JP2019509632A - 熱電装置 - Google Patents
熱電装置 Download PDFInfo
- Publication number
- JP2019509632A JP2019509632A JP2018543610A JP2018543610A JP2019509632A JP 2019509632 A JP2019509632 A JP 2019509632A JP 2018543610 A JP2018543610 A JP 2018543610A JP 2018543610 A JP2018543610 A JP 2018543610A JP 2019509632 A JP2019509632 A JP 2019509632A
- Authority
- JP
- Japan
- Prior art keywords
- platform
- thermoelectric
- arms
- tracks
- track
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000010292 electrical insulation Methods 0.000 claims abstract description 3
- 230000005855 radiation Effects 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012080 ambient air Substances 0.000 claims description 3
- 230000002745 absorbent Effects 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims description 2
- 239000011358 absorbing material Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- ZNKMCMOJCDFGFT-UHFFFAOYSA-N gold titanium Chemical compound [Ti].[Au] ZNKMCMOJCDFGFT-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229910001258 titanium gold Inorganic materials 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H10N19/101—Multiple thermocouples connected in a cascade arrangement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/023—Particular leg structure or construction or shape; Nanotubes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Hybrid Cells (AREA)
Abstract
Description
Claims (12)
- アーム(44A、44B、45A、45B)によって基板の上方に懸架されたプラットフォーム(42)を備える、金属接続部(54A、54B)によって直列に接続された交番タイプの熱電トラック(52A、52B、53A、53B)を有する熱電セルであって、前記プラットフォームおよび前記アームは同じ熱的および電気的絶縁層(50)の部分であり、各アームは熱電トラックを支持し、前記プラットフォーム(42)は矩形形状を有し、2つのアーム(44A、44B)は前記矩形の一方の側から延在し、2つのアーム(45A、45B)は反対側から延在し、同じタイプの熱電トラック(52A、52B、53A、53B)は、前記矩形の同じ側に位置するアーム上に配置されている、熱電セル。
- 前記熱電トラック(52Aおよび53A、52Bおよび53B)はドープされたテルル化ビスマスで作られ、そのタイプは導電型に対応する、請求項1に記載のセル。
- 前記絶縁層(50)は、酸化シリコン、窒化シリコン、または酸化アルミニウムで作られる、請求項1または2に記載のセル。
- 各アーム(44A、44B、45A、45B)の長さと幅との比が5より大きい、請求項1から3のいずれかに記載のセル。
- 前記プラットフォーム上に配置された吸収性コーティングも含む、請求項1から4のいずれかに記載のセル。
- マトリクス状に配置され、共通基板を有する、請求項1から5のいずれかに記載の熱電セルを多数備える熱電装置であって、前記マトリクスの各列の熱電セルは、第2の金属接点(74、76)の間で直列に接続されている、熱電装置。
- 請求項6に記載の装置を備えるサーモパイル。
- 前記プラットフォーム(42)は、太陽放射を吸収するように設計された吸収材料(84)で覆われており、前記共通基板は冷熱源と熱接触するように設計されている、請求項7に記載のサーモパイル。
- 前記プラットフォーム(42)は真空下にある、請求項8に記載のサーモパイル。
- 前記プラットフォーム(42)は周囲空気と接触しており、前記共通基板は熱源と熱接触するように設計されている、請求項7に記載のサーモパイル。
- 請求項6に記載の装置を備えるボロメータであって、前記装置は検知回路に接続され、前記装置の前記プラットフォームは選択された波長を吸収するコーティングで覆われ、前記共通基板は冷熱源と熱接触するように設計されている、ボロメータ。
- 請求項1から5のいずれかに記載のセルまたは請求項6に記載の装置を含む冷却器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1651336A FR3048128B1 (fr) | 2016-02-18 | 2016-02-18 | Dispositif thermoelectrique |
FR1651336 | 2016-02-18 | ||
PCT/FR2017/050324 WO2017140975A1 (fr) | 2016-02-18 | 2017-02-13 | Dispositif thermoélectrique |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019509632A true JP2019509632A (ja) | 2019-04-04 |
Family
ID=55650578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018543610A Pending JP2019509632A (ja) | 2016-02-18 | 2017-02-13 | 熱電装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10700254B2 (ja) |
EP (1) | EP3417492B1 (ja) |
JP (1) | JP2019509632A (ja) |
CN (1) | CN108701747B (ja) |
CA (1) | CA3011958C (ja) |
FR (1) | FR3048128B1 (ja) |
RU (1) | RU2722063C2 (ja) |
WO (1) | WO2017140975A1 (ja) |
Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07147433A (ja) * | 1993-11-24 | 1995-06-06 | Nec Corp | 赤外線撮像素子 |
