WO2019150433A1 - Thermosetting resin composition, film-form adhesive, adhesive sheet, and method for producing semiconductor device - Google Patents

Thermosetting resin composition, film-form adhesive, adhesive sheet, and method for producing semiconductor device Download PDF

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Publication number
WO2019150433A1
WO2019150433A1 PCT/JP2018/002982 JP2018002982W WO2019150433A1 WO 2019150433 A1 WO2019150433 A1 WO 2019150433A1 JP 2018002982 W JP2018002982 W JP 2018002982W WO 2019150433 A1 WO2019150433 A1 WO 2019150433A1
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WO
WIPO (PCT)
Prior art keywords
film
adhesive
resin composition
component
thermosetting resin
Prior art date
Application number
PCT/JP2018/002982
Other languages
French (fr)
Japanese (ja)
Inventor
大輔 舛野
祐樹 中村
慎太郎 橋本
健太 菊地
智陽 山崎
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2018/002982 priority Critical patent/WO2019150433A1/en
Priority to KR1020207021944A priority patent/KR102561428B1/en
Priority to JP2019569003A priority patent/JP7283399B2/en
Priority to PCT/JP2019/001538 priority patent/WO2019150995A1/en
Priority to SG11202006827RA priority patent/SG11202006827RA/en
Priority to CN201980009495.5A priority patent/CN111630643B/en
Priority to TW108103139A priority patent/TWI785196B/en
Publication of WO2019150433A1 publication Critical patent/WO2019150433A1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J119/00—Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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Definitions

  • the present invention relates to a thermosetting resin composition, a film adhesive, an adhesive sheet, and a method for manufacturing a semiconductor device.
  • silver paste is mainly used for joining a semiconductor chip and a support member for mounting the semiconductor chip.
  • the supporting members used are also required to be miniaturized and densified.
  • problems such as occurrence of defects during wire bonding due to protrusion of the paste or inclination of the semiconductor chip, difficulty in controlling the film thickness, and generation of voids may occur.
  • a film adhesive for joining a semiconductor chip and a support member has been used (see, for example, Patent Document 1).
  • an adhesive sheet comprising a dicing tape and a film adhesive laminated on the dicing tape
  • the film adhesive is attached to the back surface of the semiconductor wafer, and the semiconductor wafer is separated into pieces by dicing.
  • a semiconductor chip with an adhesive can be obtained.
  • the obtained semiconductor chip with a film adhesive can be attached to a support member via a film adhesive and bonded by thermocompression bonding.
  • the film-like adhesive is used as FOW (Film Over Wire) which is a wire-embedded film-like adhesive or FOD (Film Over Die) which is a semiconductor chip-embedded film-like adhesive
  • FOW Flexible Over Wire
  • FOD Fin Off Die
  • high fluidity is required at the time of thermocompression bonding. Therefore, the frequency and amount of bleed tend to increase further. In some cases, the bleed may occur even on the upper surface of the semiconductor chip, which may lead to electrical failure or wire bonding failure.
  • the present invention has been made in view of such circumstances, and is a thermosetting resin capable of suppressing an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding.
  • the main purpose is to provide a composition.
  • One aspect of the present invention is an epoxy resin, a curing agent, a first elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group, and a second elastomer having no carboxy group and a hydroxyl group.
  • a thermosetting resin composition comprising: According to such a thermosetting resin composition, it is possible to suppress an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding.
  • the curing agent may contain a phenol resin.
  • the first elastomer may be an acrylic resin having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
  • the second elastomer may be an acrylic resin having no carboxy group and no hydroxyl group.
  • the epoxy resin may contain an epoxy resin that is liquid at 25 ° C.
  • thermosetting resin composition may further contain an inorganic filler. Moreover, the thermosetting resin composition may further contain a curing accelerator.
  • thermosetting resin composition is a semiconductor in which a first semiconductor element is wire-bonded to a substrate via a first wire, and a second semiconductor element is pressure-bonded on the first semiconductor element.
  • the second semiconductor element may be crimped and used to embed at least a part of the first wire.
  • the present invention further includes an epoxy resin, a curing agent, a first elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group, and a second elastomer having no carboxy group and a hydroxyl group,
  • the thermosetting resin composition containing the first semiconductor element is wire bonded to the substrate via the first wire, and the second semiconductor element is pressure-bonded on the first semiconductor element.
  • the second semiconductor element may be crimped and at least a part of the first wire may be embedded and applied as an adhesive or an adhesive manufacturing.
  • the present invention provides a film adhesive formed by forming the above-mentioned thermosetting resin composition into a film.
  • the present invention provides an adhesive sheet comprising a base material and the above-described film adhesive provided on the base material.
  • the substrate may be a dicing tape.
  • an adhesive sheet whose base material is a dicing tape may be referred to as a “dicing die bonding integrated adhesive sheet”.
  • the adhesive sheet may further include a protective film laminated on the surface opposite to the base of the film adhesive.
  • the present invention provides a wire bonding step of electrically connecting a first semiconductor element via a first wire on a substrate, and the above-described film shape on one side of the second semiconductor element.
  • a wire bonding step of electrically connecting a first semiconductor element via a first wire on a substrate, and the above-described film shape on one side of the second semiconductor element.
  • the first semiconductor chip is wire bonded to the semiconductor substrate via the first wire, and the second semiconductor chip is pressure-bonded to the first semiconductor chip via the adhesive film.
  • the first semiconductor chip may be a wire embedded type semiconductor device in which at least a part of the first wire is embedded in the adhesive film, and the first wire and the first semiconductor chip are embedded in the adhesive film. It may be a chip embedded semiconductor device.
  • thermosetting resin composition capable of suppressing an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding. Therefore, the film-like adhesive formed by forming the thermosetting resin composition into a film is FOD (Film Over Die) which is a semiconductor chip-embedded film-like adhesive or FOW which is a wire-embedded film-like adhesive. (Film Over Wire) may be useful. Moreover, according to this invention, the manufacturing method of the adhesive sheet using such a film adhesive and a semiconductor device is provided.
  • FIG. 1 is a schematic cross-sectional view showing a semiconductor device according to an embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. It is a schematic cross section which shows a series of processes of
  • (meth) acrylic acid means acrylic acid or methacrylic acid corresponding thereto.
  • thermosetting resin composition is a first resin having at least one functional group selected from the group consisting of (A) an epoxy resin, (B) a curing agent, and (C) a carboxy group and a hydroxyl group. And (D) a second elastomer having no carboxy group and no hydroxyl group.
  • the thermosetting resin composition can be in a completely cured product (C stage) state after the curing process through a semi-cured (B stage) state.
  • the component (A) can be used without particular limitation as long as it has an epoxy group in the molecule.
  • the component (A) for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type Epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, stilbene-type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, triphenolphenolmethane-type epoxy resin, biphenyl-type epoxy resin, xylylene-type epoxy resin, phenylaralkyl-type epoxy Diglycidies of polycyclic aromatics such as resins, biphenyl aralkyl type epoxy resins, naphthalene type epoxy resins, polyfunctional phenols and anthracene And ether compounds.
  • the component (A) preferably has a 150 ° C. melt viscosity of 1.0 Pa ⁇ s or less from the viewpoint of fluidity.
  • the epoxy resin may contain the epoxy resin which is liquid at 25 degreeC.
  • the epoxy equivalent of the component (A) is not particularly limited, but may be 90 to 300 g / eq, 110 to 290 g / eq, or 110 to 290 g / eq. When the epoxy equivalent of the component (A) is in such a range, the fluidity tends to be secured while maintaining the bulk strength of the film adhesive.
  • Examples of commercially available components (A) include HP-7200 series manufactured by DIC Corporation, YDCN series manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., NC-3000 series and NC-7000 series manufactured by Nippon Kayaku Co., Ltd., and the like. It is done.
