JP2019220558A - テープ拡張装置 - Google Patents
テープ拡張装置 Download PDFInfo
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- JP2019220558A JP2019220558A JP2018116261A JP2018116261A JP2019220558A JP 2019220558 A JP2019220558 A JP 2019220558A JP 2018116261 A JP2018116261 A JP 2018116261A JP 2018116261 A JP2018116261 A JP 2018116261A JP 2019220558 A JP2019220558 A JP 2019220558A
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- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims abstract description 11
- 230000032258 transport Effects 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 14
- 101100008637 Caenorhabditis elegans daf-19 gene Proteins 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Abstract
Description
13 被加工物
13a 表面
13b 裏面
15 分割予定ライン
17 デバイス
19 ダイアタッチフィルム(DAF)
21 エキスパンドテープ
21a 領域
23 環状フレーム
23a 開口
2 テープ拡張装置
4 基台
6 カセット載置台
8 カセット
10 第1搬送ユニット
12 第1仮置き領域
14 第1仮置きユニット
14a,14b 第1ガイドレール
16 第2搬送ユニット
18 アーム
20 吸着パッド
22 第2仮置き領域
24 第2仮置きユニット
24a,24b 第2ガイドレール
26 第3搬送ユニット
28 テープ拡張ユニット
30 加熱ユニット
32 冷却チャンバー
34 洗浄ユニット
36 スピンナテーブル
38 クランプ
40 チャンバー
50 フレーム保持部
52 支持構造
54 支持テーブル
54a 上面
54b 下面
54c 開口
56 固定プレート
56a 開口
60 移動ユニット
62 シリンダケース
64 ピストンロッド
66 チャックテーブル
66a 保持面
70 位置調整ユニット
72 位置検出ユニット
74 位置制御ユニット
76 基台
78 移動機構
80 ボールねじ
82 パルスモータ
84 支持部
86 突き当て部
88a,88b 長孔
90a,90b 長孔
100 ロッド
102 フランジ部
104 加熱体
Claims (4)
- 分割予定ラインに沿って分割起点が形成された被加工物がエキスパンドテープを介して環状フレームに支持されたフレームユニットの該エキスパンドテープを拡張するテープ拡張装置であって、
該環状フレームを保持するフレーム保持部と、
該フレーム保持部に囲繞され、該エキスパンドテープを介して該被加工物を保持する保持面を有するチャックテーブルと、
該チャックテーブルと該フレーム保持部とを該保持面と垂直な方向に相対的に移動させる移動ユニットと、
複数の該フレームユニットを収容するカセットが載置されるカセット載置台と、
該カセット載置台に載置された該カセットから搬出された該フレームユニットが仮置きされる仮置き領域と、
該仮置き領域に仮置きされた該フレームユニットを該チャックテーブルに搬送する搬送ユニットと、
該被加工物の該保持面に対する位置を調整する位置調整ユニットと、を備え、
該位置調整ユニットは、
該仮置き領域に仮置きされ、又は該保持面で保持された該被加工物の位置を検出する位置検出ユニットと、
該フレーム保持部に保持される該フレームユニットの該環状フレームの外周部と接触する突き当て部、及び、位置検出ユニットによって検出された該被加工物の位置に応じて該突き当て部を移動させる移動機構を備える位置制御ユニットと、を備えることを特徴とするテープ拡張装置。 - 該位置検出ユニットは、該被加工物の外周縁を撮影するカメラユニットであることを特徴とする請求項1記載のテープ拡張装置。
- 該エキスパンドテープの該環状フレーム及び該被加工物と重畳しない領域を加熱して収縮させることにより、該領域に生じた該エキスパンドテープの弛みを除去する加熱ユニットを更に備えることを特徴とする請求項1又は2記載のテープ拡張装置。
- 該フレーム保持部及び該チャックテーブルを収容する冷却チャンバーと、該冷却チャンバーに冷気を供給する冷気供給ユニットとを更に備え、
該エキスパンドテープは、ダイアタッチフィルムを介して該被加工物に貼着されていることを特徴とする請求項1から3のいずれかに記載のテープ拡張装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018116261A JP7154687B2 (ja) | 2018-06-19 | 2018-06-19 | テープ拡張装置 |
KR1020190062331A KR20190143360A (ko) | 2018-06-19 | 2019-05-28 | 테이프 확장 장치 |
SG10201905296YA SG10201905296YA (en) | 2018-06-19 | 2019-06-11 | Tape expanding apparatus |
TW108120594A TWI815909B (zh) | 2018-06-19 | 2019-06-14 | 膠膜擴張裝置 |
CN201910525704.3A CN110620076B (zh) | 2018-06-19 | 2019-06-18 | 带扩展装置 |
US16/445,578 US11637032B2 (en) | 2018-06-19 | 2019-06-19 | Tape expanding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018116261A JP7154687B2 (ja) | 2018-06-19 | 2018-06-19 | テープ拡張装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019220558A true JP2019220558A (ja) | 2019-12-26 |
JP7154687B2 JP7154687B2 (ja) | 2022-10-18 |
Family
