JP2020200427A5 - - Google Patents
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- JP2020200427A5 JP2020200427A5 JP2019110319A JP2019110319A JP2020200427A5 JP 2020200427 A5 JP2020200427 A5 JP 2020200427A5 JP 2019110319 A JP2019110319 A JP 2019110319A JP 2019110319 A JP2019110319 A JP 2019110319A JP 2020200427 A5 JP2020200427 A5 JP 2020200427A5
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- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- group
- mass
- independently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 claims 16
- 239000003431 cross linking reagent Substances 0.000 claims 5
- 229920001955 polyphenylene ether Polymers 0.000 claims 4
- 125000001424 substituent group Chemical group 0.000 claims 4
- 229920005992 thermoplastic resin Polymers 0.000 claims 4
- 150000002430 hydrocarbons Chemical group 0.000 claims 3
- 125000005647 linker group Chemical group 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 150000001451 organic peroxides Chemical class 0.000 claims 3
- 229920006395 saturated elastomer Polymers 0.000 claims 3
- 229930195734 saturated hydrocarbon Natural products 0.000 claims 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims 3
- -1 vinyl aromatic compound Chemical class 0.000 claims 3
- 229920002554 vinyl polymer Polymers 0.000 claims 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 229920001400 block copolymer Polymers 0.000 claims 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 2
- 239000003063 flame retardant Substances 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000001491 aromatic compounds Chemical class 0.000 claims 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
Claims (14)
Xは、a価の任意の連結基であり、aは2.5以上の数であり、
R5は、各々独立に任意の置換基であり、kは各々独立に1~4の整数であり、k個あるR5のうちの少なくとも1つは、下記式(2):
で表される部分構造を含み、
Yは、各々独立に下記式(3):
で表される構造を有する2価の連結基であり、nはYの繰り返し数を表し、各々独立に1~200の整数であり、
Lは、任意の2価の連結基、又は単結合であり、かつ
Aは、各々独立に、炭素-炭素二重結合及び/又はエポキシ結合を含有する置換基を示す}
で表される構造を有し、かつ数平均分子量が500~8,000であるポリフェニレンエーテル成分A;
(b)炭素-炭素不飽和二重結合を1分子中に2個有する芳香族化合物を含む、架橋剤;及び
(c)有機過酸化物;
を含む樹脂組成物。 (A) The following formula (1):
X is an arbitrary linking group of a value, and a is a number of 2.5 or more.
R 5 is an independently arbitrary substituent, k is an integer of 1 to 4 independently, and at least one of the k R 5s is the following equation (2) :.
Including the partial structure represented by
Y is independently expressed by the following equation (3):
It is a divalent linking group having a structure represented by, n represents the number of repetitions of Y, and is an integer of 1 to 200 independently.
L is an arbitrary divalent linking group or a single bond, and A indicates a substituent containing a carbon-carbon double bond and / or an epoxy bond, respectively}.
Polyphenylene ether component A having a structure represented by and having a number average molecular weight of 500 to 8,000;
(B) A cross-linking agent containing an aromatic compound having two carbon-carbon unsaturated double bonds in one molecule ; and (c) an organic peroxide;
A resin composition containing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019110319A JP2020200427A (en) | 2019-06-13 | 2019-06-13 | Polyphenylene ether-containing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019110319A JP2020200427A (en) | 2019-06-13 | 2019-06-13 | Polyphenylene ether-containing resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020200427A JP2020200427A (en) | 2020-12-17 |
JP2020200427A5 true JP2020200427A5 (en) | 2022-05-06 |
Family
ID=73741841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019110319A Pending JP2020200427A (en) | 2019-06-13 | 2019-06-13 | Polyphenylene ether-containing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2020200427A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2022172759A1 (en) * | 2021-02-10 | 2022-08-18 | ||
WO2022239631A1 (en) * | 2021-05-11 | 2022-11-17 | 旭化成株式会社 | Novel terminal-modified polyphenylene ether and terminal-modified polyphenylene ether composition |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5176336B2 (en) * | 2006-03-15 | 2013-04-03 | 三菱瓦斯化学株式会社 | Polyvinylbenzyl ether compound and curable resin composition and curable film containing the same |
JP2019023263A (en) * | 2017-07-25 | 2019-02-14 | パナソニックIpマネジメント株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board |
-
2019
- 2019-06-13 JP JP2019110319A patent/JP2020200427A/en active Pending
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