  • (B) There is no restriction
  • a component a phenol resin, an ester compound, an aromatic amine, an aliphatic amine, an acid anhydride etc. are mentioned, for example. You may use these individually by 1 type or in combination of 2 or more types. Among these, from the viewpoint of reactivity and stability over time, the component (B) may contain a phenol resin.
  • the phenol resin can be used without particular limitation as long as it has a phenolic hydroxyl group in the molecule.
  • examples of the phenol resin include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and / or naphthols such as ⁇ -naphthol, ⁇ -naphthol, dihydroxynaphthalene, and formaldehyde.
  • a novolak-type phenol resin obtained by condensation or co-condensation with a compound having an aldehyde group in the presence of an acidic catalyst phenols such as allylated bisphenol A, allylated bisphenol F, allylated naphthalenediol, phenol novolak, phenol, and / or Or phenol aralkyl resins, naphthol aralkyl resins, biphenyl aralkyl type resins synthesized from naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl Examples thereof include an enol resin and a phenylaralkyl type phenol resin.
  • the phenol resin has a water absorption of 2% by mass or less in a constant temperature and humidity chamber of 85 ° C. and 85% RH for 48 hours, and a thermogravimetric analyzer (TGA). It is preferable that the heating mass decrease rate (heating rate: 5 ° C./min, atmosphere: nitrogen) at 350 ° C. measured in step 1 is less than 5% by mass.
  • phenol resins examples include Phenolite KA series, TD series (manufactured by DIC Corporation), Millex XLC series, XL series (manufactured by Mitsui Chemicals), and HE series (manufactured by Air Water Corporation). Can be mentioned.
  • the hydroxyl equivalent of the phenol resin is not particularly limited, but may be 80 to 250 g / eq, 90 to 200 g / eq, or 100 to 180 g / eq.
  • the adhesive strength tends to be maintained higher while maintaining the fluidity of the film adhesive.
  • the ratio of the epoxy equivalent of component (A) to the hydroxyl equivalent of component (B) is 0.30 / 0.70 to 0.70 from the viewpoint of curability. /0.30, 0.35 / 0.65 to 0.65 / 0.35, 0.40 / 0.60 to 0.60 / 0.40, or 0.45 / 0.55 to 0.55 / It may be 0.45.
  • the equivalent ratio is 0.30 / 0.70 or more, more sufficient curability tends to be obtained.
  • the equivalent ratio is 0.70 / 0.30 or less, the viscosity can be prevented from becoming too high, and more sufficient fluidity can be obtained.
  • the total content of the component (A) and the component (B) may be 10 to 80% by mass based on the total amount of the thermosetting resin composition.
  • the total content of the component (A) and the component (B) may be 20% by mass or more, 25% by mass or more, or 30% by mass or more, and is 70% by mass or less, 60% by mass or less, or 50% by mass. % Or less.
  • the total content of the component (A) and the component (B) is 10% by mass or more based on the total amount of the thermosetting resin composition, sufficient adhesive force tends to be obtained.
  • the viscosity can be prevented from becoming too low, and the amount of bleed can be reduced. There is a tendency to be able to suppress more.
  • Component (C) is an elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
  • the component (C) preferably has a glass transition temperature (Tg) of the polymer constituting the elastomer of 50 ° C. or lower.
  • the component (C) is not particularly limited as long as it has at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
  • an acrylic resin, a polyester resin, a polyamide resin, a polyimide resin, a silicone resin examples thereof include butadiene resins, acrylonitrile resins, and modified products thereof having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
  • the component (C) may be an acrylic resin having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group from the viewpoint of solubility in a solvent and fluidity.
  • the acrylic resin means a polymer containing a structural unit derived from a (meth) acrylic acid ester.
  • the acrylic resin is preferably a polymer including a structural unit derived from a (meth) acrylic acid ester having an alcoholic or phenolic hydroxyl group or a carboxy group as a structural unit.
  • the acrylic resin may be an acrylic rubber such as a copolymer of (meth) acrylic acid ester and acrylonitrile.
  • the glass transition temperature (Tg) of the component (C) may be ⁇ 50 to 50 ° C. or ⁇ 30 to 30 ° C. If the Tg of the acrylic resin is ⁇ 50 ° C. or higher, the thermosetting resin composition tends to be prevented from becoming too flexible. Thereby, it becomes easy to cut
  • the glass transition temperature (Tg) means a value measured using a DSC (thermal differential scanning calorimeter) (for example, “Thermo Plus 2” manufactured by Rigaku Corporation).
  • the weight average molecular weight (Mw) of the component (C) may be 100,000 to 3 million or 500,000 to 2 million.
  • Mw means a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.
  • the acid value of the component (C) having a carboxy group may be 1 to 60 mgKOH / g, 3 to 50 mgKOH / g, or 5 to 40 mgKOH / g from the viewpoint of curability.
  • the acid value is in such a range, gelation in the varnish and a decrease in fluidity in the B stage state tend to be prevented.
  • the hydroxyl value of the component (C) having a hydroxyl group may be 1 to 60 mgKOH / g, 3 to 50 mgKOH / g, or 5 to 40 mgKOH / g from the viewpoint of curability.
  • the hydroxyl value is in such a range, gelation in the varnish and a decrease in fluidity in the B stage state tend to be prevented.
  • Examples of the commercially available component (C) include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23 (all manufactured by Nagase ChemteX Corporation).
  • Component (D) is an elastomer having no carboxy group and no hydroxyl group.
  • the component (D) preferably has a glass transition temperature (Tg) of the polymer constituting the elastomer of 50 ° C. or lower.
  • the component (D) is not particularly limited as long as it does not have a carboxy group and a hydroxyl group, and examples thereof include acrylic resins, polyester resins, polyamide resins, polyimide resins, silicone resins, butadiene resins, acrylonitrile resins, and modified products thereof. And what does not have a carboxy group and a hydroxyl group is mentioned.
  • the component (D) may be an acrylic resin having no carboxy group and no hydroxyl group from the viewpoint of solubility in a solvent and fluidity.
  • the acrylic resin has the same meaning as described above.
  • the acrylic resin is preferably a polymer containing a functional monomer (such as (meth) acrylic acid ester) having an epoxy group such as a glycidyl group as a structural unit.
  • the acrylic resin may be an acrylic rubber such as a copolymer of (meth) acrylic acid ester and acrylonitrile.
  • the glass transition temperature (Tg) of the component (D) may be ⁇ 50 to 50 ° C. or ⁇ 30 to 30 ° C. If the Tg of the acrylic resin is ⁇ 50 ° C. or higher, the thermosetting resin composition tends to be prevented from becoming too flexible. Thereby, it becomes easy to cut
  • the glass transition temperature (Tg) means a value measured using a DSC (thermal differential scanning calorimeter) (for example, “Thermo Plus 2” manufactured by Rigaku Corporation).
  • the weight average molecular weight (Mw) of the component (D) may be 100,000 to 3 million or 500,000 to 2 million.
  • Mw means a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.
  • Examples of the commercially available component (D) include SG-P3, SG-80H, and HTR-860P-3CSP (all manufactured by Nagase ChemteX Corporation).
  • the total content of the component (C) and the component (D) is 20 to 150 parts by mass, 30 to 100 parts by mass, or 40 to 70 with respect to 100 parts by mass of the total amount of the components (A) and (B). It may be a mass part.
  • the total content of the component (C) and the component (D) is 20 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A) and the component (B)
  • the film formability tends to be more excellent.
  • the total content of the component (C) and the component (D) is 150 parts by mass or less with respect to 100 parts by mass of the total amount of the component (A) and the component (B)
  • embedding tends to be more excellent.
  • Mass ratio of component (C) to the total amount of component (C) and component (D) in the thermosetting resin composition May be between 0.01 and 0.50.
  • the mass ratio may be 0.02 or more, 0.03 or more, or 0.05 or more, and may be 0.30 or less, 0.20 or less, or 0.10 or less.
  • the mass ratio of the component (C) to the component (C) and the component (D) is 0.01 or more, the increase in the amount of bleed during the high-temperature pressure treatment tends to be further suppressed.
