JP2019527282A5 - - Google Patents

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Publication number
JP2019527282A5
JP2019527282A5 JP2019503970A JP2019503970A JP2019527282A5 JP 2019527282 A5 JP2019527282 A5 JP 2019527282A5 JP 2019503970 A JP2019503970 A JP 2019503970A JP 2019503970 A JP2019503970 A JP 2019503970A JP 2019527282 A5 JP2019527282 A5 JP 2019527282A5
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
curable adhesive
precursor composition
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2019503970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019527282A (ja
Filing date
Publication date
Priority claimed from EP16181797.8A external-priority patent/EP3275913B1/en
Application filed filed Critical
Publication of JP2019527282A publication Critical patent/JP2019527282A/ja
Publication of JP2019527282A5 publication Critical patent/JP2019527282A5/ja
Ceased legal-status Critical Current

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JP2019503970A 2016-07-28 2017-07-25 高性能エポキシ接着剤組成物 Ceased JP2019527282A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16181797.8 2016-07-28
EP16181797.8A EP3275913B1 (en) 2016-07-28 2016-07-28 High performance epoxy adhesive compositions
PCT/US2017/043622 WO2018022555A1 (en) 2016-07-28 2017-07-25 High performance epoxy adhesive compositions

Publications (2)

Publication Number Publication Date
JP2019527282A JP2019527282A (ja) 2019-09-26
JP2019527282A5 true JP2019527282A5 (https=) 2020-09-03

Family

ID=56557555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019503970A Ceased JP2019527282A (ja) 2016-07-28 2017-07-25 高性能エポキシ接着剤組成物

Country Status (8)

Country Link
US (1) US20190382634A1 (https=)
EP (1) EP3275913B1 (https=)
JP (1) JP2019527282A (https=)
KR (1) KR20190033586A (https=)
CN (1) CN109476826A (https=)
BR (1) BR112019001649A2 (https=)
CA (1) CA3031773A1 (https=)
WO (1) WO2018022555A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109536102A (zh) * 2018-12-06 2019-03-29 中国建材检验认证集团厦门宏业有限公司 一种高密度水下环氧修补胶及其制备方法和用途
EP3719088B1 (en) * 2019-04-02 2024-09-04 3M Innovative Properties Company Curable precursor of a structural adhesive composition
EP3719089B1 (en) * 2019-04-02 2024-07-31 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
JP6651045B1 (ja) * 2019-09-30 2020-02-19 アイカ工業株式会社 エポキシ樹脂組成物
EP4051744A1 (en) 2019-11-01 2022-09-07 Cytec Industries Inc. Primer composition for adhesive bonding and method of using the same
US12486437B2 (en) 2019-12-19 2025-12-02 3M Innovative Properties Company Shimming adhesive
EP3882294A1 (de) * 2020-03-18 2021-09-22 Hilti Aktiengesellschaft Härterzusammensetzung auf basis von diaminomethylcyclohexan und 1,3-cyclo-hexan-bis(methylamin) für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem
US11958938B2 (en) 2020-04-28 2024-04-16 3M Innovative Properties Company Curable composition
US20230250222A1 (en) * 2020-07-02 2023-08-10 Socpra Sciences Et Génie S.E.C. Catalysts for crosslinking epoxy resins
WO2022118581A1 (ja) * 2020-12-04 2022-06-09 三菱瓦斯化学株式会社 成形体の製造方法、樹脂含浸装置、及び3dプリンタ
EP4015559B1 (en) * 2020-12-21 2023-07-19 3M Innovative Properties Company Structural adhesive having superior compression properties
CN113372535A (zh) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 一种改性环氧树脂固化剂的制备方法及使用方法
CN113403013B (zh) * 2021-06-30 2022-09-02 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
KR102636434B1 (ko) * 2021-09-29 2024-02-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
CN114835882A (zh) * 2022-04-25 2022-08-02 四川星利石大涂装材料有限公司 一种低温固化环氧潜伏型固化剂的制备方法与应用
KR102754954B1 (ko) * 2022-10-14 2025-01-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
CN115746259B (zh) * 2022-11-14 2025-03-28 北京高盟新材料股份有限公司 一种低热膨胀系数透明光固化改性树脂及制备方法
EP4442727A1 (en) * 2023-04-06 2024-10-09 3M Innovative Properties Company Epoxy resin compositions comprising a lewis acid

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69111576T2 (de) * 1990-11-29 1996-02-01 Ciba Geigy Ag Hochleistungsepoxydharzklebstoff.
JP2002265922A (ja) * 2001-03-08 2002-09-18 Konishi Co Ltd 自動車ガラス用接着剤
JP2003238929A (ja) * 2002-02-15 2003-08-27 Mitsubishi Electric Corp エポキシ系接着剤及びそれを用いた飛翔体用レドーム
JP4639766B2 (ja) * 2004-11-16 2011-02-23 横浜ゴム株式会社 二液型常温硬化性エポキシ樹脂組成物および金属接着剤組成物
EP2028207A1 (en) * 2007-08-14 2009-02-25 Swancor Industrial Co., Ltd. Resin composition for composite material parts
EP2181156A1 (en) * 2007-08-17 2010-05-05 Dow Global Technologies Inc. Two part crash durable epoxy adhesives
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
CN101818037B (zh) 2009-02-27 2014-12-31 汉高(中国)投资有限公司 一种室温固化环氧结构胶粘剂组合物及其制备方法
WO2011031399A1 (en) * 2009-09-11 2011-03-17 3M Innovative Properties Company Curable and cured adhesive compositions
JP5478472B2 (ja) * 2010-12-07 2014-04-23 日本発條株式会社 ブッシュ・ブラケット一体スタビライザーバー
BR112017018406A2 (pt) * 2015-02-27 2018-04-17 3M Innovative Properties Co adesivo estrutural em duas partes
CN105567145B (zh) * 2016-03-15 2020-03-06 南京诺邦新材料有限公司 双组份结构胶及其制备方法

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