JP2007277525A5 - Adhesive composition for electronic equipment, adhesive sheet for electronic equipment using the same, and electronic component - Google Patents
Adhesive composition for electronic equipment, adhesive sheet for electronic equipment using the same, and electronic component Download PDFInfo
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- JP2007277525A5 JP2007277525A5 JP2007051097A JP2007051097A JP2007277525A5 JP 2007277525 A5 JP2007277525 A5 JP 2007277525A5 JP 2007051097 A JP2007051097 A JP 2007051097A JP 2007051097 A JP2007051097 A JP 2007051097A JP 2007277525 A5 JP2007277525 A5 JP 2007277525A5
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- 239000000853 adhesive Substances 0.000 title claims description 27
- 230000001070 adhesive Effects 0.000 title claims description 24
- 239000000203 mixture Substances 0.000 title claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 claims description 4
- 230000001681 protective Effects 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 125000004432 carbon atoms Chemical group C* 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000000962 organic group Chemical group 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 125000003566 oxetanyl group Chemical group 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- -1 characterized in Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 206010024855 Loss of consciousness Diseases 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
本発明は、電子機器用接着剤組成物、電子機器用接着剤シートおよびそれを用いた電子部品に関する。さらに詳しくは、半導体集積回路を実装する際に用いられる、テープオートメーテッドボンディング（ＴＡＢ）方式のパターン加工テープ、ボールグリッドアレイ（ＢＧＡ）パッケージ用インターポーザー等の半導体接続用基板、リードフレーム固定テープ、ＬＯＣ固定テープ、半導体素子等の電子部品とリードフレームや絶縁性支持基板などの支持部材との接着に用いられるダイボンディング材、ヒートスプレッダー、補強板、シールド材の接着剤、ソルダーレジスト、異方導電性フィルム、銅張り積層板、カバーレイ、回路間の絶縁層等各種の電子材料を作製するために適した電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート、電子部品に関する。 The present invention is an adhesive composition for electronic devices, about the adhesive sheets and electronics electronic components using the same. More specifically, a tape-automated bonding (TAB) pattern processing tape, a semiconductor connection substrate such as a ball grid array (BGA) package interposer, a lead frame fixing tape, which are used when mounting a semiconductor integrated circuit, Die bonding materials, heat spreaders, reinforcing plates, shielding material adhesives, solder resists, anisotropic conductive materials used for bonding LOC fixing tape, electronic components such as semiconductor elements, and supporting members such as lead frames and insulating support substrates sex film, copper clad laminate, cover lay, electronics adhesive composition suitable for making an insulating layer such as various electronic material between the circuit and the adhesive sheet for electronic device using the same, electronic components about the.
本発明は、このような問題点を解決し、長期高温耐性に優れた電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート、電子部品を提供することを目的とする。 The present invention is to solve such problems, superior electronics adhesive composition-term high temperature resistance and an electronic device for the adhesive sheets using the same, and to provide an electronic component.
すなわち本発明は、ａ）熱可塑性樹脂、ｂ）熱硬化性樹脂、ｃ）硬化剤、及びｄ）下記一般式（１）で表される３官能性シロキサン単位を有するオルガノポリシロキサンを含有し、前記ｄ）一般式（１）で表される３官能性シロキサン単位を有するオルガノポリシロキサンの含有量が、ｂ）熱硬化性樹脂１００重量部に対して１００重量部以上７００重量部以下であることを特徴とする電子機器用接着剤組成物、それを用いた電子機器用接着剤シート、電子部品である。また、本発明は、ａ）熱可塑性樹脂、ｂ）熱硬化性樹脂、ｃ）硬化剤、及びｅ）下記一般式（２）で表される構造を有するオルガノポリシロキサンを含有することを特徴とする電子機器用接着剤組成物、それを用いた電子機器用接着剤シート、電子部品である。 That is, the present invention contains a) a thermoplastic resin, b) a thermosetting resin, c) a curing agent, and d) an organopolysiloxane having a trifunctional siloxane unit represented by the following general formula (1) . D) The content of the organopolysiloxane having a trifunctional siloxane unit represented by the general formula (1) is 100 parts by weight or more and 700 parts by weight or less with respect to 100 parts by weight of the thermosetting resin. electronics adhesive composition, characterized in, adhesive sheet for electronic device using the same, an electronic component. Further, the present invention is characterized by containing a) a thermoplastic resin, b) a thermosetting resin, c) a curing agent, and e) an organopolysiloxane having a structure represented by the following general formula (2). electronics adhesive composition, the adhesive sheet for electronic device using the same, an electronic component.