  • the mass ratio of the component (C) to the component (C) and the component (D) is 0.50 or less, better embedding property tends to be maintained.
  • thermosetting resin composition according to the present embodiment may further contain (E) an inorganic filler.
  • the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystal Examples thereof include crystalline silica and amorphous silica. These may be used individually by 1 type and may be used in combination of 2 or more type.
  • the inorganic filler may contain aluminum oxide, aluminum nitride, boron nitride, crystalline silica, or amorphous silica. Further, from the viewpoint of adjusting the melt viscosity of the thermosetting resin composition and from the viewpoint of imparting thixotropic properties to the thermosetting resin composition, the inorganic filler is aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, Calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystalline silica or amorphous silica may be included.
  • the average particle diameter of the component (E) may be 0.005 to 0.5 ⁇ m or 0.05 to 0.3 ⁇ m from the viewpoint of further improving the adhesiveness.
  • an average particle diameter means the value calculated
  • the component may be surface-treated with a surface treatment agent from the viewpoint of compatibility between the surface and the solvent, other components, and the like, and adhesive strength.
  • a surface treatment agent include a silane coupling agent.
  • the functional group of the silane coupling agent include a vinyl group, a (meth) acryloyl group, an epoxy group, a mercapto group, an amino group, a diamino group, an alkoxy group, and an ethoxy group.
  • the content of the component (E) is 10 to 90 parts by mass or 10 to 50 parts by mass with respect to 100 parts by mass of the total amount of the components (A), (B), (C), and (D). It may be. Adhesion before hardening that content of (E) component is 10 mass parts or more with respect to 100 mass parts of total amounts of (A) component, (B) component, (C) component, and (D) component The dicing property of the layer is improved, and the adhesive force of the adhesive layer after curing tends to be improved. When the content of the component (E) is 90 parts by mass or less with respect to 100 parts by mass of the total amount of the components (A), (B), (C), and (D), the fluidity is lowered. And the elastic modulus of the cured film adhesive can be prevented from becoming too high.
  • thermosetting resin composition according to this embodiment may further contain (F) a curing accelerator.
  • a hardening accelerator is not specifically limited, What is generally used can be used.
  • the component (F) include imidazoles and derivatives thereof, organic phosphorus compounds, secondary amines, tertiary amines, quaternary ammonium salts, and the like. You may use these individually by 1 type or in combination of 2 or more types. Among these, from the viewpoint of reactivity, the component (F) may be imidazoles and derivatives thereof.
  • imidazoles examples include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, and the like. You may use these individually by 1 type or in combination of 2 or more types.
  • the content of the component (F) is 0.04 to 3 parts by mass or 0.04 to 0.04 to 100 parts by mass of the total amount of the components (A), (B), (C), and (D). It may be 0.2 parts by mass.
  • content of (F) component exists in such a range, it exists in the tendency which can make sclerosis
  • thermosetting resin composition according to the present embodiment may further contain an antioxidant, a silane coupling agent, a rheology control agent, and the like as other components.
  • the content of these components may be 0.02 to 3 parts by mass with respect to 100 parts by mass as the total of components (A), (B), (C), and (D).
  • the adhesive composition according to this embodiment may be used as an adhesive varnish diluted with a solvent.
  • the solvent is not particularly limited as long as it can dissolve components other than the component (E).
  • the solvent include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; aliphatic hydrocarbons such as hexane and heptane; cyclic alkanes such as methylcyclohexane; tetrahydrofuran, 1,4-dioxane and the like.
  • Cyclic ether such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone; ester such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, ⁇ -butyrolactone; Examples thereof include carbonic acid esters such as ethylene carbonate and propylene carbonate; amides such as N, N-dimethylformamide, N, N-dimethylacetamide and N-methyl-2-pyrrolidone. You may use these individually by 1 type or in combination of 2 or more types.
  • the solvent may be toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, or cyclohexane from the viewpoints of solubility and boiling point.
  • the solid component concentration in the adhesive varnish may be 10 to 80% by mass based on the total mass of the adhesive varnish.
  • Adhesive varnish mixes (A) component, (B) component, (C) component, (D) component and solvent, and (E) component, (F) component, and other components as necessary It can be prepared by kneading. Mixing and kneading can be performed by appropriately combining dispersers such as a normal stirrer, a raking machine, a triple roll, a ball mill, and a bead mill.
  • the mixing time can be reduced by mixing the component (E) and the low molecular weight component in advance and then blending the high molecular weight component.
  • bubbles in the varnish may be removed by vacuum degassing or the like.
  • FIG. 1 is a schematic cross-sectional view showing a film adhesive according to an embodiment.
  • the film adhesive 10 is formed by forming the above-described adhesive composition into a film.
  • the film adhesive 10 may be in a semi-cured (B stage) state.
  • Such a film adhesive 10 can be formed by applying an adhesive composition to a support film.
  • the film adhesive 10 can be formed by applying the adhesive varnish to a support film and removing the solvent by heating and drying.
  • the support film is not particularly limited, and examples thereof include films of polytetrafluoroethylene, polyethylene, polypropylene, polymethylpentene, polyethylene terephthalate, polyimide, and the like.
  • the thickness of the support film may be, for example, 60 to 200 ⁇ m or 70 to 170 ⁇ m.
  • a known method can be used, for example, knife coating method, roll coating method, spray coating method, gravure coating method, bar coating method, curtain coating method, etc. It is done.
  • the conditions for the heat drying are not particularly limited as long as the solvent used is sufficiently volatilized, but may be, for example, 50 to 200 ° C. for 0.1 to 90 minutes.
  • the thickness of the film adhesive can be appropriately adjusted according to the application.
  • the thickness of the film adhesive may be 20 to 200 ⁇ m, 30 to 200 ⁇ m, or 40 to 150 ⁇ m from the viewpoint of sufficiently embedding irregularities such as a semiconductor chip, a wire, and a wiring circuit of a substrate.
  • FIG. 2 is a schematic cross-sectional view showing an adhesive sheet according to an embodiment.
  • the adhesive sheet 100 includes a base material 20 and the above-described film adhesive 10 provided on the base material.
  • the substrate 20 is not particularly limited, but may be a substrate film.
  • the base film may be the same as the above support film.
  • the base material 20 may be a dicing tape.
  • Such an adhesive sheet can be used as a dicing die bonding integrated adhesive sheet. In this case, since the lamination process to the semiconductor wafer is performed once, the work efficiency can be improved.
  • the dicing tape examples include plastic films such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyimide film.
  • the dicing tape may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment as necessary.
  • the dicing tape is preferably one having adhesiveness.
  • Such a dicing tape may be one obtained by imparting adhesiveness to the above-mentioned plastic film, or may be one obtained by providing an adhesive layer on one side of the above-mentioned plastic film.
  • the adhesive sheet 100 can be formed by applying an adhesive composition to a base film in the same manner as the above-described method for forming a film adhesive.
  • the method for applying the adhesive composition to the substrate 20 may be the same as the method for applying the adhesive composition to the support film.
  • the adhesive sheet 100 may be formed using a film adhesive prepared in advance.
  • the adhesive sheet 100 can be formed by laminating under a predetermined condition (for example, room temperature (20 ° C.) or a heated state) using a roll laminator, a vacuum laminator, or the like. Since the adhesive sheet 100 can be continuously manufactured and has high efficiency, it is preferably formed using a roll laminator in a heated state.
  • the thickness of the film adhesive 10 may be 20 to 200 ⁇ m, 30 to 200 ⁇ m, or 40 to 150 ⁇ m from the viewpoint of embedding properties such as unevenness of a semiconductor chip, a wire, a wiring circuit of a substrate, and the like.
  • the thickness of the film adhesive 10 is 20 ⁇ m or more, a sufficient adhesive force tends to be obtained, and when the thickness of the film adhesive 10 is 200 ⁇ m or less, it is economical and the semiconductor device It is possible to meet the demand for downsizing.
