JP2019179910A5 - - Google Patents
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- Publication number
- JP2019179910A5 JP2019179910A5 JP2018070150A JP2018070150A JP2019179910A5 JP 2019179910 A5 JP2019179910 A5 JP 2019179910A5 JP 2018070150 A JP2018070150 A JP 2018070150A JP 2018070150 A JP2018070150 A JP 2018070150A JP 2019179910 A5 JP2019179910 A5 JP 2019179910A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- heat
- dissipating
- insulating resin
- dissipating insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 14
- 238000001723 curing Methods 0.000 claims 3
- 239000010954 inorganic particle Substances 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- -1 oxetane compound Chemical class 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018070150A JP7142453B2 (ja) | 2018-03-30 | 2018-03-30 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
| CN201980016406.XA CN111788870B (zh) | 2018-03-30 | 2019-03-26 | 散热绝缘性树脂组合物和使用其的印刷电路板 |
| PCT/JP2019/012839 WO2019189171A1 (ja) | 2018-03-30 | 2019-03-26 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
| KR1020207030064A KR102679624B1 (ko) | 2018-03-30 | 2019-03-26 | 방열 절연성 수지 조성물, 및 그것을 사용한 프린트 배선판 |
| TW108111133A TWI813658B (zh) | 2018-03-30 | 2019-03-29 | 散熱絕緣性樹脂組成物及使用其之印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018070150A JP7142453B2 (ja) | 2018-03-30 | 2018-03-30 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019179910A JP2019179910A (ja) | 2019-10-17 |
| JP2019179910A5 true JP2019179910A5 (enrdf_load_stackoverflow) | 2021-05-06 |
| JP7142453B2 JP7142453B2 (ja) | 2022-09-27 |
Family
ID=68061822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018070150A Active JP7142453B2 (ja) | 2018-03-30 | 2018-03-30 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7142453B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102679624B1 (enrdf_load_stackoverflow) |
| CN (1) | CN111788870B (enrdf_load_stackoverflow) |
| TW (1) | TWI813658B (enrdf_load_stackoverflow) |
| WO (1) | WO2019189171A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102546928B1 (ko) | 2020-04-28 | 2023-06-23 | 주식회사 파루인쇄전자 | 고열전도성 절연 페이스트를 이용한 방열장치 |
| CN118055972B (zh) * | 2021-10-04 | 2024-11-19 | 东京油墨株式会社 | 散热性间隙填料用树脂组合物、散热性间隙填料和物品 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224561A (ja) | 1993-01-25 | 1994-08-12 | Ibiden Co Ltd | 放熱構造プリント配線板及びその製造方法 |
| JP3659825B2 (ja) | 1997-12-19 | 2005-06-15 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
| JP3989349B2 (ja) * | 2002-09-30 | 2007-10-10 | 京セラケミカル株式会社 | 電子部品封止装置 |
| JP5089885B2 (ja) | 2006-01-17 | 2012-12-05 | 太陽ホールディングス株式会社 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
| JP5104507B2 (ja) * | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP5497300B2 (ja) * | 2008-02-07 | 2014-05-21 | 日東電工株式会社 | 無機−ポリマー複合材、粘着剤層および粘着フィルム |
| JP2012111807A (ja) | 2010-11-22 | 2012-06-14 | Uniplus Electronics Co Ltd | 熱硬化性樹脂組成物及びその熱硬化性樹脂組成物を使用したプリプレグシート又は積層板 |
| JP2012214612A (ja) * | 2011-03-31 | 2012-11-08 | Aica Kogyo Co Ltd | シリコーン放熱部材 |
| KR101333260B1 (ko) * | 2012-02-10 | 2013-11-26 | 동현전자 주식회사 | 고열 전도성 절연 재료용 수지 조성물 및 절연 필름 |
| KR101687394B1 (ko) * | 2013-06-17 | 2016-12-16 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트 |
| JP6428032B2 (ja) * | 2014-08-06 | 2018-11-28 | Jnc株式会社 | 樹脂組成物、それを用いた放熱塗料および電子部品 |
| JP6478351B2 (ja) | 2017-08-29 | 2019-03-06 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法 |
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2018
- 2018-03-30 JP JP2018070150A patent/JP7142453B2/ja active Active
-
2019
- 2019-03-26 WO PCT/JP2019/012839 patent/WO2019189171A1/ja active Application Filing
- 2019-03-26 CN CN201980016406.XA patent/CN111788870B/zh active Active
- 2019-03-26 KR KR1020207030064A patent/KR102679624B1/ko active Active
- 2019-03-29 TW TW108111133A patent/TWI813658B/zh active