ID=68840255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018116261A Active JP7154687B2 (ja) | 2018-06-19 | 2018-06-19 | テープ拡張装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11637032B2 (ja) |
JP (1) | JP7154687B2 (ja) |
KR (1) | KR20190143360A (ja) |
CN (1) | CN110620076B (ja) |
SG (1) | SG10201905296YA (ja) |
TW (1) | TWI815909B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023209901A1 (ja) * | 2022-04-27 | 2023-11-02 | ヤマハ発動機株式会社 | エキスパンド装置、半導体チップの製造方法および半導体チップ |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113510610A (zh) * | 2021-07-30 | 2021-10-19 | 深圳市诺泰芯装备有限公司 | 一种晶圆盘自动上料及扩膜设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211766A (ja) * | 1994-01-14 | 1995-08-11 | Disco Abrasive Syst Ltd | 中心合わせ装置 |
JPH07306153A (ja) * | 1994-05-12 | 1995-11-21 | Olympus Optical Co Ltd | 基板外観検査装置 |
JP2010034250A (ja) * | 2008-07-29 | 2010-02-12 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2011077482A (ja) * | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2018067668A (ja) * | 2016-10-20 | 2018-04-26 | 株式会社ディスコ | シート拡張装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP4256214B2 (ja) * | 2003-06-27 | 2009-04-22 | 株式会社ディスコ | 板状物の分割装置 |
JP2006054246A (ja) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | ウエーハの分離方法 |
JP5791866B2 (ja) * | 2009-03-06 | 2015-10-07 | 株式会社ディスコ | ワーク分割装置 |
JP4896236B2 (ja) * | 2010-01-21 | 2012-03-14 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP6425435B2 (ja) * | 2014-07-01 | 2018-11-21 | 株式会社ディスコ | チップ間隔維持装置 |
JP6671794B2 (ja) * | 2016-05-11 | 2020-03-25 | 株式会社ディスコ | ウェーハの加工方法 |
JP6731793B2 (ja) * | 2016-06-08 | 2020-07-29 | 株式会社ディスコ | ウェーハ加工システム |
-
2018
- 2018-06-19 JP JP2018116261A patent/JP7154687B2/ja active Active
-
2019
- 2019-05-28 KR KR1020190062331A patent/KR20190143360A/ko not_active Application Discontinuation
- 2019-06-11 SG SG10201905296YA patent/SG10201905296YA/en unknown
- 2019-06-14 TW TW108120594A patent/TWI815909B/zh active
- 2019-06-18 CN CN201910525704.3A patent/CN110620076B/zh active Active
- 2019-06-19 US US16/445,578 patent/US11637032B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211766A (ja) * | 1994-01-14 | 1995-08-11 | Disco Abrasive Syst Ltd | 中心合わせ装置 |
JPH07306153A (ja) * | 1994-05-12 | 1995-11-21 | Olympus Optical Co Ltd | 基板外観検査装置 |
JP2010034250A (ja) * | 2008-07-29 | 2010-02-12 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2011077482A (ja) * | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2018067668A (ja) * | 2016-10-20 | 2018-04-26 | 株式会社ディスコ | シート拡張装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023209901A1 (ja) * | 2022-04-27 | 2023-11-02 | ヤマハ発動機株式会社 | エキスパンド装置、半導体チップの製造方法および半導体チップ |
Also Published As
Publication number | Publication date |
---|---|
JP7154687B2 (ja) | 2022-10-18 |
CN110620076B (zh) | 2024-02-23 |
SG10201905296YA (en) | 2020-01-30 |
US20190385888A1 (en) | 2019-12-19 |
US11637032B2 (en) | 2023-04-25 |
TW202002036A (zh) | 2020-01-01 |
CN110620076A (zh) | 2019-12-27 |
TWI815909B (zh) | 2023-09-21 |
KR20190143360A (ko) | 2019-12-30 |
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