JP2019537263A5 - - Google Patents
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- Publication number
- JP2019537263A5 JP2019537263A5 JP2019524901A JP2019524901A JP2019537263A5 JP 2019537263 A5 JP2019537263 A5 JP 2019537263A5 JP 2019524901 A JP2019524901 A JP 2019524901A JP 2019524901 A JP2019524901 A JP 2019524901A JP 2019537263 A5 JP2019537263 A5 JP 2019537263A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- edge profile
- line segment
- vertical line
- wafer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 8
- 238000006073 displacement reaction Methods 0.000 claims 6
- 238000003384 imaging method Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 3
- 230000000694 effects Effects 0.000 claims 2
- 238000000605 extraction Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662427373P | 2016-11-29 | 2016-11-29 | |
| US62/427,373 | 2016-11-29 | ||
| US15/627,834 | 2017-06-20 | ||
| US15/627,834 US10540759B2 (en) | 2016-11-29 | 2017-06-20 | Bonded wafer metrology |
| PCT/US2017/063310 WO2018102260A1 (en) | 2016-11-29 | 2017-11-27 | Bonded wafer metrology |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019537263A JP2019537263A (ja) | 2019-12-19 |
| JP2019537263A5 true JP2019537263A5 (enExample) | 2021-01-14 |
| JP6916877B2 JP6916877B2 (ja) | 2021-08-11 |
Family
ID=62190293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019524901A Active JP6916877B2 (ja) | 2016-11-29 | 2017-11-27 | 貼り合わせウエハの計測 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10540759B2 (enExample) |
| EP (1) | EP3507826B1 (enExample) |
| JP (1) | JP6916877B2 (enExample) |
| KR (1) | KR102301552B1 (enExample) |
| CN (1) | CN109964307B (enExample) |
| TW (1) | TWI731197B (enExample) |
| WO (1) | WO2018102260A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488751B (zh) * | 2018-08-29 | 2022-08-19 | 中山大学 | 一种自动化工艺线的石墨料盘视觉定位系统 |
| KR102840203B1 (ko) | 2020-09-01 | 2025-08-01 | 삼성전자주식회사 | 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비 |
| JP7682654B2 (ja) * | 2021-03-11 | 2025-05-26 | 株式会社岡本工作機械製作所 | 半導体装置の製造方法及び製造装置 |
| IL304714B2 (en) * | 2021-04-19 | 2025-03-01 | Kla Corp | Edge profile inspection for delamination defects |
| US12131454B2 (en) * | 2021-09-15 | 2024-10-29 | Onto Innovation, Inc. | Substrate mapping using deep neural-networks |
| CN115661143B (zh) * | 2022-12-14 | 2023-05-30 | 惠州威尔高电子有限公司 | 用于MiniLED晶圆缺陷的快速检测系统 |
| JP2024130368A (ja) | 2023-03-14 | 2024-09-30 | 株式会社コベルコ科研 | 貼合せ基板の位置ずれ量測定装置および該方法ならびに半導体製造装置 |
| CN116313971B (zh) * | 2023-05-17 | 2023-10-20 | 拓荆键科(海宁)半导体设备有限公司 | 通过边缘检测来进行晶圆键合对准的方法 |
| US20250086780A1 (en) * | 2023-09-12 | 2025-03-13 | Kla Corporation | Concentricity offset measurement for hybrid bonding |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0979398B1 (en) * | 1996-06-04 | 2012-01-04 | KLA-Tencor Corporation | Optical scanning system for surface inspection |
| US6901171B1 (en) | 1999-04-30 | 2005-05-31 | Cognex Technology And Investment Corporation | Methods and apparatuses for refining groupings of edge points that represent a contour in an image |
| JP2002050749A (ja) * | 2000-07-31 | 2002-02-15 | Canon Inc | 複合部材の分離方法及び装置 |
