JP2019192917A - ウエッジボンディング用部品 - Google Patents
ウエッジボンディング用部品 Download PDFInfo
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- JP2019192917A JP2019192917A JP2019096893A JP2019096893A JP2019192917A JP 2019192917 A JP2019192917 A JP 2019192917A JP 2019096893 A JP2019096893 A JP 2019096893A JP 2019096893 A JP2019096893 A JP 2019096893A JP 2019192917 A JP2019192917 A JP 2019192917A
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Abstract
Description
ド機構3と、振動伝達機構4と、図示しない加圧機構とを備える。
から受ける超音波振動をワイヤ1に与える。この荷重と超音波信号によって、ワイヤ1は回路基板(不図示)上に位置する電極等の被接合部材5に接合される。
ラミック焼結体からなる。このようなセラミック焼結体は、硬度,剛性および機械的強度(以下、これらをまとめて機械的特性と記載する場合がある。)がいずれも高い。セラミック焼結体は、例えば、酸化アルミニウムの含有量の含有量が例えば50質量%より大きく80質量%以下、炭化チタンの含有量が20質量%より大きく50質量%未満となっている。
る。また、セラミック焼結体に含まれる各元素の含有量は、蛍光X 線分析装置またはI
CP(Inductively Coupled Plasma)発光分光分析装置によって求めることができる。具体的には、X線回折装置によって酸化アルミニウムや炭化チタンが同定された場合には、アルミニウムおよびチタンの含有量を測定し、アルミニウムは酸化物(Al2O3)に、チタンは炭化物(TiC)にそれぞれ換算すればよい。
り、セラミック焼結体の平均結晶粒径を求めることができる。
TiO2+CO→TiO+CO2・・・(1)
TiO+TiC→TiCxOy(x+y<1、かつx≫y)・・・(2)
方加圧焼結(HIP)を行なうことで、機械的強度をより高くできる。例えば、3点曲げ強度が800MPa以上のウエッジボンディング用部品を得ることもできる。
1602:1995,JIS R 1601:2008(ISO14704:2000(MOD)),JIS C 2141:1992に準拠して測定した。これらの測定値を表に示した。
の試料10本を切り出した。切り出しには、ダイヤモンドブレードを備えたスライシングマシーンを用いた。切り出した各試料について、切断面に発生するチッピングの長さを測定し、その最大値を表に示している。この観察は、光学顕微鏡を用いて倍率400倍で行った。なお、ダイヤモンドブレードにはSD1200を用い、このダイヤモンドブレードの回転数を10000rpm、送り速度を100mm/分とし、1回の切り込み量を2mmとして切り出した。以下、チッピングの最大値が比較的小さいことを欠損性が高いともいう。また、チッピングの最大値が比較的大きいことを欠損性が低いともいう。
て解析し、セラミック焼結体の平均結晶粒径を求め、その値を表3に示した。
例のボンディングロッドの場合、30万回のボンディングを繰り返した後でも摩耗量は30μm以下であった。一方、比較例のボンディングロッドでは、10万回のボンディングを繰り返した段階で、摩耗量は100μmを超えていた。酸化アルミニウムを主成分とし、副成分として炭化チタンを含むセラミック焼結体からなる試料No.20を用いた場合、比較例とくらべて耐久性が著しく高くなっていた。また、10万回のボンディングを終了した後にボンディングロッドの先端面の状態を、顕微鏡で観察した。比較例の先端面には、摩耗によって生じたパーティクルが複数付着していたが、試料No.20の実施例の
方はパーティクルは確認することができなかった。
2:ボンディングツール
3:ワイヤフィード機構
4:振動伝達機構
5:被接合部材
31:ドラム
32:第1ワイヤガイド
33:第2ワイヤガイド
34:支持台
35:ワイヤクランプ
41:超音波発振器
42:ボルト締めランジュバン型振動子
43:コーン
44:ホーン
Claims (5)
- ワイヤと接触する表面を備え、該表面の少なくとも一部が、酸化アルミニウムを主成分とし、副成分として炭化チタンを含むセラミック焼結体からなり、
前記セラミック焼結体は、前記ワイヤを押圧する溝を有しているとともに、前記溝の表面に、前記溝の延伸方向に対して斜め方向に延びる複数の凸条部を有していることを特徴とするウエッジボンディング用部品。 - 前記セラミック焼結体は、炭化チタンを30質量%以上40質量%以下含有することを特徴とする請求項1に記載のウエッジボンディング用部品。
- 前記セラミック焼結体は、イッテルビウムを酸化物換算で0.06質量%以上かつ0.2質量%以下含有することを特徴とする請求項1または請求項2に記載のウエッジボンディング用部品。
- 前記セラミック焼結体は、平均結晶粒径が0.1μm以上かつ0.9μm以下であることを特徴とする請求項1乃至請求項3のいずれかに記載のウエッジボンディング用部品。
