JP2019515484A5 - - Google Patents
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- Publication number
- JP2019515484A5 JP2019515484A5 JP2018547428A JP2018547428A JP2019515484A5 JP 2019515484 A5 JP2019515484 A5 JP 2019515484A5 JP 2018547428 A JP2018547428 A JP 2018547428A JP 2018547428 A JP2018547428 A JP 2018547428A JP 2019515484 A5 JP2019515484 A5 JP 2019515484A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- slit
- chamber
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2016/054909 WO2017152958A1 (en) | 2016-03-08 | 2016-03-08 | Chamber for degassing substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019515484A JP2019515484A (ja) | 2019-06-06 |
| JP2019515484A5 true JP2019515484A5 (enExample) | 2020-11-26 |
| JP6800237B2 JP6800237B2 (ja) | 2020-12-16 |
Family
ID=55527913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018547428A Active JP6800237B2 (ja) | 2016-03-08 | 2016-03-08 | 基板を脱ガスするためのチャンバ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11776825B2 (enExample) |
| EP (1) | EP3427291B1 (enExample) |
| JP (1) | JP6800237B2 (enExample) |
| KR (1) | KR102345172B1 (enExample) |
| CN (1) | CN108780766B (enExample) |
| WO (1) | WO2017152958A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10998209B2 (en) | 2019-05-31 | 2021-05-04 | Applied Materials, Inc. | Substrate processing platforms including multiple processing chambers |
| US11901198B2 (en) * | 2019-07-12 | 2024-02-13 | Axcelis Technologies, Inc. | Toxic outgas control post process |
| KR102707382B1 (ko) * | 2020-06-10 | 2024-09-13 | 삼성전자주식회사 | 매거진 지지 장치 및 이를 포함하는 반도체 제조 장비 |
| US12080571B2 (en) | 2020-07-08 | 2024-09-03 | Applied Materials, Inc. | Substrate processing module and method of moving a workpiece |
| US11749542B2 (en) | 2020-07-27 | 2023-09-05 | Applied Materials, Inc. | Apparatus, system, and method for non-contact temperature monitoring of substrate supports |
| US11817331B2 (en) | 2020-07-27 | 2023-11-14 | Applied Materials, Inc. | Substrate holder replacement with protective disk during pasting process |
| US11747660B2 (en) * | 2020-07-28 | 2023-09-05 | HKC Corporation Limited | Degassing machine and degassing system |
| US11600507B2 (en) | 2020-09-09 | 2023-03-07 | Applied Materials, Inc. | Pedestal assembly for a substrate processing chamber |
| US11610799B2 (en) | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
| US12195314B2 (en) | 2021-02-02 | 2025-01-14 | Applied Materials, Inc. | Cathode exchange mechanism to improve preventative maintenance time for cluster system |
| US11674227B2 (en) | 2021-02-03 | 2023-06-13 | Applied Materials, Inc. | Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure |
| US12002668B2 (en) | 2021-06-25 | 2024-06-04 | Applied Materials, Inc. | Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool |
| CN119465018B (zh) * | 2025-01-13 | 2025-04-18 | 上海陛通半导体能源科技股份有限公司 | 一种用于pvd设备的脱气腔 |
| CN119465019B (zh) * | 2025-01-13 | 2025-04-18 | 上海陛通半导体能源科技股份有限公司 | 一种半导体元器件高温脱气之后快速冷却装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3656454A (en) | 1970-11-23 | 1972-04-18 | Air Reduction | Vacuum coating apparatus |
| US5607009A (en) | 1993-01-28 | 1997-03-04 | Applied Materials, Inc. | Method of heating and cooling large area substrates and apparatus therefor |
| US5793050A (en) * | 1996-02-16 | 1998-08-11 | Eaton Corporation | Ion implantation system for implanting workpieces |
| FR2747112B1 (fr) * | 1996-04-03 | 1998-05-07 | Commissariat Energie Atomique | Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement |
| US6602348B1 (en) * | 1996-09-17 | 2003-08-05 | Applied Materials, Inc. | Substrate cooldown chamber |
| US6460369B2 (en) | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
| SG185822A1 (en) | 2000-02-01 | 2012-12-28 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| US6698718B2 (en) * | 2001-08-29 | 2004-03-02 | Wafermasters, Inc. | Rotary valve |
| JP4821074B2 (ja) | 2001-08-31 | 2011-11-24 | 東京エレクトロン株式会社 | 処理システム |
| US6497734B1 (en) * | 2002-01-02 | 2002-12-24 | Novellus Systems, Inc. | Apparatus and method for enhanced degassing of semiconductor wafers for increased throughput |
| US7431585B2 (en) | 2002-01-24 | 2008-10-07 | Applied Materials, Inc. | Apparatus and method for heating substrates |
| JP4319434B2 (ja) * | 2003-03-11 | 2009-08-26 | 東京エレクトロン株式会社 | ゲートバルブ及び真空容器 |
| US7282097B2 (en) * | 2004-06-14 | 2007-10-16 | Applied Materials, Inc. | Slit valve door seal |
| KR20060033234A (ko) | 2004-10-14 | 2006-04-19 | 삼성전자주식회사 | 급속 열처리 장치 |
| US20060156979A1 (en) | 2004-11-22 | 2006-07-20 | Applied Materials, Inc. | Substrate processing apparatus using a batch processing chamber |
| US20060127067A1 (en) | 2004-12-13 | 2006-06-15 | General Electric Company | Fast heating and cooling wafer handling assembly and method of manufacturing thereof |
| US7665951B2 (en) * | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
| WO2008144670A1 (en) * | 2007-05-18 | 2008-11-27 | Brooks Automation, Inc. | Load lock fast pump vent |
| CN101620988A (zh) * | 2008-06-30 | 2010-01-06 | 佳能安内华股份有限公司 | 堆叠装载锁定室及包含其的衬底处理设备 |
| US8420981B2 (en) | 2009-11-13 | 2013-04-16 | Tel Nexx, Inc. | Apparatus for thermal processing with micro-environment |
| US20120220116A1 (en) | 2011-02-25 | 2012-08-30 | Applied Materials, Inc. | Dry Chemical Cleaning For Semiconductor Processing |
| US20120285621A1 (en) * | 2011-05-10 | 2012-11-15 | Applied Materials, Inc. | Semiconductor chamber apparatus for dielectric processing |
| KR101898677B1 (ko) * | 2012-04-30 | 2018-09-13 | 삼성전자주식회사 | 멀티 스택 큐어 시스템 및 그 운전 방법 |
| KR101224520B1 (ko) * | 2012-06-27 | 2013-01-22 | (주)이노시티 | 프로세스 챔버 |
| US20140273525A1 (en) | 2013-03-13 | 2014-09-18 | Intermolecular, Inc. | Atomic Layer Deposition of Reduced-Leakage Post-Transition Metal Oxide Films |
| WO2014143846A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc | Multi-position batch load lock apparatus and systems and methods including same |
| US9245767B2 (en) * | 2013-09-12 | 2016-01-26 | Applied Materials, Inc. | Anneal module for semiconductor wafers |
| US9349620B2 (en) | 2014-07-09 | 2016-05-24 | Asm Ip Holdings B.V. | Apparatus and method for pre-baking substrate upstream of process chamber |
| CN110120360B (zh) * | 2014-12-11 | 2023-01-13 | 瑞士艾发科技 | 用于衬底脱气的室 |
| US10403552B1 (en) * | 2018-04-02 | 2019-09-03 | Varian Semiconductor Equipment Associates, Inc. | Replacement gate formation with angled etch and deposition |
-
2016
- 2016-03-08 WO PCT/EP2016/054909 patent/WO2017152958A1/en not_active Ceased
- 2016-03-08 EP EP16709913.4A patent/EP3427291B1/en active Active
- 2016-03-08 CN CN201680083323.9A patent/CN108780766B/zh active Active
- 2016-03-08 JP JP2018547428A patent/JP6800237B2/ja active Active
- 2016-03-08 KR KR1020187029133A patent/KR102345172B1/ko active Active
- 2016-03-08 US US16/083,123 patent/US11776825B2/en active Active
-
2023
- 2023-08-23 US US18/454,374 patent/US20230395402A1/en active Pending
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