JPH1079531A (ja) * | 1996-09-04 | 1998-03-24 | Nikon Corp | エネルギ変換素子及びその製造方法 |
JPH11191644A (ja) * | 1997-12-26 | 1999-07-13 | Nissan Motor Co Ltd | 赤外線検知素子 |
JP2000077729A (ja) * | 1998-08-27 | 2000-03-14 | Nissan Motor Co Ltd | センサの製造方法 |
US6046398A (en) * | 1998-11-04 | 2000-04-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Micromachined thermoelectric sensors and arrays and process for producing |
JP2000244023A (ja) * | 1999-02-18 | 2000-09-08 | Kansai Research Institute | 熱電変換装置 |
JP2005221238A (ja) * | 2004-02-03 | 2005-08-18 | Mitsuteru Kimura | 温度差の検出方法、温度センサおよびこれを用いた赤外線センサ |
JP2006525657A (ja) * | 2003-05-07 | 2006-11-09 | パーキンエルマー オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コー. カーゲー | 放射線センサ、ウエハ、センサモジュールおよび放射線センサの製造方法 |
JP2007500951A (ja) * | 2003-05-19 | 2007-01-18 | アプライド ディジタル ソリューションズ | 低電力熱電発電装置 |
US20080271772A1 (en) * | 2007-03-29 | 2008-11-06 | Stichting Imec Nederland | Method for Manufacturing a Thermopile on a Membrane and a Membrane-less Thermopile, the Thermopile thus Obtained and a Thermoelectric Generator Comprising Such Thermopiles |
JP2009502687A (ja) * | 2005-08-02 | 2009-01-29 | グラフィック パッケージング インターナショナル インコーポレイテッド | 取出構成要素部を有するカートン |
JP2009526401A (ja) * | 2006-02-10 | 2009-07-16 | デストロン フィアリング コーポレイション | 改良型低電力熱発電素子 |
JP2009180682A (ja) * | 2008-01-31 | 2009-08-13 | Ritsumeikan | 赤外線センサ |
JP2010062268A (ja) * | 2008-09-02 | 2010-03-18 | Sumitomo Electric Ind Ltd | BiTe系薄膜、その作製方法、および赤外線センサ |
JP2010107299A (ja) * | 2008-10-29 | 2010-05-13 | Ngk Spark Plug Co Ltd | 赤外線検知素子及びセンサ並びに赤外線検知素子の製造方法 |
JP2010130002A (ja) * | 2008-11-26 | 2010-06-10 | Korea Electronics Telecommun | 熱電素子及び熱電素子モジュール並びにその熱電素子の形成方法 |
JP2010129561A (ja) * | 2008-11-25 | 2010-06-10 | Sumitomo Electric Ind Ltd | BiTe系薄膜の作製方法及び赤外線センサ |
JP2012083341A (ja) * | 2010-09-13 | 2012-04-26 | Ricoh Co Ltd | 熱型赤外線センサー及びその製造方法 |
JP2012119450A (ja) * | 2010-11-30 | 2012-06-21 | Daikin Ind Ltd | 熱電変換モジュール |
WO2012086775A1 (ja) * | 2010-12-24 | 2012-06-28 | 京セラ株式会社 | 熱電発電モジュール |
JP2012212838A (ja) * | 2011-03-23 | 2012-11-01 | National Institute Of Advanced Industrial & Technology | 熱電薄膜デバイス |
JP2013186039A (ja) * | 2012-03-09 | 2013-09-19 | Panasonic Corp | 赤外線検出装置 |
US20150177070A1 (en) * | 2013-12-22 | 2015-06-25 | Melexis Technologies N.V. | Infrared thermal sensor with beams having different widths |
US20150355017A1 (en) * | 2014-06-05 | 2015-12-10 | SunEdison Inc. | Methods and systems for calibrating irradiance sensors |
WO2016002499A1 (ja) * | 2014-07-04 | 2016-01-07 | 株式会社村田製作所 | 熱型赤外線センサおよびガス測定装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2262425A1 (en) * | 1974-02-22 | 1975-09-19 | Radiotechnique Compelec | Sensitive junction thermopile as radiation detector - junctions arranged in series over thermally absorbent windows |
JPS6177728A (ja) * | 1984-09-25 | 1986-04-21 | Matsushita Electric Ind Co Ltd | 熱電堆型赤外検出素子 |
JP3339276B2 (ja) * | 1995-11-08 | 2002-10-28 | 日産自動車株式会社 | 赤外線検出素子 |
JP2000298061A (ja) * | 1999-04-14 | 2000-10-24 | Murata Mfg Co Ltd | 赤外線センサ |
JP2002176204A (ja) * | 2000-12-07 | 2002-06-21 | Ihi Aerospace Co Ltd | 赤外線検出素子 |
CN1433089A (zh) * | 2002-01-18 | 2003-07-30 | 祥群科技股份有限公司 | 具有隐藏式热电偶支脚的热电堆红外线元件及其制造方法 |
RU2217712C2 (ru) * | 2002-02-08 | 2003-11-27 | Федеральное государственное унитарное предприятие "Смоленское производственное объединение "Аналитприбор" | Термоэлектрический приёмник излучения |