  • FIG. 3 is a schematic cross-sectional view showing an adhesive sheet according to another embodiment.
  • the adhesive sheet 110 further includes a protective film 30 laminated on the surface of the film adhesive 10 opposite to the base 20.
  • the protective film 30 may be the same as the above support film.
  • the thickness of the protective film may be, for example, 15 to 200 ⁇ m or 70 to 170 ⁇ m.
  • FIG. 4 is a schematic cross-sectional view showing a semiconductor device according to an embodiment.
  • the first semiconductor element Wa in the first stage is wire-bonded to the substrate 14 via the first wire 88, and the second semiconductor element Waa is formed on the first semiconductor element Wa.
  • the semiconductor device is a semiconductor device in which at least a part of the first wire 88 is embedded in the film adhesive 10 by being pressure-bonded via the film adhesive 10.
  • the semiconductor device is a semiconductor device in which the first wire 88 and the first semiconductor element Wa are embedded even if the semiconductor device is a wire embedded type semiconductor device in which at least a part of the first wire 88 is embedded. May be.
  • the substrate 14 and the second semiconductor element Waa are further electrically connected via the second wire 98, and the second semiconductor element Waa is sealed with the sealing material 42. ing.
  • the thickness of the first semiconductor element Wa may be 10 to 170 ⁇ m, and the thickness of the second semiconductor element Waa may be 20 to 400 ⁇ m.
  • the first semiconductor element Wa embedded in the film adhesive 10 is a controller chip for driving the semiconductor device 200.
  • the substrate 14 is composed of an organic substrate 90 having two circuit patterns 84 and 94 formed on the surface thereof.
  • the first semiconductor element Wa is pressure-bonded onto the circuit pattern 94 via an adhesive 41.
  • the second semiconductor element Waa is interposed via the film adhesive 10 so that the circuit pattern 94, the first semiconductor element Wa, and the circuit pattern 84 to which the first semiconductor element Wa is not bonded are covered. Crimped to the substrate 14.
  • a film adhesive 10 is embedded in the uneven steps due to the circuit patterns 84 and 94 on the substrate 14.
  • the second semiconductor element Waa, the circuit pattern 84, and the second wire 98 are sealed with a resin sealing material 42.
  • a die-bonding step embedded in the adhesive is
  • the semiconductor device 200 is a semiconductor device in which a first wire 88 and a first semiconductor element Wa are embedded, and is manufactured by the following procedure.
  • the first semiconductor element Wa having the adhesive 41 is crimped onto the circuit pattern 94 on the substrate 14, and the circuit pattern 84 on the substrate 14 and the first pattern are connected to each other via the first wire 88.
  • the first semiconductor element Wa is electrically bonded and connected (first wire bonding step).
  • the adhesive sheet 100 is laminated on one side of a semiconductor wafer (for example, thickness 100 ⁇ m, size: 8 inches), and the base material 20 is peeled off, whereby the film-like adhesive 10 (for example, thickness) is applied to one side of the semiconductor wafer. 110 ⁇ m). Then, after the dicing tape is bonded to the film adhesive 10, the dicing tape is diced to a predetermined size (for example, 7.5 mm square), whereby the second film adhesive 10 is applied as shown in FIG. The semiconductor element Waa is obtained (laminating step).
  • the temperature condition of the laminating process may be 50-100 ° C or 60-80 ° C.
  • the temperature in the laminating step is 50 ° C. or higher, good adhesion to the semiconductor wafer can be obtained.
  • the temperature of the laminating process is 100 ° C. or lower, the film-like adhesive 10 can be prevented from flowing excessively during the laminating process, so that it is possible to prevent a change in thickness and the like.
  • Examples of the dicing method include blade dicing using a rotary blade, and a method of cutting a film adhesive or both a wafer and a film adhesive with a laser.
  • the second semiconductor element Waa to which the film adhesive 10 is attached is pressure-bonded to the substrate 14 to which the first semiconductor element Wa is bonded via the first wire 88.
  • the first wire 88 and the first semiconductor element Wa are covered with the second semiconductor element Waa to which the film-like adhesive 10 is attached by the film-like adhesive 10.
  • the second semiconductor element Waa is fixed to the substrate 14 by pressing the second semiconductor element Waa to the substrate 14 (die bonding step).
  • the film adhesive 10 is preferably pressure-bonded for 0.5 to 3.0 seconds under conditions of 80 to 180 ° C. and 0.01 to 0.50 MPa.
  • the film adhesive 10 is pressed and heated for 5 minutes or more under the conditions of 60 to 175 ° C. and 0.3 to 0.7 MPa.
  • the circuit pattern 84, the second wire 98 and the second semiconductor element Waa are sealed with a sealing material 42.
  • the semiconductor device 200 can be manufactured through such steps.
  • the semiconductor device may be a wire embedded type semiconductor device in which at least a part of the first wire 88 is embedded.
  • Examples 1 to 5 and Comparative Examples 1 to 3 ⁇ Preparation of adhesive sheet>
  • a varnish of a thermosetting resin composition having a solid content of 40% by mass was prepared using cyclohexanone as a solvent.
  • the obtained varnish was filtered through a 100-mesh filter and vacuum degassed.
  • the varnish after vacuum defoaming was applied as a base film onto a polyethylene terephthalate (PET) film that had been subjected to a release treatment with a thickness of 38 ⁇ m.
  • PET polyethylene terephthalate
  • the applied varnish was heat-dried in two stages of 90 ° C. for 5 minutes, followed by 140 ° C. for 5 minutes.
  • an adhesive sheet provided with a film adhesive having a thickness of 110 ⁇ m in a semi-cured (B stage) state was obtained on the base film.
  • each component in Table 1 is as follows.
  • Epoxy resin A-1 Dicyclopentadiene skeleton-containing epoxy resin, manufactured by DIC Corporation, trade name: HP-7200L, epoxy equivalent: 242 to 252 g / eq
  • A-2 Cresol novolac type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name: YDCN-700-10, epoxy equivalent: 209 g / eq
  • A-3 Bisphenol F type epoxy resin (liquid at 25 ° C.), manufactured by DIC Corporation, trade name: EXA-830CRP, epoxy equivalent: 159 g / eq
  • Curing agent B-1 Biphenyl aralkyl type phenol resin, manufactured by Air Water Co., Ltd., trade name: HE-200C-10, hydroxyl group equivalent: 205 g / eq
  • B-2 Phenylaralkyl type phenol resin, manufactured by Air Water Co., Ltd., trade name: HE100C-30, hydroxyl group equivalent: 175 g
  • C-2 Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: SG-708-6, weight average molecular weight: 700,000, acid value: 9 mgKOH / g, Tg: 4 ° C.
  • C-3 Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: SG-280 EK23, weight average molecular weight: 900,000, acid value: 30 mgKOH / g, Tg: -29 ° C
  • Second elastomer D-1 Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: HTR-860P-3CSP, weight average molecular weight: 800,000, glycidyl group-containing monomer ratio: 3%, Tg: -7 °C
  • E Inorganic filler
  • E-1 Silica filler dispersion, fused silica, manufactured by Admatechs Co., Ltd., trade name: SC2050-HLG, average particle size: 0.50 ⁇ m
  • F
  • the film adhesive of the semiconductor chip A and the semiconductor wafer of the semiconductor chip B were pressure-bonded under the conditions of 120 ° C., 0.20 MPa, and 1.5 seconds to obtain an evaluation sample.
  • alignment was performed so that the semiconductor chip B that was previously crimped was in the center of the semiconductor chip A.
  • the evaluation sample thus obtained was observed for the presence or absence of observation of voids with an ultrasonic digital diagnostic imaging apparatus (Insight Inc., probe: 75 MHz), and when voids were observed, The ratio of the void area was calculated, and these analysis results were evaluated as embeddability.