- 前記セラミック焼結体における前記ワイヤとの接触面は、炭化チタンの結晶粒子に比べて、酸化アルミニウムの結晶粒子が突出していることを特徴とする請求項1乃至請求項4のいずれかに記載のウエッジボンディング用部品。
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Application Number | Priority Date | Filing Date | Title |
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JP2015015481 | 2015-01-29 | ||
JP2015015481 | 2015-01-29 |
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JPH05206194A (ja) * | 1992-01-27 | 1993-08-13 | Shinagawa Refract Co Ltd | アルミナ系ボンディングキャピラリ |
JPH06314721A (ja) * | 1993-04-28 | 1994-11-08 | Kyocera Corp | ワイヤボンディング用キャピラリ |
JP3016223U (ja) * | 1995-03-24 | 1995-09-26 | 超音波工業株式会社 | 超音波ボンディング用ウェッジツール |
JPH09232386A (ja) * | 1996-02-23 | 1997-09-05 | Nec Kansai Ltd | ワイヤボンダ |
JPH11135534A (ja) * | 1997-10-31 | 1999-05-21 | Hitachi Ltd | 半導体装置 |
JP2000058603A (ja) * | 1998-08-10 | 2000-02-25 | Fuji Electric Co Ltd | 超音波ワイヤボンダ |
JP2008078442A (ja) * | 2006-09-22 | 2008-04-03 | Kyocera Corp | ワイヤボンディング用クランプ部材 |
US20140103095A1 (en) * | 2011-09-20 | 2014-04-17 | Orthodyne Electronics Corporation | Wire bonding tool |
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JPH0645389A (ja) | 1992-07-21 | 1994-02-18 | Shinagawa Refract Co Ltd | ボンディングツール |
JPH07178568A (ja) | 1993-10-08 | 1995-07-18 | Honda Motor Co Ltd | 抵抗溶接用電極及びその製造方法 |
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JPH05206194A (ja) * | 1992-01-27 | 1993-08-13 | Shinagawa Refract Co Ltd | アルミナ系ボンディングキャピラリ |
JPH06314721A (ja) * | 1993-04-28 | 1994-11-08 | Kyocera Corp | ワイヤボンディング用キャピラリ |
JP3016223U (ja) * | 1995-03-24 | 1995-09-26 | 超音波工業株式会社 | 超音波ボンディング用ウェッジツール |
JPH09232386A (ja) * | 1996-02-23 | 1997-09-05 | Nec Kansai Ltd | ワイヤボンダ |
JPH11135534A (ja) * | 1997-10-31 | 1999-05-21 | Hitachi Ltd | 半導体装置 |
JP2000058603A (ja) * | 1998-08-10 | 2000-02-25 | Fuji Electric Co Ltd | 超音波ワイヤボンダ |
JP2008078442A (ja) * | 2006-09-22 | 2008-04-03 | Kyocera Corp | ワイヤボンディング用クランプ部材 |
US20140103095A1 (en) * | 2011-09-20 | 2014-04-17 | Orthodyne Electronics Corporation | Wire bonding tool |
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US20180019224A1 (en) | 2018-01-18 |
CN107210243A (zh) | 2017-09-26 |
JPWO2016121873A1 (ja) | 2017-10-19 |
WO2016121873A1 (ja) | 2016-08-04 |
JP6748263B2 (ja) | 2020-08-26 |
US10147701B2 (en) | 2018-12-04 |
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