US6987223B2 (en) * | 2002-08-28 | 2006-01-17 | Delphi Technologies, Inc. | Heat sink for silicon thermopile |
US20050087221A1 (en) * | 2003-10-28 | 2005-04-28 | Shah Reza H. | Heat conversion system |
US8552380B1 (en) * | 2012-05-08 | 2013-10-08 | Cambridge Cmos Sensors Limited | IR detector |
US9306146B2 (en) * | 2012-12-21 | 2016-04-05 | Richard C. Thuss | Low thermal conductivity thermoelectric materials and method for making the same |
DE102013216909A1 (de) * | 2013-08-26 | 2015-02-26 | Robert Bosch Gmbh | Thermosensor und Verfahren zur Herstellung eines Thermosensors |
CN103700722B (zh) * | 2013-12-02 | 2018-03-30 | 中北大学 | 架空式热电堆红外探测器 |
US20160079306A1 (en) * | 2014-09-12 | 2016-03-17 | Excelitas Technologies Singapore Pte. Ltd. | Surface Micro-Machined Infrared Sensor Using Highly Temperature Stable Interferometric Absorber |
-
2016
- 2016-02-18 FR FR1651336A patent/FR3048128B1/fr active Active
-
2017
- 2017-02-13 JP JP2018543610A patent/JP2019509632A/ja active Pending
- 2017-02-13 RU RU2018132856A patent/RU2722063C2/ru active
- 2017-02-13 US US15/998,951 patent/US10700254B2/en active Active
- 2017-02-13 CN CN201780011766.1A patent/CN108701747B/zh active Active
- 2017-02-13 WO PCT/FR2017/050324 patent/WO2017140975A1/fr active Application Filing
- 2017-02-13 CA CA3011958A patent/CA3011958C/fr active Active
- 2017-02-13 EP EP17708865.5A patent/EP3417492B1/fr active Active
Patent Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07147433A (ja) * | 1993-11-24 | 1995-06-06 | Nec Corp | 赤外線撮像素子 |
JPH1079531A (ja) * | 1996-09-04 | 1998-03-24 | Nikon Corp | エネルギ変換素子及びその製造方法 |
JPH11191644A (ja) * | 1997-12-26 | 1999-07-13 | Nissan Motor Co Ltd | 赤外線検知素子 |
JP2000077729A (ja) * | 1998-08-27 | 2000-03-14 | Nissan Motor Co Ltd | センサの製造方法 |
US6046398A (en) * | 1998-11-04 | 2000-04-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Micromachined thermoelectric sensors and arrays and process for producing |
JP2000244023A (ja) * | 1999-02-18 | 2000-09-08 | Kansai Research Institute | 熱電変換装置 |
JP2006525657A (ja) * | 2003-05-07 | 2006-11-09 | パーキンエルマー オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コー. カーゲー | 放射線センサ、ウエハ、センサモジュールおよび放射線センサの製造方法 |
JP2007500951A (ja) * | 2003-05-19 | 2007-01-18 | アプライド ディジタル ソリューションズ | 低電力熱電発電装置 |
JP2005221238A (ja) * | 2004-02-03 | 2005-08-18 | Mitsuteru Kimura | 温度差の検出方法、温度センサおよびこれを用いた赤外線センサ |
JP2009502687A (ja) * | 2005-08-02 | 2009-01-29 | グラフィック パッケージング インターナショナル インコーポレイテッド | 取出構成要素部を有するカートン |
JP2009526401A (ja) * | 2006-02-10 | 2009-07-16 | デストロン フィアリング コーポレイション | 改良型低電力熱発電素子 |
US20080271772A1 (en) * | 2007-03-29 | 2008-11-06 | Stichting Imec Nederland | Method for Manufacturing a Thermopile on a Membrane and a Membrane-less Thermopile, the Thermopile thus Obtained and a Thermoelectric Generator Comprising Such Thermopiles |
JP2009180682A (ja) * | 2008-01-31 | 2009-08-13 | Ritsumeikan | 赤外線センサ |
JP2010062268A (ja) * | 2008-09-02 | 2010-03-18 | Sumitomo Electric Ind Ltd | BiTe系薄膜、その作製方法、および赤外線センサ |
JP2010107299A (ja) * | 2008-10-29 | 2010-05-13 | Ngk Spark Plug Co Ltd | 赤外線検知素子及びセンサ並びに赤外線検知素子の製造方法 |
JP2010129561A (ja) * | 2008-11-25 | 2010-06-10 | Sumitomo Electric Ind Ltd | BiTe系薄膜の作製方法及び赤外線センサ |
JP2010130002A (ja) * | 2008-11-26 | 2010-06-10 | Korea Electronics Telecommun | 熱電素子及び熱電素子モジュール並びにその熱電素子の形成方法 |
JP2012083341A (ja) * | 2010-09-13 | 2012-04-26 | Ricoh Co Ltd | 熱型赤外線センサー及びその製造方法 |