| JP4533563B2 (ja) * | 2001-07-13 | 2010-09-01 | 株式会社東芝 | パターン評価方法，位置合わせ方法、検査装置の検査方法，半導体製造工程の管理方法 |
| JP3629244B2 (ja) | 2002-02-19 | 2005-03-16 | 本多エレクトロン株式会社 | ウエーハ用検査装置 |
| JP2007501942A (ja) | 2003-05-19 | 2007-02-01 | マイクロ−エプシロン・メステヒニク・ゲーエムベーハー・ウント・コンパニー・カー・ゲー | 好適に円形エッジを有する物体の品質を光学的に制御する光学的試験方法及び光学的試験装置 |
| US7340087B2 (en) | 2003-07-14 | 2008-03-04 | Rudolph Technologies, Inc. | Edge inspection |
| JP4500157B2 (ja) | 2004-11-24 | 2010-07-14 | 株式会社神戸製鋼所 | 形状計測装置用光学系 |
| JP4585926B2 (ja) | 2005-06-17 | 2010-11-24 | 株式会社日立ハイテクノロジーズ | パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム |
| US7616804B2 (en) | 2006-07-11 | 2009-11-10 | Rudolph Technologies, Inc. | Wafer edge inspection and metrology |
| JP4262285B2 (ja) | 2007-07-18 | 2009-05-13 | 株式会社コベルコ科研 | 形状測定装置，形状測定方法 |
| DE102007042271B3 (de) * | 2007-09-06 | 2009-02-05 | Vistec Semiconductor Systems Gmbh | Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts |
| US20090142916A1 (en) | 2007-11-29 | 2009-06-04 | Qimonda Ag | Apparatus and method of manufacturing an integrated circuit |
| JP5409080B2 (ja) * | 2009-03-31 | 2014-02-05 | アズビル株式会社 | 円盤状部材の中心位置推定方法及び画像処理装置 |
| FR2955654B1 (fr) | 2010-01-25 | 2012-03-30 | Soitec Silicon Insulator Technologies | Systeme et procede d'evaluation de deformations inhomogenes dans des plaques multicouches |
| TWI532116B (zh) * | 2010-04-11 | 2016-05-01 | 肯提克有限公司 | 晶圓對齊方法及系統 |
| US8629902B2 (en) | 2010-10-12 | 2014-01-14 | Kla-Tencor Corporation | Coordinate fusion and thickness calibration for semiconductor wafer edge inspection |
| US8525973B2 (en) * | 2010-10-13 | 2013-09-03 | Eulitha A.G. | Method and apparatus for printing periodic patterns |
| EP2463892B1 (de) * | 2010-12-13 | 2013-04-03 | EV Group E. Thallner GmbH | Einrichtung, Vorrichtung und Verfahren zur Ermittlung von Ausrichtungsfehlern |
| JP2013093389A (ja) | 2011-10-24 | 2013-05-16 | Hitachi High-Technologies Corp | 光学式検査装置及びエッジ検査装置 |
| JP5836223B2 (ja) * | 2011-12-02 | 2015-12-24 | 株式会社神戸製鋼所 | 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法 |
| US9646896B2 (en) | 2013-07-12 | 2017-05-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithographic overlay sampling |
| US9734568B2 (en) * | 2014-02-25 | 2017-08-15 | Kla-Tencor Corporation | Automated inline inspection and metrology using shadow-gram images |
| US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
| US9719943B2 (en) | 2014-09-30 | 2017-08-01 | Kla-Tencor Corporation | Wafer edge inspection with trajectory following edge profile |
| KR101987726B1 (ko) | 2015-03-20 | 2019-06-11 | 가부시키가이샤 히다치 하이테크놀로지즈 | 전자선식 패턴 검사 장치 |
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2017
- 2017-06-20 US US15/627,834 patent/US10540759B2/en active Active
- 2017-11-27 JP JP2019524901A patent/JP6916877B2/ja active Active
- 2017-11-27 CN CN201780070558.9A patent/CN109964307B/zh active Active
- 2017-11-27 EP EP17876339.7A patent/EP3507826B1/en active Active
- 2017-11-27 KR KR1020197017836A patent/KR102301552B1/ko active Active
- 2017-11-27 WO PCT/US2017/063310 patent/WO2018102260A1/en not_active Ceased
- 2017-11-28 TW TW106141279A patent/TWI731197B/zh active