  • the evaluation criteria are as follows. The results are shown in Table 1. A: No void was observed. B: Although voids were observed, the ratio was less than 5 area%. C: A void was observed, and the ratio was 5 area% or more.
  • thermosetting resin composition according to the present invention can suppress an increase in the amount of bleed during high-temperature pressure treatment while having good embedding property during thermocompression bonding. It was done.
  • thermosetting resin composition according to the present invention has a good embedding property at the time of thermocompression bonding, and can suppress an increase in the amount of bleed at the time of high-temperature pressure treatment.
  • a film-like adhesive formed by forming a product into a film can be useful as a chip-embedded film-like adhesive FOD (Film Over Die) or a wire-embedded film-like adhesive FOW (Film Over Wire) .
  • SYMBOLS 10 Film adhesive, 14 ... Substrate, 20 ... Base material, 30 ... Protective film, 41 ... Adhesive, 42 ... Sealing material, 84, 94 ... Circuit pattern, 88 ... First wire, 90 ... Organic substrate 98, second wire, 100, 110, adhesive sheet, 200, semiconductor device, Wa, first semiconductor element, Waa, second semiconductor element.

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Abstract

Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having at least one type of functional group selected from a group consisting of a carboxy group and a hydroxy group; and a second elastomer which does not have a carboxy group or a hydroxy group.

Description

熱硬化性樹脂組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法Thermosetting resin composition, film adhesive, adhesive sheet, and method for manufacturing semiconductor device
　本発明は、熱硬化性樹脂組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法に関する。 The present invention relates to a thermosetting resin composition, a film adhesive, an adhesive sheet, and a method for manufacturing a semiconductor device.
　従来、半導体チップと半導体チップ搭載用の支持部材との接合には、主に銀ペーストが使用されている。しかし、近年の半導体チップの小型化・集積化に伴い、使用される支持部材にも小型化、細密化が要求されるようになっている。その一方で、銀ペーストを用いる場合では、ペーストのはみ出し又は半導体チップの傾きに起因するワイヤボンディング時における不具合の発生、膜厚制御の困難性、ボイド発生等の問題が生じる場合がある。 Conventionally, silver paste is mainly used for joining a semiconductor chip and a support member for mounting the semiconductor chip. However, with the recent miniaturization and integration of semiconductor chips, the supporting members used are also required to be miniaturized and densified. On the other hand, when a silver paste is used, problems such as occurrence of defects during wire bonding due to protrusion of the paste or inclination of the semiconductor chip, difficulty in controlling the film thickness, and generation of voids may occur.
　そのため、近年、半導体チップと支持部材とを接合するためのフィルム状接着剤が使用されている（例えば、特許文献１参照）。ダイシングテープとダイシングテープ上に積層されたフィルム状接着剤とを備える接着シートを用いる場合、半導体ウェハの裏面にフィルム状接着剤を貼り付け、ダイシングによって半導体ウェハを個片化することによって、フィルム状接着剤付き半導体チップを得ることができる。得られたフィルム状接着剤付き半導体チップは、フィルム状接着剤を介して支持部材に貼り付け、熱圧着により接合することができる。 Therefore, in recent years, a film adhesive for joining a semiconductor chip and a support member has been used (see, for example, Patent Document 1). When using an adhesive sheet comprising a dicing tape and a film adhesive laminated on the dicing tape, the film adhesive is attached to the back surface of the semiconductor wafer, and the semiconductor wafer is separated into pieces by dicing. A semiconductor chip with an adhesive can be obtained. The obtained semiconductor chip with a film adhesive can be attached to a support member via a film adhesive and bonded by thermocompression bonding.
特開２００７－０５３２４０号公報JP 2007-053240 A
　しかしながら、半導体チップのサイズが小さくなるにつれて、加圧時に単位面積当たりにかかる力が大きくなるため、高温加圧処理（例えば、加圧キュア等）において、フィルム状接着剤が半導体チップからはみ出す、ブリードという現象が発生する場合がある。 However, as the size of the semiconductor chip is reduced, the force per unit area during pressurization increases, so that the film-like adhesive protrudes from the semiconductor chip in high-temperature pressurization processing (for example, pressure curing). May occur.
　また、フィルム状接着剤をワイヤ埋め込み型フィルム状接着剤であるＦＯＷ（Ｆｉｌｍ　Ｏｖｅｒ　Ｗｉｒｅ）又は半導体チップ埋め込み型フィルム状接着剤であるＦＯＤ（Ｆｉｌｍ　Ｏｖｅｒ　Ｄｉｅ）として用いる場合は、埋め込み性を向上させる観点から、熱圧着時に高い流動性が求められる。そのため、ブリードの発生頻度及び量がさらに増大する傾向にある。場合によっては、ブリードが半導体チップ上面にまで生じることがあり、これによって、電気不良又はワイヤボンディング不良につながるおそれがある。 In addition, when the film-like adhesive is used as FOW (Film Over Wire) which is a wire-embedded film-like adhesive or FOD (Film Over Die) which is a semiconductor chip-embedded film-like adhesive, a viewpoint of improving embedding property Therefore, high fluidity is required at the time of thermocompression bonding. Therefore, the frequency and amount of bleed tend to increase further. In some cases, the bleed may occur even on the upper surface of the semiconductor chip, which may lead to electrical failure or wire bonding failure.
　本発明は、このような実情に鑑みてなされたものであり、熱圧着時に良好な埋め込み性を有しつつ、高温加圧処理時のブリード量の増加を抑制することが可能な熱硬化性樹脂組成物を提供することを主な目的とする。 The present invention has been made in view of such circumstances, and is a thermosetting resin capable of suppressing an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding. The main purpose is to provide a composition.
　本発明の一側面は、エポキシ樹脂と、硬化剤と、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有する第１のエラストマと、カルボキシ基及び水酸基を有しない第２のエラストマと、を含有する、熱硬化性樹脂組成物を提供する。このような熱硬化性樹脂組成物によれば、熱圧着時に良好な埋め込み性を有しつつ、高温加圧処理時のブリード量の増加を抑制することが可能となる。 One aspect of the present invention is an epoxy resin, a curing agent, a first elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group, and a second elastomer having no carboxy group and a hydroxyl group. And a thermosetting resin composition comprising: According to such a thermosetting resin composition, it is possible to suppress an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding.
　硬化剤はフェノール樹脂を含んでいてよい。 The curing agent may contain a phenol resin.
　第１のエラストマはカルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するアクリル樹脂であってよい。また、第２のエラストマはカルボキシ基及び水酸基を有しないアクリル樹脂であってよい。 The first elastomer may be an acrylic resin having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group. The second elastomer may be an acrylic resin having no carboxy group and no hydroxyl group.
　エポキシ樹脂は２５℃で液体のエポキシ樹脂を含んでいてよい。 The epoxy resin may contain an epoxy resin that is liquid at 25 ° C.
　熱硬化性樹脂組成物は無機フィラーをさらに含有していてもよい。また、熱硬化性樹脂組成物は硬化促進剤をさらに含有していてもよい。 The thermosetting resin composition may further contain an inorganic filler. Moreover, the thermosetting resin composition may further contain a curing accelerator.
　熱硬化性樹脂組成物は、基板上に第１のワイヤを介して第１の半導体素子がワイヤボンディング接続されると共に、第１の半導体素子上に、第２の半導体素子が圧着されてなる半導体装置において、第２の半導体素子を圧着すると共に第１のワイヤの少なくとも一部を埋め込むために用いられるものであってよい。 The thermosetting resin composition is a semiconductor in which a first semiconductor element is wire-bonded to a substrate via a first wire, and a second semiconductor element is pressure-bonded on the first semiconductor element. In the apparatus, the second semiconductor element may be crimped and used to embed at least a part of the first wire.
