JP2008063551A5 - Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same - Google Patents
Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same Download PDFInfo
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- JP2008063551A5 JP2008063551A5 JP2006315158A JP2006315158A JP2008063551A5 JP 2008063551 A5 JP2008063551 A5 JP 2008063551A5 JP 2006315158 A JP2006315158 A JP 2006315158A JP 2006315158 A JP2006315158 A JP 2006315158A JP 2008063551 A5 JP2008063551 A5 JP 2008063551A5
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- adhesive
- electronic equipment
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- adhesive composition
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- 239000000853 adhesive Substances 0.000 title claims description 25
- 230000001070 adhesive Effects 0.000 title claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims 3
- 230000000111 anti-oxidant Effects 0.000 claims 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 230000003078 antioxidant Effects 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 239000002530 phenolic antioxidant Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 230000001681 protective Effects 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 206010024855 Loss of consciousness Diseases 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
本発明は、電子機器用接着剤組成物、電子機器用接着剤シートおよびそれを用いた電子部品に関する。さらに詳しくは、半導体集積回路を実装する際に用いられる、テープオートメーテッドボンディング（ＴＡＢ）方式のパターン加工テープ、ボールグリッドアレイ（ＢＧＡ）パッケージ用インターポーザー等の半導体接続用基板、リードフレーム固定テープ、ＬＯＣ固定テープ、半導体素子等の電子部品とリードフレームや絶縁性支持基板などの支持部材との接着に用いられるダイボンディング材、ヒートスプレッダー、補強板、シールド材の接着剤、ソルダーレジスト、異方導電性フィルム、銅張り積層板、カバーレイ、半導体用封止剤、回路間の絶縁層等各種の電子材料を作製するために適した電子機器用接着剤組成物、電子機器用接着剤シートおよびそれを用いた電子部品に関する。 The present invention is an adhesive composition for electronic devices, about the adhesive sheets and electronics electronic components using the same. More specifically, a tape-automated bonding (TAB) pattern processing tape, a semiconductor connection substrate such as a ball grid array (BGA) package interposer, a lead frame fixing tape, which are used when mounting a semiconductor integrated circuit, Die bonding materials, heat spreaders, reinforcing plates, shielding material adhesives, solder resists, anisotropic conductive materials used for bonding LOC fixing tape, electronic components such as semiconductor elements, and supporting members such as lead frames and insulating support substrates Adhesive composition for electronic equipment, adhesive sheet for electronic equipment, and the like suitable for producing various electronic materials such as conductive films, copper-clad laminates, coverlays, semiconductor sealants, insulating layers between circuits about the electronic components that were used.
本発明は、このような問題点を解決し、長期高温耐性に優れた電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート、電子部品を提供することを目的とする。 The present invention is to solve such problems, superior electronics adhesive composition-term high temperature resistance and an electronic device for the adhesive sheets using the same, and to provide an electronic component.