JP2012119450A (ja) * | 2010-11-30 | 2012-06-21 | Daikin Ind Ltd | 熱電変換モジュール |
WO2012086775A1 (ja) * | 2010-12-24 | 2012-06-28 | 京セラ株式会社 | 熱電発電モジュール |
JP2012212838A (ja) * | 2011-03-23 | 2012-11-01 | National Institute Of Advanced Industrial & Technology | 熱電薄膜デバイス |
JP2013186039A (ja) * | 2012-03-09 | 2013-09-19 | Panasonic Corp | 赤外線検出装置 |
US20150177070A1 (en) * | 2013-12-22 | 2015-06-25 | Melexis Technologies N.V. | Infrared thermal sensor with beams having different widths |
US20150355017A1 (en) * | 2014-06-05 | 2015-12-10 | SunEdison Inc. | Methods and systems for calibrating irradiance sensors |
WO2016002499A1 (ja) * | 2014-07-04 | 2016-01-07 | 株式会社村田製作所 | 熱型赤外線センサおよびガス測定装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017140975A1 (fr) | 2017-08-24 |
US20190326499A1 (en) | 2019-10-24 |
CN108701747A (zh) | 2018-10-23 |
EP3417492A1 (fr) | 2018-12-26 |
RU2018132856A (ru) | 2020-03-18 |
US10700254B2 (en) | 2020-06-30 |
RU2018132856A3 (ja) | 2020-04-08 |
CA3011958A1 (fr) | 2017-08-24 |
CN108701747B (zh) | 2022-04-01 |
EP3417492B1 (fr) | 2020-03-11 |
CA3011958C (fr) | 2023-08-29 |
FR3048128A1 (fr) | 2017-08-25 |
RU2722063C2 (ru) | 2020-05-26 |
FR3048128B1 (fr) | 2018-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9748466B2 (en) | Wafer scale thermoelectric energy harvester | |
US9869593B2 (en) | Detection device with suspended bolometric membranes having a high absorption efficiency and signal-to-noise ratio | |
US20060220164A1 (en) | Thermopile-based gas sensor | |
KR100313909B1 (ko) | 적외선 센서 및 그 제조방법 | |
JP2015233154A (ja) | 積層サーモパイル | |
JPH05206526A (ja) | ボロメータとその製法 | |
US9954154B2 (en) | Superlattice quantum well thermoelectric generator via radiation exchange and/or conduction/convection | |
JP2014077783A (ja) | 熱電対、サーモパイル、赤外線センサー及び赤外線センサーの製造方法 | |
KR20140032342A (ko) | 초격자 양자우물 적외선 감지기 | |
US7241998B2 (en) | Microbolometer and its manufacturing method | |
US11322672B2 (en) | Integrated thermoelectric structure, method for manufacturing an integrated thermoelectric structure, method for operating same as a detector, thermoelectric generator and thermoelectric Peltier element | |
US10700254B2 (en) | Thermoelectric device | |
KR101677717B1 (ko) | 멤스 써모파일 센서 및 그 제조방법 | |
US20190162600A1 (en) | Infrared radiation sensors and methods of manufacturing infrared radiation sensors | |
US12010917B2 (en) | Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module, and optical sensor | |
KR101331996B1 (ko) | 써모파일 센서 및 그 제조방법 | |
US20190252593A1 (en) | Thermoelectric conversion device and manufacturing method thereof | |
KR101444920B1 (ko) | 열형 온도 감지 소자 | |
KR102471714B1 (ko) | 실리콘 나노와이어를 이용한 적외선 센서 및 그 제조방법 | |
JP2006170956A (ja) | 赤外線検出装置、半導体基板、およびそれらの製造方法 | |
KR101227242B1 (ko) | 에스오아이 기판을 이용한 써모파일의 제조방법 및 적외선 센서의 제조방법 | |
US20240114791A1 (en) | Thermoelectric conversion device | |
Fournol et al. | Cooled Bolometer Design for High-Sensitivity THz Passive Imaging | |
JPH0227827B2 (ja) | ||
KR20060021982A (ko) | 써모파일 적외선 센서 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181213 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191218 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210202 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20210427 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210729 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20211214 |