　本発明はさらに、エポキシ樹脂と、硬化剤と、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有する第１のエラストマと、カルボキシ基及び水酸基を有しない第２のエラストマと、を含有する熱硬化性樹脂組成物の、基板上に第１のワイヤを介して第１の半導体素子がワイヤボンディング接続されると共に、第１の半導体素子上に、第２の半導体素子が圧着されてなる半導体装置において、第２の半導体素子を圧着すると共に第１のワイヤの少なくとも一部を埋め込むために用いられる、接着剤としての応用又は接着剤の製造のための応用に関してもよい。 The present invention further includes an epoxy resin, a curing agent, a first elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group, and a second elastomer having no carboxy group and a hydroxyl group, The thermosetting resin composition containing the first semiconductor element is wire bonded to the substrate via the first wire, and the second semiconductor element is pressure-bonded on the first semiconductor element. In the semiconductor device as described above, the second semiconductor element may be crimped and at least a part of the first wire may be embedded and applied as an adhesive or an adhesive manufacturing.
　別の側面において、本発明は、上述の熱硬化性樹脂組成物をフィルム状に形成してなるフィルム状接着剤を提供する。 In another aspect, the present invention provides a film adhesive formed by forming the above-mentioned thermosetting resin composition into a film.
　別の側面において、本発明は、基材と基材上に設けられた上述のフィルム状接着剤とを備える接着シートを提供する。 In another aspect, the present invention provides an adhesive sheet comprising a base material and the above-described film adhesive provided on the base material.
　基材は、ダイシングテープであってよい。なお、本明細書において、基材がダイシングテープである接着シートを「ダイシングダイボンディング一体型接着シート」という場合がある。 The substrate may be a dicing tape. In the present specification, an adhesive sheet whose base material is a dicing tape may be referred to as a “dicing die bonding integrated adhesive sheet”.
　接着シートは、フィルム状接着剤の基材とは反対側の面に積層された保護フィルムをさらに備えてもよい。 The adhesive sheet may further include a protective film laminated on the surface opposite to the base of the film adhesive.
　さらに、別の側面において、本発明は、基板上に第１のワイヤを介して第１の半導体素子を電気的に接続するワイヤボンディング工程と、第２の半導体素子の片面に、上述のフィルム状接着剤を貼付するラミネート工程と、フィルム状接着剤が貼付された第２の半導体素子を、フィルム状接着剤を介して圧着することで、第１のワイヤの少なくとも一部をフィルム状接着剤に埋め込むダイボンド工程と、を備える、半導体装置の製造方法を提供する。 Furthermore, in another aspect, the present invention provides a wire bonding step of electrically connecting a first semiconductor element via a first wire on a substrate, and the above-described film shape on one side of the second semiconductor element. By laminating the laminating step for applying the adhesive and the second semiconductor element to which the film adhesive is applied via the film adhesive, at least a part of the first wire is applied to the film adhesive. A method for manufacturing a semiconductor device is provided.
　なお、半導体装置は、半導体基板上に第１のワイヤを介して第１の半導体チップがワイヤボンディング接続されると共に、第１の半導体チップ上に、第２の半導体チップが接着フィルムを介して圧着されることで、第１のワイヤの少なくとも一部が接着フィルムに埋め込まれてなるワイヤ埋込型の半導体装置であってもよく、第１のワイヤ及び第１の半導体チップが接着フィルムに埋め込まれてなるチップ埋込型の半導体装置であってもよい。 In the semiconductor device, the first semiconductor chip is wire bonded to the semiconductor substrate via the first wire, and the second semiconductor chip is pressure-bonded to the first semiconductor chip via the adhesive film. As a result, it may be a wire embedded type semiconductor device in which at least a part of the first wire is embedded in the adhesive film, and the first wire and the first semiconductor chip are embedded in the adhesive film. It may be a chip embedded semiconductor device.
　本発明によれば、熱圧着時に良好な埋め込み性を有しつつ、高温加圧処理時のブリード量の増加を抑制することが可能な熱硬化性樹脂組成物が提供される。そのため、当該熱硬化性樹脂組成物をフィルム状に形成してなるフィルム状接着剤は、半導体チップ埋め込み型フィルム状接着剤であるＦＯＤ（Ｆｉｌｍ　Ｏｖｅｒ　Ｄｉｅ）又はワイヤ埋め込み型フィルム状接着剤であるＦＯＷ（Ｆｉｌｍ　Ｏｖｅｒ　Ｗｉｒｅ）として有用となり得る。また、本発明によれば、このようなフィルム状接着剤を用いた接着シート及び半導体装置の製造方法が提供される。 According to the present invention, there is provided a thermosetting resin composition capable of suppressing an increase in the amount of bleed during high-temperature pressure treatment while having good embedding properties during thermocompression bonding. Therefore, the film-like adhesive formed by forming the thermosetting resin composition into a film is FOD (Film Over Die) which is a semiconductor chip-embedded film-like adhesive or FOW which is a wire-embedded film-like adhesive. (Film Over Wire) may be useful. Moreover, according to this invention, the manufacturing method of the adhesive sheet using such a film adhesive and a semiconductor device is provided.
一実施形態に係るフィルム状接着剤を示す模式断面図である。It is a schematic cross section which shows the film adhesive which concerns on one Embodiment. 一実施形態に係る接着シートを示す模式断面図である。It is a schematic cross section which shows the adhesive sheet which concerns on one Embodiment. 他の実施形態に係る接着シートを示す模式断面図である。It is a schematic cross section which shows the adhesive sheet which concerns on other embodiment. 一実施形態に係る半導体装置を示す模式断面図である。1 is a schematic cross-sectional view showing a semiconductor device according to an embodiment. 一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. 一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. 一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. 一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment. 一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。It is a schematic cross section which shows a series of processes of the manufacturing method of the semiconductor device which concerns on one Embodiment.
　以下、図面を適宜参照しながら、本発明の実施形態について説明する。ただし、本発明は以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described with appropriate reference to the drawings. However, the present invention is not limited to the following embodiments.
　本明細書において、（メタ）アクリル酸はアクリル酸又はそれに対応するメタクリル酸を意味する。（メタ）アクリロイル基等の他の類似表現についても同様である。 In the present specification, (meth) acrylic acid means acrylic acid or methacrylic acid corresponding thereto. The same applies to other similar expressions such as a (meth) acryloyl group.
［熱硬化性樹脂組成物］
　本実施形態に係る熱硬化性樹脂組成物は、（Ａ）エポキシ樹脂と、（Ｂ）硬化剤と、（Ｃ）カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有する第１のエラストマと、（Ｄ）カルボキシ基及び水酸基を有しない第２のエラストマと、を含有する。熱硬化性樹脂組成物は、半硬化（Ｂステージ）状態を経て、硬化処理後に完全硬化物（Ｃステージ）状態となり得る。 [Thermosetting resin composition]
The thermosetting resin composition according to this embodiment is a first resin having at least one functional group selected from the group consisting of (A) an epoxy resin, (B) a curing agent, and (C) a carboxy group and a hydroxyl group. And (D) a second elastomer having no carboxy group and no hydroxyl group. The thermosetting resin composition can be in a completely cured product (C stage) state after the curing process through a semi-cured (B stage) state.
