JP2014090168A5 - - Google Patents

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Publication number
JP2014090168A5
JP2014090168A5 JP2013213420A JP2013213420A JP2014090168A5 JP 2014090168 A5 JP2014090168 A5 JP 2014090168A5 JP 2013213420 A JP2013213420 A JP 2013213420A JP 2013213420 A JP2013213420 A JP 2013213420A JP 2014090168 A5 JP2014090168 A5 JP 2014090168A5
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JP
Japan
Prior art keywords
heating
radiating portion
shaped
arc
infrared lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013213420A
Other languages
English (en)
Japanese (ja)
Other versions
JP6351948B2 (ja
JP2014090168A (ja
Filing date
Publication date
Priority claimed from US13/650,916 external-priority patent/US9093482B2/en
Priority claimed from US13/932,926 external-priority patent/US9748120B2/en
Application filed filed Critical
Publication of JP2014090168A publication Critical patent/JP2014090168A/ja
Publication of JP2014090168A5 publication Critical patent/JP2014090168A5/ja
Application granted granted Critical
Publication of JP6351948B2 publication Critical patent/JP6351948B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013213420A 2012-10-12 2013-10-11 円板状物品の液体処理装置およびかかる装置で用いる加熱システム Active JP6351948B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/650,916 US9093482B2 (en) 2012-10-12 2012-10-12 Method and apparatus for liquid treatment of wafer shaped articles
US13/650,916 2012-10-12
US13/932,926 2013-07-01
US13/932,926 US9748120B2 (en) 2013-07-01 2013-07-01 Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Publications (3)

Publication Number Publication Date
JP2014090168A JP2014090168A (ja) 2014-05-15
JP2014090168A5 true JP2014090168A5 (enExample) 2016-11-24
JP6351948B2 JP6351948B2 (ja) 2018-07-04

Family

ID=50654094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013213420A Active JP6351948B2 (ja) 2012-10-12 2013-10-11 円板状物品の液体処理装置およびかかる装置で用いる加熱システム

Country Status (3)

Country Link
JP (1) JP6351948B2 (enExample)
KR (2) KR20140047564A (enExample)
TW (1) TWI602253B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101681183B1 (ko) * 2014-07-11 2016-12-02 세메스 주식회사 기판 처리 장치
KR102069078B1 (ko) * 2014-08-27 2020-01-23 주식회사 제우스 기판 처리장치
WO2016056748A1 (ko) * 2014-10-10 2016-04-14 주식회사 제우스 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치
KR102082151B1 (ko) * 2014-10-10 2020-02-27 주식회사 제우스 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치
KR102123563B1 (ko) * 2014-10-20 2020-06-16 주식회사 제우스 기판지지장치 및 이를 구비한 기판 액처리 장치
JP6658195B2 (ja) * 2016-03-28 2020-03-04 大日本印刷株式会社 エッチング方法およびエッチング装置
JP6837481B2 (ja) * 2016-05-26 2021-03-03 三益半導体工業株式会社 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置
US10720343B2 (en) * 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
CN113168123A (zh) * 2018-12-21 2021-07-23 Asml控股股份有限公司 掩模版子场热控制
KR102263006B1 (ko) 2019-07-18 2021-06-10 세메스 주식회사 기판 처리 장치
KR102407266B1 (ko) 2019-10-02 2022-06-13 세메스 주식회사 지지 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
FR3103629B1 (fr) * 2019-11-25 2021-10-22 Soitec Silicon On Insulator Procédé de collage de deux substrats
CN111403316A (zh) * 2020-03-18 2020-07-10 沈阳拓荆科技有限公司 一种提高硅片温度均匀性的加热系统
KR102564838B1 (ko) 2020-07-24 2023-08-10 세메스 주식회사 지지 유닛, 이를 포함하는 기판 처리 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164555A (ja) * 1998-11-30 2000-06-16 Ebara Corp 基板乾燥装置及び方法
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
US6550988B2 (en) * 2000-10-30 2003-04-22 Dainippon Screen Mfg., Co., Ltd. Substrate processing apparatus
JP2005032933A (ja) * 2003-07-10 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置
JP4548735B2 (ja) * 2006-11-14 2010-09-22 東京エレクトロン株式会社 基板処理システム
JP4428717B2 (ja) * 2006-11-14 2010-03-10 東京エレクトロン株式会社 基板処理方法及び基板処理システム

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