JP2019525468A - マイクロメカニカル及び半導体処理におけるワークピースキャリアの積層された上部プレート - Google Patents
マイクロメカニカル及び半導体処理におけるワークピースキャリアの積層された上部プレート Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 238000012545 processing Methods 0.000 title abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000005245 sintering Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 57
- 238000004049 embossing Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 4
- 238000003892 spreading Methods 0.000 claims 4
- 238000005553 drilling Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 29
- 239000007789 gas Substances 0.000 description 19
- 239000012530 fluid Substances 0.000 description 14
- 238000001816 cooling Methods 0.000 description 13
- 239000013529 heat transfer fluid Substances 0.000 description 11
- 239000003570 air Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 239000012080 ambient air Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
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- 210000002304 esc Anatomy 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
[0001]本出願は、2016年7月20日出願のKadthala R. Narendrnathによる「LAMINATED TOP PLATE OF A WORKPIECE CARRIER IN MECHANICAL AND SEMICONDUCTOR PROCESSING」と題する米国仮特許出願第62/364,590号からの優先権を主張するものである。
これにより、エンボス加工の後に型を取り除くことがより簡単になる。さらに、これにより、上部より底部でより狭いテーパ側面を有するチャネル236が生じる結果となる。テーパされたチャネルは、底部にエアポケットを残すことなく、より容易に供給器で充填される。
Claims (20)
- ワークピースキャリア上部プレートを製造する方法であって、
複数のセラミックシートのうちの少なくとも1つの上に導電性ペーストを供給することと、
前記複数のセラミックシート間に前記ペーストを埋め込むことと、
前記ペーストと共にセラミックシートを圧縮することと、
前記ペーストを焼結することと
を含む方法。 - 前記ペーストを焼結することが、前記セラミックシートを焼結することをさらに含む、請求項1に記載の方法。
- 前記導電性ペーストが供給される前に、前記セラミックシートをエンボス加工することをさらに含む、請求項1に記載の方法。
- 前記ペーストを供給することが、前記ペーストを広げて、次いで、スキージで前記ペーストを取り除くことを含む、請求項1に記載の方法。
- ステンシルをセラミックシートのうちの選択したものの上に当てることをさらに含み、広げることは、前記ステンシルを通して前記ペーストを選択された前記セラミックシート上に広げることを含む、請求項4に記載の方法。
- 前記ペーストが線として前記選択されたセラミックシートに供給されるように、前記ステンシルが、線パターンの開口を画定する、請求項5に記載の方法。
- 前記セラミックシートを通して穿孔することをさらに含む、請求項1に記載の方法。
- 半導体基板を運ぶためのワークピースキャリア上部プレートであって、
共に圧縮された複数のセラミックシート、
前記セラミックシート上に供給され、前記セラミックシート間に埋め込まれた、焼結された導電性ペースト、及び
前記導電性ペーストに電流を印加するために前記導電性ペーストに連結された電気端子
を備えている、ワークピースキャリア上部プレート。 - 前記セラミックシートが焼結される、請求項8に記載のキャリア。
- 前記導電性ペーストが供給される前に、前記セラミックシートがエンボス加工される、請求項8に記載のキャリア。
- 前記ペーストが供給されることは、広げられ、次いで、スキージで取り除かれることにより行われる、請求項8に記載のキャリア。
- 前記セラミックシートが、穿孔された貫通孔を有する、請求項8に記載のキャリア。
- 前記ペーストが、電極の形態をとり、前記電気端子が、前記電極への帯電を可能にする、請求項8に記載のキャリア。
- 前記ペーストが、抵抗ヒータの形態をとり、前記電気端子が、電流の印加を可能にして、前記ヒータを加熱する、請求項8に記載のキャリア。
- ワークピースキャリアのための上部プレートを形成する方法であって、
一定のパターンのウェルをセラミックシート内にエンボス加工することと、
前記セラミックシートの前記ウェル内に導電性ペーストを供給することと、
前記ペーストを乾燥させることと、
前記セラミックシートを複数の他のセラミックシートと共に圧縮し、前記上部プレートを形成することと
を含む方法。 - エンボス加工することが、前記セラミックシート内に型押しすること、又は、逆に、セラミックシートを前記型の中に押し込めることを含む、請求項15に記載の方法。
- エンボス加工することが、前記セラミックシートを通してピンを押し込め、孔を形成することを含む、請求項15に記載の方法。
- エンボス加工することが、電気部分のための凹部を形成することを含む、請求項15に記載の方法。
- 前記ペーストを乾燥した後に、前記ペーストを焼結することをさらに含む、請求項15に記載の方法。
- 導電性ペーストを供給することが、前記セラミックシートの上にステンシルを当てて、前記セラミックシートにわたって前記ペーストを供給することを含む、請求項15に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662364590P | 2016-07-20 | 2016-07-20 | |
US62/364,590 | 2016-07-20 | ||
US15/356,905 | 2016-11-21 | ||
US15/356,905 US10636690B2 (en) | 2016-07-20 | 2016-11-21 | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing |
PCT/US2017/033166 WO2018017183A1 (en) | 2016-07-20 | 2017-05-17 | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing |
Publications (2)
Publication Number | Publication Date |
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JP2019525468A true JP2019525468A (ja) | 2019-09-05 |
JP6805324B2 JP6805324B2 (ja) | 2020-12-23 |
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JP2019502657A Active JP6805324B2 (ja) | 2016-07-20 | 2017-05-17 | マイクロメカニカル及び半導体処理におけるワークピースキャリアの積層された上部プレート |
Country Status (6)
Country | Link |
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US (1) | US10636690B2 (ja) |
JP (1) | JP6805324B2 (ja) |
KR (1) | KR20190018772A (ja) |
CN (1) | CN109478528A (ja) |
TW (1) | TW201812977A (ja) |
WO (1) | WO2018017183A1 (ja) |
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DE102018101453A1 (de) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes |
CN114280829B (zh) * | 2022-01-06 | 2022-09-06 | 重庆臻宝实业有限公司 | 一种下部电极1Pitch Emboss的形成方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230306A (ja) * | 1999-11-10 | 2001-08-24 | Ibiden Co Ltd | セラミック基板 |
JP2002050866A (ja) * | 2000-08-02 | 2002-02-15 | Ngk Spark Plug Co Ltd | セラミック部材の製造方法、離形シート及びその製造方法 |
JP2003017552A (ja) * | 2001-07-03 | 2003-01-17 | Onahama Seisakusho:Kk | セラミックヒータ及びセラミックヒータ内臓型静電チャック |
JP2005032787A (ja) * | 2003-07-08 | 2005-02-03 | Murata Mfg Co Ltd | セラミック配線基板及びその製造方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
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2017
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- 2017-05-17 CN CN201780043038.9A patent/CN109478528A/zh active Pending
- 2017-05-17 JP JP2019502657A patent/JP6805324B2/ja active Active
- 2017-05-17 KR KR1020197004795A patent/KR20190018772A/ko not_active Application Discontinuation
- 2017-06-05 TW TW106118451A patent/TW201812977A/zh unknown
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Also Published As
Publication number | Publication date |
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CN109478528A (zh) | 2019-03-15 |
WO2018017183A1 (en) | 2018-01-25 |
KR20190018772A (ko) | 2019-02-25 |
US10636690B2 (en) | 2020-04-28 |
US20180025932A1 (en) | 2018-01-25 |
JP6805324B2 (ja) | 2020-12-23 |
TW201812977A (zh) | 2018-04-01 |
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