＜（Ａ）成分：エポキシ樹脂＞
　（Ａ）成分は、分子内にエポキシ基を有するものであれば、特に制限なく用いることができる。（Ａ）成分としては、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡノボラック型エポキシ樹脂、ビスフェノールＦノボラック型エポキシ樹脂、ジシクロペンタジエン骨格含有エポキシ樹脂、スチルベン型エポキシ樹脂、トリアジン骨格含有エポキシ樹脂、フルオレン骨格含有エポキシ樹脂、トリフェノールフェノールメタン型エポキシ樹脂、ビフェニル型エポキシ樹脂、キシリレン型エポキシ樹脂、フェニルアラルキル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、ナフタレン型エポキシ樹脂、多官能フェノール類、アントラセン等の多環芳香族類のジグリシジルエーテル化合物などが挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。これらの中でも、（Ａ）成分は、流動性の観点から、１５０℃溶融粘度が１．０Ｐａ・ｓ以下であるものが好ましい。また、（Ａ）成分は、エポキシ樹脂が２５℃で液体のエポキシ樹脂を含んでいてもよい。 <(A) component: epoxy resin>
The component (A) can be used without particular limitation as long as it has an epoxy group in the molecule. As the component (A), for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type Epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, stilbene-type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, triphenolphenolmethane-type epoxy resin, biphenyl-type epoxy resin, xylylene-type epoxy resin, phenylaralkyl-type epoxy Diglycidies of polycyclic aromatics such as resins, biphenyl aralkyl type epoxy resins, naphthalene type epoxy resins, polyfunctional phenols and anthracene And ether compounds. You may use these individually by 1 type or in combination of 2 or more types. Among these, the component (A) preferably has a 150 ° C. melt viscosity of 1.0 Pa · s or less from the viewpoint of fluidity. Moreover, as for (A) component, the epoxy resin may contain the epoxy resin which is liquid at 25 degreeC.
　（Ａ）成分のエポキシ当量は、特に制限されないが、９０～３００ｇ／ｅｑ、１１０～２９０ｇ／ｅｑ、又は１１０～２９０ｇ／ｅｑであってよい。（Ａ）成分のエポキシ当量がこのような範囲にあると、フィルム状接着剤のバルク強度を維持しつつ、流動性を確保することができる傾向にある。 The epoxy equivalent of the component (A) is not particularly limited, but may be 90 to 300 g / eq, 110 to 290 g / eq, or 110 to 290 g / eq. When the epoxy equivalent of the component (A) is in such a range, the fluidity tends to be secured while maintaining the bulk strength of the film adhesive.
　（Ａ）成分の市販品としては、例えば、ＤＩＣ株式会社製のＨＰ－７２００シリーズ、新日鉄住金化学株式会社製のＹＤＣＮシリーズ、日本化薬株式会社製のＮＣ－３０００、ＮＣ－７０００シリーズ等が挙げられる。 Examples of commercially available components (A) include HP-7200 series manufactured by DIC Corporation, YDCN series manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., NC-3000 series and NC-7000 series manufactured by Nippon Kayaku Co., Ltd., and the like. It is done.
　（Ｂ）成分は、特に制限なく、エポキシ樹脂の硬化剤として一般的に使用されているものを用いることができる。（Ｂ）成分としては、例えば、フェノール樹脂、エステル化合物、芳香族アミン、脂肪族アミン、酸無水物等が挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。これらの中でも、反応性及び経時安定性の観点から、（Ｂ）成分はフェノール樹脂を含んでいてよい。 (B) There is no restriction | limiting in particular and what is generally used as a hardening | curing agent of an epoxy resin can be used. (B) As a component, a phenol resin, an ester compound, an aromatic amine, an aliphatic amine, an acid anhydride etc. are mentioned, for example. You may use these individually by 1 type or in combination of 2 or more types. Among these, from the viewpoint of reactivity and stability over time, the component (B) may contain a phenol resin.
　フェノール樹脂は、分子内にフェノール性水酸基を有するものであれば特に制限なく用いることができる。フェノール樹脂としては、例えば、フェノール、クレゾール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、フェニルフェノール、アミノフェノール等のフェノール類及び／又はα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール類とホルムアルデヒド等のアルデヒド基を有する化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂、アリル化ビスフェノールＡ、アリル化ビスフェノールＦ、アリル化ナフタレンジオール、フェノールノボラック、フェノール等のフェノール類及び／又はナフトール類とジメトキシパラキシレン又はビス（メトキシメチル）ビフェニルから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂、ビフェニルアラルキル型フェノール樹脂、フェニルアラルキル型フェノール樹脂などが挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。これらの中でも、耐熱性の観点から、フェノール樹脂は、８５℃、８５％ＲＨの恒温恒湿槽に４８時間の条件において、吸水率が２質量％以下であり、かつ熱重量分析計（ＴＧＡ）で測定した３５０℃での加熱質量減少率（昇温速度：５℃／ｍｉｎ、雰囲気：窒素）が５質量％未満であるものが好ましい。 The phenol resin can be used without particular limitation as long as it has a phenolic hydroxyl group in the molecule. Examples of the phenol resin include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and / or naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene, and formaldehyde. A novolak-type phenol resin obtained by condensation or co-condensation with a compound having an aldehyde group in the presence of an acidic catalyst, phenols such as allylated bisphenol A, allylated bisphenol F, allylated naphthalenediol, phenol novolak, phenol, and / or Or phenol aralkyl resins, naphthol aralkyl resins, biphenyl aralkyl type resins synthesized from naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl Examples thereof include an enol resin and a phenylaralkyl type phenol resin. You may use these individually by 1 type or in combination of 2 or more types. Among these, from the viewpoint of heat resistance, the phenol resin has a water absorption of 2% by mass or less in a constant temperature and humidity chamber of 85 ° C. and 85% RH for 48 hours, and a thermogravimetric analyzer (TGA). It is preferable that the heating mass decrease rate (heating rate: 5 ° C./min, atmosphere: nitrogen) at 350 ° C. measured in step 1 is less than 5% by mass.
　フェノール樹脂の市販品としては、例えば、フェノライトＫＡシリーズ、ＴＤシリーズ（ＤＩＣ株式会社製）、ミレックスＸＬＣシリーズ、ＸＬシリーズ（三井化学株式会社製）、ＨＥシリーズ（エア・ウォーター株式会社製）等が挙げられる。 Examples of commercially available phenol resins include Phenolite KA series, TD series (manufactured by DIC Corporation), Millex XLC series, XL series (manufactured by Mitsui Chemicals), and HE series (manufactured by Air Water Corporation). Can be mentioned.
　フェノール樹脂の水酸基当量は、特に制限されないが、８０～２５０ｇ／ｅｑ、９０～２００ｇ／ｅｑ、又は１００～１８０ｇ／ｅｑであってよい。フェノール樹脂の水酸基当量がこのような範囲にあると、フィルム状接着剤の流動性を保ちつつ、接着力をより高く維持できる傾向にある。 The hydroxyl equivalent of the phenol resin is not particularly limited, but may be 80 to 250 g / eq, 90 to 200 g / eq, or 100 to 180 g / eq. When the hydroxyl equivalent of the phenol resin is in such a range, the adhesive strength tends to be maintained higher while maintaining the fluidity of the film adhesive.
　（Ａ）成分のエポキシ当量と（Ｂ）成分の水酸基当量との比（エポキシ樹脂のエポキシ当量／フェノール樹脂の水酸基当量）は、硬化性の観点から、０．３０／０．７０～０．７０／０．３０、０．３５／０．６５～０．６５／０．３５、０．４０／０．６０～０．６０／０．４０、又は０．４５／０．５５～０．５５／０．４５であってよい。当該当量比が０．３０／０．７０以上であると、より充分な硬化性が得られる傾向にある。当該当量比が０．７０／０．３０以下であると、粘度が高くなり過ぎることを防ぐことができ、より充分な流動性を得ることができる。 The ratio of the epoxy equivalent of component (A) to the hydroxyl equivalent of component (B) (epoxy equivalent of epoxy resin / hydroxyl equivalent of phenol resin) is 0.30 / 0.70 to 0.70 from the viewpoint of curability. /0.30, 0.35 / 0.65 to 0.65 / 0.35, 0.40 / 0.60 to 0.60 / 0.40, or 0.45 / 0.55 to 0.55 / It may be 0.45. When the equivalent ratio is 0.30 / 0.70 or more, more sufficient curability tends to be obtained. When the equivalent ratio is 0.70 / 0.30 or less, the viscosity can be prevented from becoming too high, and more sufficient fluidity can be obtained.