すなわち本発明は、ａ）熱硬化性樹脂、ｂ）硬化剤、ｃ）オルガノポリシロキサンを側鎖に有する重合体、およびｄ）炭素数１〜８の側鎖を有するアクリル酸エステルおよび／またはメタクリル酸エステルを必須共重合成分とする共重合体を含有することを特徴とする電子機器用接着剤組成物、それを用いた電子機器用接着剤シート、電子部品である。 That is, the present invention relates to a) a thermosetting resin, b) a curing agent, c) a polymer having an organopolysiloxane in the side chain, and d) an acrylic ester and / or methacryl having a side chain having 1 to 8 carbon atoms. ester essential copolymerization component to copolymer electronics adhesive composition characterized by containing, adhesive sheet for electronic device using the same, an electronic component.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006315158A JP5087910B2 (en) | 2005-12-13 | 2006-11-22 | Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005358536 | 2005-12-13 | ||
| JP2005358536 | 2005-12-13 | ||
| JP2006215530 | 2006-08-08 | ||
| JP2006215530 | 2006-08-08 | ||
| JP2006315158A JP5087910B2 (en) | 2005-12-13 | 2006-11-22 | Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008063551A JP2008063551A (en) | 2008-03-21 |
| JP2008063551A5 true JP2008063551A5 (en) | 2009-12-03 |
| JP5087910B2 JP5087910B2 (en) | 2012-12-05 |
Family
ID=39286524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006315158A Active JP5087910B2 (en) | 2005-12-13 | 2006-11-22 | Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5087910B2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4983166B2 (en) * | 2006-09-06 | 2012-07-25 | 住友ベークライト株式会社 | Resin composition and semiconductor device produced using resin composition |
| TW200913181A (en) * | 2007-07-10 | 2009-03-16 | Arakawa Chem Ind | Optical semiconductor-sealing composition |
| JP2011100927A (en) * | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | Bonding agent composition |
| JP5391158B2 (en) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | Wafer sticking adhesive sheet and wafer processing method using the same |
| WO2014021450A1 (en) * | 2012-08-02 | 2014-02-06 | リンテック株式会社 | Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device |
| JP6374199B2 (en) * | 2014-03-31 | 2018-08-15 | 日東電工株式会社 | Die bond film, dicing die bond film and laminated film |
| JP2016083918A (en) * | 2014-10-29 | 2016-05-19 | 学校法人関東学院 | Biocompatible laminate and biocompatible electronic component |
| JP2016111210A (en) * | 2014-12-08 | 2016-06-20 | 信越化学工業株式会社 | Conductive connection method using die bond material, and optical semiconductor device |
| WO2019150433A1 (en) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | Thermosetting resin composition, film-form adhesive, adhesive sheet, and method for producing semiconductor device |
| JP7421498B2 (en) | 2018-12-28 | 2024-01-24 | リンテック株式会社 | Film adhesive, laminate sheet, composite sheet, and method for producing laminate |
| CN113165349A (en) * | 2018-12-28 | 2021-07-23 | 琳得科株式会社 | Film-like adhesive, laminate sheet, composite sheet, and method for producing laminate |
| JP7421497B2 (en) | 2018-12-28 | 2024-01-24 | リンテック株式会社 | Film adhesive, laminate sheet, composite sheet, and method for producing laminate |
| JP7251167B2 (en) * | 2019-01-28 | 2023-04-04 | 株式会社レゾナック | FILM ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| CN113316622B (en) * | 2019-08-05 | 2023-07-07 | 株式会社Lg化学 | Adhesive film, method for manufacturing the same, and foldable display device including the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2582875B2 (en) * | 1988-11-01 | 1997-02-19 | 日東電工株式会社 | Removable adhesive |
| JP2948638B2 (en) * | 1990-08-23 | 1999-09-13 | 関西ペイント株式会社 | Curable resin composition |
| JPH0948957A (en) * | 1995-08-07 | 1997-02-18 | Sony Chem Corp | Manufacture of double-face adhesive tape |
| JP3777734B2 (en) * | 1996-10-15 | 2006-05-24 | 東レ株式会社 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same |
| JPH10265752A (en) * | 1997-03-25 | 1998-10-06 | Hitachi Chem Co Ltd | Adhesive for additive-type printed circuit board |
| JP4824876B2 (en) * | 2001-08-01 | 2011-11-30 | 三井化学株式会社 | Circuit connection paste material |
| JP4420266B2 (en) * | 2001-11-30 | 2010-02-24 | 三井化学株式会社 | Paste resin composition for circuit connection and method of using the same |
| JP2003165826A (en) * | 2001-11-30 | 2003-06-10 | Mitsui Chemicals Inc | Paste resin composition for connecting circuit and method for using the same |
| JP2005298781A (en) * | 2004-04-06 | 2005-10-27 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for flexible wiring circuit board and adhesive film |
| JP2006001652A (en) * | 2004-06-15 | 2006-01-05 | Uwa:Kk | Auxiliary device for suspension stabilization by crane |
| JP4305311B2 (en) * | 2004-07-16 | 2009-07-29 | ダイキン工業株式会社 | Micro shunt |
-
2006
- 2006-11-22 JP JP2006315158A patent/JP5087910B2/en active Active
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