JP2019179910A5 - - Google Patents

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Publication number
JP2019179910A5
JP2019179910A5 JP2018070150A JP2018070150A JP2019179910A5 JP 2019179910 A5 JP2019179910 A5 JP 2019179910A5 JP 2018070150 A JP2018070150 A JP 2018070150A JP 2018070150 A JP2018070150 A JP 2018070150A JP 2019179910 A5 JP2019179910 A5 JP 2019179910A5
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JP
Japan
Prior art keywords
resin composition
heat
dissipating
insulating resin
dissipating insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018070150A
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Japanese (ja)
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JP7142453B2 (en
JP2019179910A (en
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Publication date
Application filed filed Critical
Priority claimed from JP2018070150A external-priority patent/JP7142453B2/en
Priority to JP2018070150A priority Critical patent/JP7142453B2/en
Priority to PCT/JP2019/012839 priority patent/WO2019189171A1/en
Priority to KR1020207030064A priority patent/KR20200136946A/en
Priority to CN201980016406.XA priority patent/CN111788870A/en
Priority to TW108111133A priority patent/TWI813658B/en
Publication of JP2019179910A publication Critical patent/JP2019179910A/en
Publication of JP2019179910A5 publication Critical patent/JP2019179910A5/ja
Publication of JP7142453B2 publication Critical patent/JP7142453B2/en
Application granted granted Critical
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Claims (6)

（Ａ）放熱性無機粒子、（Ｂ）硬化性樹脂組成物を含有してなる放熱絶縁性樹脂組成物であって、前記（Ａ）放熱性無機粒子が少なくとも（Ａ−１）β−炭化ケイ素を含有し、かつ、前記（Ａ）放熱性無機粒子の体積占有率が、前記放熱絶縁性樹脂組成物の硬化物全容量に対して６０容量％以上であることを特徴とする放熱絶縁性樹脂組成物。 A heat-dissipating insulating resin composition containing (A) heat-dissipating inorganic particles and (B) curable resin composition, wherein the (A) heat-dissipating inorganic particles are at least (A-1) β-silicon carbide. The heat-dissipating insulating resin (A) is characterized in that the volume occupancy of the heat-dissipating inorganic particles is 60% by volume or more based on the total volume of the cured product of the heat-dissipating insulating resin composition. Composition. 前記（Ｂ）硬化性樹脂組成物が、（Ｂ−１）熱硬化性樹脂組成物であることを特徴とする請求項１に記載の放熱絶縁性樹脂組成物。 The heat-dissipating insulating resin composition according to claim 1, wherein the (B) curable resin composition is (B-1) a thermosetting resin composition. 前記（Ｂ−１）熱硬化性樹脂組成物が、エポキシ化合物および／またはオキセタン化合物と、硬化剤および／または硬化触媒を含有することを特徴とする請求項２に記載の放熱絶縁性樹脂組成物。 The heat-dissipating insulating resin composition according to claim 2 , wherein the (B-1) thermosetting resin composition contains an epoxy compound and / or an oxetane compound, and a curing agent and / or a curing catalyst. .. 前記（Ｂ）硬化性樹脂組成物が、（Ｂ−２）光硬化性樹脂組成物であることを特徴とする請求項１に記載の放熱絶縁性樹脂組成物。 The heat-dissipating insulating resin composition according to claim 1, wherein the (B) curable resin composition is (B-2) a photocurable resin composition. 前記（Ｂ−２）光硬化性樹脂組成物が、一分子中に１個以上のエチレン性不飽和結合を有する化合物と、光重合開始剤を含有することを特徴とする請求項４に記載の放熱絶縁性樹脂組成物。 The fourth aspect of claim 4, wherein the (B-2) photocurable resin composition contains a compound having one or more ethylenically unsaturated bonds in one molecule and a photopolymerization initiator. Heat-dissipating insulating resin composition. 前記請求項１〜５のいずれか一項に記載の放熱絶縁性樹脂組成物を、熱硬化および／または光硬化して得られる硬化物により、絶縁層および／またはソルダーレジスト層が形成されてなることを特徴とするプリント配線板。 An insulating layer and / or a solder resist layer is formed by a cured product obtained by thermally curing and / or photocuring the heat-dissipating insulating resin composition according to any one of claims 1 to 5. A printed wiring board characterized by that.
JP2018070150A 2018-03-30 2018-03-30 Heat dissipation insulating resin composition and printed wiring board using the same Active JP7142453B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018070150A JP7142453B2 (en) 2018-03-30 2018-03-30 Heat dissipation insulating resin composition and printed wiring board using the same
PCT/JP2019/012839 WO2019189171A1 (en) 2018-03-30 2019-03-26 Heat-dissipating insulating resin composition, and printed wiring board in which same is used
KR1020207030064A KR20200136946A (en) 2018-03-30 2019-03-26 Heat-dissipating insulating resin composition, and printed wiring board using same
CN201980016406.XA CN111788870A (en) 2018-03-30 2019-03-26 Heat-dissipating insulating resin composition and printed wiring board using same
TW108111133A TWI813658B (en) 2018-03-30 2019-03-29 Heat dissipation insulating resin composition and printed wiring board using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018070150A JP7142453B2 (en) 2018-03-30 2018-03-30 Heat dissipation insulating resin composition and printed wiring board using the same

Publications (3)

Publication Number Publication Date
JP2019179910A JP2019179910A (en) 2019-10-17
JP2019179910A5 true JP2019179910A5 (en) 2021-05-06
JP7142453B2 JP7142453B2 (en) 2022-09-27

Family

ID=68061822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018070150A Active JP7142453B2 (en) 2018-03-30 2018-03-30 Heat dissipation insulating resin composition and printed wiring board using the same

Country Status (5)

Country Link
JP (1) JP7142453B2 (en)
KR (1) KR20200136946A (en)
CN (1) CN111788870A (en)
TW (1) TWI813658B (en)
WO (1) WO2019189171A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102546928B1 (en) 2020-04-28 2023-06-23 주식회사 파루인쇄전자 Heat-dissipating apparatus using insulative paste of high thermal conductive

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224561A (en) 1993-01-25 1994-08-12 Ibiden Co Ltd Heat dissipating structure printed board and its manufacture
JP3659825B2 (en) 1997-12-19 2005-06-15 太陽インキ製造株式会社 Photocurable / thermosetting composition capable of alkali development and cured film obtained therefrom
JP5089885B2 (en) * 2006-01-17 2012-12-05 太陽ホールディングス株式会社 Thermal insulation resin composition and printed wiring board using the same
JP5497300B2 (en) * 2008-02-07 2014-05-21 日東電工株式会社 Inorganic-polymer composite, adhesive layer and adhesive film
JP2012111807A (en) * 2010-11-22 2012-06-14 Uniplus Electronics Co Ltd Thermosetting resin composition and prepreg sheet or laminated board using the thermosetting resin composition
JP6428032B2 (en) * 2014-08-06 2018-11-28 Jnc株式会社 Resin composition, heat radiation paint and electronic component using the same
JP6478351B2 (en) * 2017-08-29 2019-03-06 互応化学工業株式会社 Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board

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