014617A (zh) 薄膜形成装置
CN112041478B (zh) 成膜装置以及成膜方法
CN112323037A (zh) 镀膜真空室工件旋转装置
CN110423993A (zh) 一种镀膜治具
CN205077133U (zh) 用于镜片镀膜的回转架
JP2018515930A5 (enExample)