実施例１〜９、比較例１〜２
（接着剤シートの作製）
表１〜３に記載の各無機質充填剤を、無機質充填剤が２０重量％となるようにトルエンと混合した後、ボールミル処理して分散液を作製した。この分散液に、各熱硬化性樹脂、オルガノポリシロキサン、熱可塑性樹脂、硬化剤、硬化促進剤、その他添加剤および分散液とメチルエチルケトンを、それぞれ表１〜３に記載の組成比および固形分２０重量％となるように加え、３０℃で撹拌、混合して接着剤溶液を作製した。無機質充填剤を含まない場合は、各熱硬化性樹脂、オルガノポリシロキサン、熱可塑性樹脂、硬化剤、硬化促進剤、その他添加剤に固形分２０重量％となるようにメチルエチルケトンを添加し、それぞれ表１〜３の組成比となるようにし、３０℃で撹拌、混合して接着剤溶液を作製した。この接着剤溶液をバーコータで、シリコーン離型剤付きの厚さ３８μｍのポリエチレンテレフタレートフィルム（藤森工業(株)製“フィルムバイナ”ＧＴ）に必要な乾燥厚さとなるように塗布し、１５０℃で４分間乾燥し、保護フィルムを貼り合わせて、本発明の接着剤シートを作製した。
Example 1-9, Comparative Examples 1-2
(Preparation of adhesive sheet)
Each inorganic filler listed in Tables 1 to 3 was mixed with toluene so that the inorganic filler was 20% by weight, and then ball milled to prepare a dispersion. In this dispersion, each thermosetting resin, organopolysiloxane, thermoplastic resin, curing agent, curing accelerator, other additives, and the dispersion and methyl ethyl ketone are respectively mixed in the composition ratios and solid content 20 shown in Tables 1 to 3. It added so that it might become weight%, and it stirred and mixed at 30 degreeC and produced the adhesive agent solution. When inorganic filler is not included, methyl ethyl ketone is added to each thermosetting resin, organopolysiloxane, thermoplastic resin, curing agent, curing accelerator, and other additives so that the solid content is 20% by weight. The composition ratio was 1 to 3, and the mixture was stirred and mixed at 30 ° C. to prepare an adhesive solution. This adhesive solution was applied with a bar coater to a dry thickness necessary for a 38 μm-thick polyethylene terephthalate film with a silicone release agent (“Film Vina” GT manufactured by Fujimori Kogyo Co., Ltd.) It dried for minutes and bonded the protective film and produced the adhesive sheet of this invention.
