JP2020200427A5 - - Google Patents

Claims (14)

(A) The following formula (1):

{In the ceremony,
X is an arbitrary linking group of a value, and a is a number of 2.5 or more.
R ⁵ is an independently arbitrary substituent, k is an integer of 1 to 4 independently, and at least one of the k R ^5s is the following equation (2) :.

(In the formula, R ¹¹ is an independently C _1-8 alkyl group, R ¹² is an independent C _1-8 alkylene group, b is an independent 0 or 1, and R is R. Reference numeral ¹³ indicates a hydrogen atom, either an alkyl group or a phenyl group of C _1-8 , and the alkyl group, the alkylene group and the phenyl group have a substituent to the extent that the condition of C _1-8 is satisfied. good)
Including the partial structure represented by
Y is independently expressed by the following equation (3):

(In the formula, R ²¹ is an independently saturated or unsaturated hydrocarbon group of C _1-6 , and R ²² is an independently hydrogen atom or a saturated or unsaturated hydrocarbon group of C _1-6 , respectively. And the saturated or unsaturated hydrocarbon group may have a substituent as long as the condition of C _1-6 is satisfied).
It is a divalent linking group having a structure represented by, n represents the number of repetitions of Y, and is an integer of 1 to 200 independently.
L is an arbitrary divalent linking group or a single bond, and A indicates a substituent containing a carbon-carbon double bond and / or an epoxy bond, respectively}.
Polyphenylene ether component A having a structure represented by and having a number average molecular weight of 500 to 8,000;
(B) A cross-linking agent containing an aromatic compound having two carbon-carbon unsaturated double bonds in one molecule ; and (c) an organic peroxide;
A resin composition containing. The resin composition according to claim 1, wherein the weight ratio of the polyphenylene ether component A: the cross-linking agent is 25:75 to 95: 5. The resin composition according to claim 1 or 2, wherein the cross-linking agent contains divinylbenzene. The resin composition according to any one of claims 1 to 3, wherein the organic peroxide has a 1-minute half-life temperature of 155 ° C to 185 ° C. One of claims 1 to 4, wherein the content of the organic peroxide is 0.05 parts by mass to 5 parts by mass based on 100 parts by mass of the total mass of the polyphenylene ether component A and the cross-linking agent. The resin composition according to the section. The resin composition further comprises a thermoplastic resin, and the thermoplastic resin is made from a block copolymer of a vinyl aromatic compound and an olefin-based alken compound, a hydrogenated product thereof, and a homopolymer of the vinyl aromatic compound. Any of claims 1 to 5, which is at least one selected from the group consisting of, and has a content of 20% by mass or more of the unit derived from the vinyl aromatic compound of the block copolymer or the hydrogenated product thereof. The resin composition according to item 1. The resin composition according to claim 6, wherein the thermoplastic resin has a weight average molecular weight of 10,000 to 300,000. The resin composition according to claim 6 or 7, wherein the content of the thermoplastic resin is 2 parts by mass to 20 parts by mass based on the total mass of 100 parts by mass of the polyphenylene ether component A and the cross-linking agent. Any one of claims 1 to 8, wherein the resin composition further contains a flame retardant, and the flame retardant is incompatible with other contained components in the resin composition after curing of the resin composition. The resin composition according to. An electronic circuit board material comprising the resin composition according to any one of claims 1 to 9. A resin film containing the resin composition according to any one of claims 1 to 9. A prepreg which is a composite of a base material and the resin composition according to any one of claims 1 to 9. The prepreg according to claim 12, wherein the base material is glass cloth. A laminate of the resin film according to claim 11 or the cured product of the prepreg according to claim 12 or 13 and a metal foil.