JP2019507493A5 - - Google Patents
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- JP2019507493A5 JP2019507493A5 JP2018534060A JP2018534060A JP2019507493A5 JP 2019507493 A5 JP2019507493 A5 JP 2019507493A5 JP 2018534060 A JP2018534060 A JP 2018534060A JP 2018534060 A JP2018534060 A JP 2018534060A JP 2019507493 A5 JP2019507493 A5 JP 2019507493A5
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- JP
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- Prior art keywords
- laser
- wafer
- control system
- temperature
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000012431 wafers Nutrition 0.000 claims description 158
- 238000000034 method Methods 0.000 claims description 75
- 238000005224 laser annealing Methods 0.000 claims description 47
- 238000000137 annealing Methods 0.000 claims description 44
- 238000012544 monitoring process Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 17
- 238000002310 reflectometry Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000013519 translation Methods 0.000 claims description 11
- 230000003750 conditioning effect Effects 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000002835 absorbance Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511021931.0A CN106935491B (zh) | 2015-12-30 | 2015-12-30 | 一种激光退火装置及其退火方法 |
| CN201511021931.0 | 2015-12-30 | ||
| PCT/CN2016/112662 WO2017114424A1 (zh) | 2015-12-30 | 2016-12-28 | 一种激光退火装置及其退火方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019507493A JP2019507493A (ja) | 2019-03-14 |
| JP2019507493A5 true JP2019507493A5 (enExample) | 2020-03-12 |
| JP6831383B2 JP6831383B2 (ja) | 2021-02-17 |
Family
ID=59224600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018534060A Active JP6831383B2 (ja) | 2015-12-30 | 2016-12-28 | レーザーアニーリング装置及びそのためのレーザーアニーリング方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20190015929A1 (enExample) |
| EP (1) | EP3399543B1 (enExample) |
| JP (1) | JP6831383B2 (enExample) |
| KR (1) | KR102080613B1 (enExample) |
| CN (1) | CN106935491B (enExample) |
| TW (1) | TW201729295A (enExample) |
| WO (1) | WO2017114424A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10270032B2 (en) | 2017-09-13 | 2019-04-23 | Int Tech Co., Ltd. | Light source and a manufacturing method therewith |
| US10768532B2 (en) * | 2018-05-15 | 2020-09-08 | International Business Machines Corporation | Co-optimization of lithographic and etching processes with complementary post exposure bake by laser annealing |
| KR102546719B1 (ko) * | 2018-09-04 | 2023-06-21 | 삼성전자주식회사 | 모니터링 장치 및 모니터링 방법 |
| CN109686686B (zh) * | 2019-01-30 | 2024-06-14 | 北京华卓精科科技股份有限公司 | 激光热处理装置及激光热处理方法 |
| CN110181165B (zh) * | 2019-05-27 | 2021-03-26 | 北京华卓精科科技股份有限公司 | 激光预热退火系统和方法 |
| WO2021020615A1 (ko) * | 2019-07-30 | 2021-02-04 | (주)에이치아이티오토모티브 | 열처리 장치 |
| CN110918770B (zh) * | 2019-12-16 | 2021-01-15 | 山东大学 | 一种多点激光冲击成形装置及成形方法 |
| CN112769025A (zh) * | 2020-12-30 | 2021-05-07 | 中国科学院微电子研究所 | 光学整形装置及方法 |
| CN113345806B (zh) * | 2021-04-23 | 2024-03-05 | 北京华卓精科科技股份有限公司 | 一种SiC基半导体的激光退火方法 |
| CN113305389A (zh) * | 2021-06-08 | 2021-08-27 | 武汉虹信科技发展有限责任公司 | 一种激光焊接装置及激光焊接方法 |
| US12469717B2 (en) * | 2021-08-27 | 2025-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems, methods, and semiconductor devices |
| CN114932308B (zh) * | 2022-04-11 | 2024-01-30 | 深圳市韵腾激光科技有限公司 | 一种动态Mini显示单元修复系统 |
| CN116230509A (zh) * | 2022-09-08 | 2023-06-06 | 北京华卓精科科技股份有限公司 | 一种激光退火方法及系统 |
| CN115424961B (zh) * | 2022-09-29 | 2025-09-02 | 上海集成电路研发中心有限公司 | 激光退火设备及激光退火控制方法 |
| CN115602751A (zh) * | 2022-10-25 | 2023-01-13 | 江苏华兴激光科技有限公司（Cn） | 一种用于红外雪崩探测芯片的激光退火装置及其检测方法 |
| CN116275509B (zh) * | 2023-05-15 | 2023-09-08 | 苏州亚太精睿传动科技股份有限公司 | 一种激光焊接方法 |
| CN116790851A (zh) * | 2023-06-20 | 2023-09-22 | 京东方科技集团股份有限公司 | 退火装置、其检测方法、退火设备、以及退火工艺方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4663513A (en) * | 1985-11-26 | 1987-05-05 | Spectra-Physics, Inc. | Method and apparatus for monitoring laser processes |
| JP3301054B2 (ja) * | 1996-02-13 | 2002-07-15 | 株式会社半導体エネルギー研究所 | レーザー照射装置及びレーザー照射方法 |
| JP4514861B2 (ja) * | 1999-11-29 | 2010-07-28 | 株式会社半導体エネルギー研究所 | レーザ照射装置およびレーザ照射方法および半導体装置の作製方法 |
