JP2019536199A5 - - Google Patents

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Publication number
JP2019536199A5
JP2019536199A5 JP2019520537A JP2019520537A JP2019536199A5 JP 2019536199 A5 JP2019536199 A5 JP 2019536199A5 JP 2019520537 A JP2019520537 A JP 2019520537A JP 2019520537 A JP2019520537 A JP 2019520537A JP 2019536199 A5 JP2019536199 A5 JP 2019536199A5
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JP
Japan
Prior art keywords
layer
pulse
photoheat
bottom substrate
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2019520537A
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English (en)
Japanese (ja)
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JP2019536199A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/056880 external-priority patent/WO2018075449A1/en
Publication of JP2019536199A publication Critical patent/JP2019536199A/ja
Publication of JP2019536199A5 publication Critical patent/JP2019536199A5/ja
Abandoned legal-status Critical Current

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JP2019520537A 2016-10-17 2017-10-17 有機発光ダイオード用の光抽出基板を製造する方法およびそれを備えた製品 Abandoned JP2019536199A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662409070P 2016-10-17 2016-10-17
US62/409,070 2016-10-17
PCT/US2017/056880 WO2018075449A1 (en) 2016-10-17 2017-10-17 Processes for making light extraction substrates for an organic light emitting diode and products including the same

Publications (2)

Publication Number Publication Date
JP2019536199A JP2019536199A (ja) 2019-12-12
JP2019536199A5 true JP2019536199A5 (https=) 2020-11-26

Family

ID=60201682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019520537A Abandoned JP2019536199A (ja) 2016-10-17 2017-10-17 有機発光ダイオード用の光抽出基板を製造する方法およびそれを備えた製品

Country Status (7)

Country Link
US (2) US10367169B2 (https=)
EP (1) EP3526826A1 (https=)
JP (1) JP2019536199A (https=)
KR (1) KR102434981B1 (https=)
CN (1) CN109863615A (https=)
TW (1) TW201821255A (https=)
WO (1) WO2018075449A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112368847A (zh) * 2018-06-21 2021-02-12 康宁公司 通过近红外光辐射固化的内部光提取层
CN111162191B (zh) * 2019-03-18 2022-03-29 广东聚华印刷显示技术有限公司 封装结构、显示面板及其制备方法
CN112652240A (zh) * 2019-10-11 2021-04-13 群创光电股份有限公司 可挠性显示装置及可挠性显示装置的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2944145B1 (fr) * 2009-04-02 2011-08-26 Saint Gobain Procede de fabrication d'une structure a surface texturee pour dispositif a diode electroluminescente organique et structure a surface texturee
US9583678B2 (en) * 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
EP2518789B1 (en) * 2011-04-18 2016-04-13 Corning Precision Materials Co., Ltd. Method of manufacturing a light extraction substrate for an electroluminescent device
US8827532B2 (en) * 2011-04-22 2014-09-09 3M Innovative Properties Company Light guides
KR101359663B1 (ko) 2011-05-19 2014-02-07 한양대학교 산학협력단 극단파 백색광 조사법을 이용한 반도체 산화물의 광소결 방법
SG11201400107UA (en) * 2011-08-16 2014-04-28 Xenon Corp Sintering process and apparatus
KR20130052825A (ko) * 2011-11-14 2013-05-23 삼성전자주식회사 반도체 발광소자
JP5897437B2 (ja) 2012-09-14 2016-03-30 富士フイルム株式会社 導電層の製造方法、プリント配線基板
NL1039815C2 (en) 2012-09-21 2014-03-24 Stichting Dutch Polymer Inst Atmospheric plasma sintering.
US9711744B2 (en) * 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US9310685B2 (en) 2013-05-13 2016-04-12 Nokia Technologies Oy Method and apparatus for the formation of conductive films on a substrate
TW201527013A (zh) 2013-12-20 2015-07-16 Xenon Corp 用於連續閃光燈燒結的系統和方法
CN106103084A (zh) 2014-03-19 2016-11-09 富士胶片株式会社 功能性层叠膜、功能性层叠膜的制造方法、及包含功能性层叠膜的有机电致发光装置
TW201539736A (zh) * 2014-03-19 2015-10-16 ３Ｍ新設資產公司 用於藉白光成色之 oled 裝置的奈米結構
KR101751589B1 (ko) 2014-09-22 2017-06-27 한국에너지기술연구원 상이한 촉매가 코팅된 플레이트를 포함한 열교환형 반응기
KR101579457B1 (ko) * 2014-12-22 2015-12-22 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 제조방법, 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR101642120B1 (ko) * 2014-12-24 2016-07-22 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 제조방법, 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR101632614B1 (ko) * 2014-12-24 2016-06-22 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 제조방법, 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR101999294B1 (ko) 2016-03-23 2019-07-15 코닝 인코포레이티드 유기발광소자용 광추출 기판, 그 제조방법 및 이를 포함하는 유기발광소자

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