JP2019510650A5 - - Google Patents
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- JP2019510650A5 JP2019510650A5 JP2018549965A JP2018549965A JP2019510650A5 JP 2019510650 A5 JP2019510650 A5 JP 2019510650A5 JP 2018549965 A JP2018549965 A JP 2018549965A JP 2018549965 A JP2018549965 A JP 2018549965A JP 2019510650 A5 JP2019510650 A5 JP 2019510650A5
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- JP
- Japan
- Prior art keywords
- polishing pad
- substrate
- polishing
- casing
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 1
Description
次に、位置決め駆動システム560は、基板10の上の所望の位置に研磨パッドキャリア300と研磨パッド200を配置する。研磨パッド200は基板10に接触させられる。例えば、研磨パッドキャリア300は、研磨パッド200を動かして基板10の上に研磨パッド200を押圧することができる。代替的に、又は追加的に、一又は複数の垂直アクチュエータは、研磨パッドキャリア300全体を下げて、及び/又は基板支持体を持ち上げて、基板10に接触させることが可能になりうる。研磨駆動システム500は、研磨パッドキャリア300と基板支持体105との間の相対運動を生み出し、基板10の研磨を引き起す。
研磨パッドキャリアは、ケーシング310を含む。ケーシング310は一般的に、研磨パッドアセンブリ250を取り囲むことができる。例えば、ケーシング310は、少なくとも研磨パッドアセンブリ250の膜250が配置される内部空洞を含みうる。
下方駆動シャフト526がローター510の中心に接触すると仮定すると、下方駆動シャフト526は、上方駆動シャフト522から、軌道の望ましい半径をもたらす距離Sだけオフセットされうる。具体的には、オフセットによって、下方駆動シャフト522が半径Sの円で回転する場合には、凹部344の直径をT、ローターの直径をUとすると、R=S−((T−U)/2)となる。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021184805A JP7326405B2 (ja) | 2016-03-24 | 2021-11-12 | 化学機械研磨のためのテクスチャード加工された小型パッド |
JP2023126338A JP2023162199A (ja) | 2016-03-24 | 2023-08-02 | 化学機械研磨のためのテクスチャード加工された小型パッド |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662313023P | 2016-03-24 | 2016-03-24 | |
US62/313,023 | 2016-03-24 | ||
PCT/US2017/022924 WO2017165216A1 (en) | 2016-03-24 | 2017-03-17 | Textured small pad for chemical mechanical polishing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021184805A Division JP7326405B2 (ja) | 2016-03-24 | 2021-11-12 | 化学機械研磨のためのテクスチャード加工された小型パッド |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019510650A JP2019510650A (ja) | 2019-04-18 |
JP2019510650A5 true JP2019510650A5 (ja) | 2020-05-14 |
JP6979030B2 JP6979030B2 (ja) | 2021-12-08 |
Family
ID=59897480
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018549965A Active JP6979030B2 (ja) | 2016-03-24 | 2017-03-17 | 化学機械研磨のためのテクスチャード加工された小型パッド |
JP2021184805A Active JP7326405B2 (ja) | 2016-03-24 | 2021-11-12 | 化学機械研磨のためのテクスチャード加工された小型パッド |
JP2023126338A Pending JP2023162199A (ja) | 2016-03-24 | 2023-08-02 | 化学機械研磨のためのテクスチャード加工された小型パッド |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021184805A Active JP7326405B2 (ja) | 2016-03-24 | 2021-11-12 | 化学機械研磨のためのテクスチャード加工された小型パッド |
JP2023126338A Pending JP2023162199A (ja) | 2016-03-24 | 2023-08-02 | 化学機械研磨のためのテクスチャード加工された小型パッド |
Country Status (6)
Country | Link |
---|---|
US (1) | US10589399B2 (ja) |
JP (3) | JP6979030B2 (ja) |
KR (2) | KR102535628B1 (ja) |
CN (1) | CN108883515A (ja) |
TW (2) | TWI757275B (ja) |
WO (1) | WO2017165216A1 (ja) |
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-
2017
- 2017-03-17 KR KR1020227004767A patent/KR102535628B1/ko active IP Right Grant
- 2017-03-17 KR KR1020187030591A patent/KR102363829B1/ko active IP Right Grant
- 2017-03-17 US US15/461,944 patent/US10589399B2/en active Active
- 2017-03-17 WO PCT/US2017/022924 patent/WO2017165216A1/en active Application Filing
- 2017-03-17 JP JP2018549965A patent/JP6979030B2/ja active Active
- 2017-03-17 CN CN201780019865.4A patent/CN108883515A/zh active Pending
- 2017-03-24 TW TW106109841A patent/TWI757275B/zh active
- 2017-03-24 TW TW111104600A patent/TWI836343B/zh active
-
2021
- 2021-11-12 JP JP2021184805A patent/JP7326405B2/ja active Active
-
2023
- 2023-08-02 JP JP2023126338A patent/JP2023162199A/ja active Pending
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