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| TW521310B (en) * | 2001-02-08 | 2003-02-21 | Toshiba Corp | Laser processing method and apparatus |
| TW582062B (en) * | 2001-09-14 | 2004-04-01 | Sony Corp | Laser irradiation apparatus and method of treating semiconductor thin film |
| JP2003347236A (ja) * | 2002-05-28 | 2003-12-05 | Sony Corp | レーザ照射装置 |
| AU2003258289A1 (en) * | 2002-08-19 | 2004-03-03 | The Trustees Of Columbia University In The City Of New York | A single-shot semiconductor processing system and method having various irradiation patterns |
| JP2004119971A (ja) * | 2002-09-04 | 2004-04-15 | Sharp Corp | レーザ加工方法およびレーザ加工装置 |
| US6747245B2 (en) * | 2002-11-06 | 2004-06-08 | Ultratech Stepper, Inc. | Laser scanning apparatus and methods for thermal processing |
| JP4373115B2 (ja) * | 2003-04-04 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7364952B2 (en) * | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
| KR101041066B1 (ko) * | 2004-02-13 | 2011-06-13 | 삼성전자주식회사 | 실리콘 결정화 방법, 이를 이용한 실리콘 결정화 장치,이를 이용한 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 이를 이용한 표시장치 |
| US7645337B2 (en) * | 2004-11-18 | 2010-01-12 | The Trustees Of Columbia University In The City Of New York | Systems and methods for creating crystallographic-orientation controlled poly-silicon films |
| US7279721B2 (en) * | 2005-04-13 | 2007-10-09 | Applied Materials, Inc. | Dual wavelength thermal flux laser anneal |
| JP2007251015A (ja) * | 2006-03-17 | 2007-09-27 | Sumitomo Heavy Ind Ltd | レーザアニール装置及びレーザアニール方法 |
| US8148663B2 (en) * | 2007-07-31 | 2012-04-03 | Applied Materials, Inc. | Apparatus and method of improving beam shaping and beam homogenization |
| US20090114630A1 (en) * | 2007-11-05 | 2009-05-07 | Hawryluk Andrew M | Minimization of surface reflectivity variations |
| US8674257B2 (en) * | 2008-02-11 | 2014-03-18 | Applied Materials, Inc. | Automatic focus and emissivity measurements for a substrate system |
| JP5590925B2 (ja) * | 2010-03-10 | 2014-09-17 | 住友重機械工業株式会社 | 半導体装置の製造方法及びレーザアニール装置 |
| CN102062647B (zh) * | 2010-11-24 | 2012-08-08 | 中国科学院半导体研究所 | 测量半导体激光器腔面温度的测试系统 |
| US8309474B1 (en) * | 2011-06-07 | 2012-11-13 | Ultratech, Inc. | Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication |
| US9302348B2 (en) * | 2011-06-07 | 2016-04-05 | Ultratech Inc. | Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication |
| JP6030451B2 (ja) * | 2011-06-15 | 2016-11-24 | 株式会社日本製鋼所 | レーザ処理装置およびレーザ処理方法 |
| US8546805B2 (en) * | 2012-01-27 | 2013-10-01 | Ultratech, Inc. | Two-beam laser annealing with improved temperature performance |
| SG195515A1 (en) * | 2012-06-11 | 2013-12-30 | Ultratech Inc | Laser annealing systems and methods with ultra-short dwell times |
| CN103578943B (zh) * | 2012-07-25 | 2017-05-31 | 上海微电子装备有限公司 | 一种激光退火装置及激光退火方法 |
| CN103903967B (zh) * | 2012-12-28 | 2016-12-07 | 上海微电子装备有限公司 | 一种激光退火装置及方法 |
| US20140273533A1 (en) * | 2013-03-15 | 2014-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Annealing Method Utilizing a Vacuum Environment |
| US10226837B2 (en) * | 2013-03-15 | 2019-03-12 | Nlight, Inc. | Thermal processing with line beams |
| CN104078339B (zh) * | 2013-03-26 | 2017-08-29 | 上海微电子装备有限公司 | 一种激光退火装置和方法 |
| TW201528379A (zh) * | 2013-12-20 | 2015-07-16 | Applied Materials Inc | 雙波長退火方法與設備 |
| CN106471609B (zh) * | 2014-07-02 | 2019-10-15 | 应用材料公司 | 用于使用嵌入光纤光学器件及环氧树脂光学散射器的基板温度控制的装置、系统与方法 |
| US10088365B2 (en) * | 2016-11-08 | 2018-10-02 | Sumitomo Heavy Industries, Ltd. | Laser annealing apparatus |
| DE102017100015A1 (de) * | 2017-01-02 | 2018-07-05 | Schott Ag | Verfahren zum Trennen von Substraten |
-
2015
- 2015-12-30 CN CN201511021931.0A patent/CN106935491B/zh active Active
-
2016
- 2016-12-28 WO PCT/CN2016/112662 patent/WO2017114424A1/zh not_active Ceased
- 2016-12-28 KR KR1020187021712A patent/KR102080613B1/ko active Active
- 2016-12-28 US US16/067,353 patent/US20190015929A1/en not_active Abandoned
- 2016-12-28 JP JP2018534060A patent/JP6831383B2/ja active Active
- 2016-12-28 EP EP16881213.9A patent/EP3399543B1/en active Active
- 2016-12-29 TW TW105143862A patent/TW201729295A/zh unknown
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