実施例２と実施例５について、マイグレーション評価を行ったところ、実施例５は外観の変化は見られなかった。一方、実施例２はデンドライドが確認された。その他の特性は同じであった。 When migration evaluation was performed on Example 2 and Example 5 , no change in the appearance of Example 5 was observed. On the other hand, dendride was confirmed in Example 2 . Other characteristics were the same.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007051097A JP5109411B2 (en) | 2006-03-16 | 2007-03-01 | Adhesive composition for electronic device, adhesive sheet for electronic device using the same, and electronic component |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006072157 | 2006-03-16 | ||
| JP2006072157 | 2006-03-16 | ||
| JP2007051097A JP5109411B2 (en) | 2006-03-16 | 2007-03-01 | Adhesive composition for electronic device, adhesive sheet for electronic device using the same, and electronic component |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007277525A JP2007277525A (en) | 2007-10-25 |
| JP2007277525A5 true JP2007277525A5 (en) | 2010-02-04 |
| JP5109411B2 JP5109411B2 (en) | 2012-12-26 |
Family
ID=38679298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007051097A Active JP5109411B2 (en) | 2006-03-16 | 2007-03-01 | Adhesive composition for electronic device, adhesive sheet for electronic device using the same, and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5109411B2 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4983166B2 (en) * | 2006-09-06 | 2012-07-25 | 住友ベークライト株式会社 | Resin composition and semiconductor device produced using resin composition |
| JP5266696B2 (en) * | 2007-09-19 | 2013-08-21 | 東レ株式会社 | Adhesive composition for electronic equipment and adhesive sheet for electronic equipment using the same |
| US8138580B2 (en) | 2007-09-19 | 2012-03-20 | Toray Industries, Inc. | Adhesive composition for electronic components, and adhesive sheet for electronic components using the same |
| JP2009091566A (en) * | 2007-09-19 | 2009-04-30 | Toray Ind Inc | Adhesive composition and adhesive sheet using it |
| KR101392442B1 (en) * | 2008-01-11 | 2014-05-07 | 도레이첨단소재 주식회사 | Liquid adhesive for electronic parts and method for applying to a lead-frame using the same |
| JP2009203337A (en) * | 2008-02-27 | 2009-09-10 | Lintec Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device |
| JP4806815B2 (en) * | 2008-03-31 | 2011-11-02 | リンテック株式会社 | Adhesive composition, adhesive sheet and method for producing semiconductor device |
| JP5544819B2 (en) * | 2009-10-20 | 2014-07-09 | 住友金属鉱山株式会社 | Epoxy group-containing adhesive resin composition and optical semiconductor adhesive using the same |
| JP5544843B2 (en) * | 2009-11-27 | 2014-07-09 | 住友金属鉱山株式会社 | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
| JP5804820B2 (en) * | 2011-07-25 | 2015-11-04 | 日東電工株式会社 | Adhesive sheet for manufacturing semiconductor device, semiconductor device having adhesive sheet for manufacturing semiconductor device, and method for manufacturing semiconductor device |
| JP6547221B2 (en) * | 2014-12-16 | 2019-07-24 | リンテック株式会社 | Adhesive for die bonding |
| JP6672837B2 (en) * | 2016-01-28 | 2020-03-25 | 日立化成株式会社 | Anisotropic conductive adhesive composition, film adhesive, connection structure, and semiconductor device |
| CN108885410A (en) * | 2016-03-31 | 2018-11-23 | 富士胶片株式会社 | The manufacturing method of electronic material manufacture medical fluid, pattern forming method, the manufacturing method of semiconductor device, electronic material are manufactured with medical fluid, container and quality inspection method |
| JP2018060856A (en) * | 2016-10-03 | 2018-04-12 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Coating composition and optical semiconductor device |
| WO2018212233A1 (en) * | 2017-05-17 | 2018-11-22 | 株式会社ダイセル | Curable composition for adhesive agent, adhesive sheet, cured article, laminate, and apparatus |
| WO2019150433A1 (en) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | Thermosetting resin composition, film-form adhesive, adhesive sheet, and method for producing semiconductor device |
| KR102357279B1 (en) * | 2019-06-10 | 2022-01-28 | 주식회사 엘지화학 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3777734B2 (en) * | 1996-10-15 | 2006-05-24 | 東レ株式会社 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same |
| JPH10178251A (en) * | 1996-10-15 | 1998-06-30 | Toray Ind Inc | Board for connecting semiconductor integrated circuit, parts constituting it, and semiconductor device |
| JP2001031943A (en) * | 1999-07-26 | 2001-02-06 | Tomoegawa Paper Co Ltd | Adhesive for semiconductor and adhesive tape for semiconductor |
| JP4763876B2 (en) * | 2000-05-23 | 2011-08-31 | 日東電工株式会社 | Thermosetting adhesive composition and adhesive sheets |
| JP2002060716A (en) * | 2000-08-24 | 2002-02-26 | Hitachi Chem Co Ltd | Low-elastic adhesive, low-elastic adhesive member, substrate for loading semiconductor having low-elastic adhesive member and semiconductor device using the same |
-
2007
- 2007-03-01 JP JP2007051097A patent/JP5109411B2/en active Active
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