　（Ａ）成分及び（Ｂ）成分の合計の含有量は、熱硬化性樹脂組成物全量を基準として、１０～８０質量％であってよい。（Ａ）成分及び（Ｂ）成分の合計の含有量は、２０質量％以上、２５質量％以上、又は３０質量％以上であってもよく、７０質量％以下、６０質量％以下、又は５０質量％以下であってもよい。（Ａ）成分及び（Ｂ）成分の合計の含有量が、熱硬化性樹脂組成物全量を基準として、１０質量％以上であると、充分な接着力が得られる傾向にある。（Ａ）成分及び（Ｂ）成分の合計の含有量が、熱硬化性樹脂組成物全量を基準として、８０質量％以下であると、粘度が低くなり過ぎることを防ぐことができ、ブリード量をより抑えることができる傾向にある。 The total content of the component (A) and the component (B) may be 10 to 80% by mass based on the total amount of the thermosetting resin composition. The total content of the component (A) and the component (B) may be 20% by mass or more, 25% by mass or more, or 30% by mass or more, and is 70% by mass or less, 60% by mass or less, or 50% by mass. % Or less. When the total content of the component (A) and the component (B) is 10% by mass or more based on the total amount of the thermosetting resin composition, sufficient adhesive force tends to be obtained. When the total content of the component (A) and the component (B) is 80% by mass or less based on the total amount of the thermosetting resin composition, the viscosity can be prevented from becoming too low, and the amount of bleed can be reduced. There is a tendency to be able to suppress more.
＜（Ｃ）第１のエラストマ＞
　（Ｃ）成分は、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するエラストマである。熱硬化性樹脂組成物が（Ｃ）成分を含有することによって、熱圧着時に架橋反応が進行し、熱硬化性樹脂組成物が増粘して、高温加圧処理時のブリード量の増加を抑制することが可能となり得る。（Ｃ）成分は、エラストマを構成する重合体のガラス転移温度（Ｔｇ）が５０℃以下であるものが好ましい。 <(C) First elastomer>
Component (C) is an elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group. When the thermosetting resin composition contains the component (C), the crosslinking reaction proceeds during thermocompression bonding, the thermosetting resin composition thickens, and the increase in the amount of bleed during high-temperature pressure treatment is suppressed. Can be possible. The component (C) preferably has a glass transition temperature (Tg) of the polymer constituting the elastomer of 50 ° C. or lower.
　（Ｃ）成分は、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するものであれば特に制限されないが、例えば、アクリル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、シリコーン樹脂、ブタジエン樹脂、アクリロニトリル樹脂及びこれらの変性体等であって、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するものが挙げられる。 The component (C) is not particularly limited as long as it has at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group. For example, an acrylic resin, a polyester resin, a polyamide resin, a polyimide resin, a silicone resin, Examples thereof include butadiene resins, acrylonitrile resins, and modified products thereof having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
　（Ｃ）成分は、溶剤への溶解性、流動性の観点から、カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するアクリル樹脂であってよい。ここで、アクリル樹脂とは、（メタ）アクリル酸エステルに由来する構成単位を含むポリマーを意味する。アクリル樹脂は、構成単位として、アルコール性若しくはフェノール性水酸基、又はカルボキシ基を有する（メタ）アクリル酸エステルに由来する構成単位を含むポリマーであることが好ましい。また、アクリル樹脂は、（メタ）アクリル酸エステルとアクリルニトリルとの共重合体等のアクリルゴムであってもよい。 The component (C) may be an acrylic resin having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group from the viewpoint of solubility in a solvent and fluidity. Here, the acrylic resin means a polymer containing a structural unit derived from a (meth) acrylic acid ester. The acrylic resin is preferably a polymer including a structural unit derived from a (meth) acrylic acid ester having an alcoholic or phenolic hydroxyl group or a carboxy group as a structural unit. The acrylic resin may be an acrylic rubber such as a copolymer of (meth) acrylic acid ester and acrylonitrile.
　（Ｃ）成分のガラス転移温度（Ｔｇ）は、－５０～５０℃又は－３０～３０℃であってよい。アクリル樹脂のＴｇが－５０℃以上であると、熱硬化性樹脂組成物の柔軟性が高くなり過ぎることを防ぐことができる傾向にある。これにより、ウェハダイシング時にフィルム状接着剤を切断し易くなり、バリの発生を防ぐことが可能となる。アクリル樹脂のＴｇが５０℃以下であると、熱硬化性樹脂組成物の柔軟性の低下を抑えることができる傾向にある。これにより、フィルム状接着剤をウェハに貼り付ける際に、ボイドを充分に埋め込み易くなる傾向にある。また、ウェハの密着性の低下によるダイシング時のチッピングを防ぐことが可能となる。ここで、ガラス転移温度（Ｔｇ）は、ＤＳＣ（熱示差走査熱量計）（例えば、株式会社リガク製「Ｔｈｅｒｍｏ　Ｐｌｕｓ　２」）を用いて測定した値を意味する。 The glass transition temperature (Tg) of the component (C) may be −50 to 50 ° C. or −30 to 30 ° C. If the Tg of the acrylic resin is −50 ° C. or higher, the thermosetting resin composition tends to be prevented from becoming too flexible. Thereby, it becomes easy to cut | disconnect a film adhesive at the time of wafer dicing, and it becomes possible to prevent generation | occurrence | production of a burr | flash. It exists in the tendency which can suppress the fall of the softness | flexibility of a thermosetting resin composition as Tg of acrylic resin is 50 degrees C or less. Thereby, when sticking a film adhesive on a wafer, it exists in the tendency for a void to be embedded easily. Further, chipping during dicing due to a decrease in wafer adhesion can be prevented. Here, the glass transition temperature (Tg) means a value measured using a DSC (thermal differential scanning calorimeter) (for example, “Thermo Plus 2” manufactured by Rigaku Corporation).
　（Ｃ）成分の重量平均分子量（Ｍｗ）は、１０万～３００万又は５０万～２００万であってよい。アクリル樹脂のＭｗがこのような範囲にあると、フィルム形成性、フィルム状における強度、可撓性、タック性等を適切に制御することができると共に、リフロー性に優れ、埋め込み性を向上することができる。ここで、Ｍｗは、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）で測定し、標準ポリスチレンによる検量線を用いて換算した値を意味する。 The weight average molecular weight (Mw) of the component (C) may be 100,000 to 3 million or 500,000 to 2 million. When the Mw of the acrylic resin is in such a range, the film formability, strength in film form, flexibility, tackiness, etc. can be appropriately controlled, and the reflow property is excellent and the embedding property is improved. Can do. Here, Mw means a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.
　カルボキシ基を有する（Ｃ）成分の酸価は、硬化性の観点から、１～６０ｍｇＫＯＨ／ｇ、３～５０ｍｇＫＯＨ／ｇ、又は５～４０ｍｇＫＯＨ／ｇであってよい。酸価がこのような範囲にあると、ワニスにおけるゲル化及びＢステージ状態の流動性の低下を防ぐことができる傾向にある。 The acid value of the component (C) having a carboxy group may be 1 to 60 mgKOH / g, 3 to 50 mgKOH / g, or 5 to 40 mgKOH / g from the viewpoint of curability. When the acid value is in such a range, gelation in the varnish and a decrease in fluidity in the B stage state tend to be prevented.
　水酸基を有する（Ｃ）成分の水酸基価は、硬化性の観点から、１～６０ｍｇＫＯＨ／ｇ、３～５０ｍｇＫＯＨ／ｇ、又は５～４０ｍｇＫＯＨ／ｇであってよい。水酸基価がこのような範囲にあると、ワニスにおけるゲル化及びＢステージ状態の流動性の低下を防ぐことができる傾向にある。 The hydroxyl value of the component (C) having a hydroxyl group may be 1 to 60 mgKOH / g, 3 to 50 mgKOH / g, or 5 to 40 mgKOH / g from the viewpoint of curability. When the hydroxyl value is in such a range, gelation in the varnish and a decrease in fluidity in the B stage state tend to be prevented.
　（Ｃ）成分の市販品としては、例えば、ＳＧ－７０Ｌ、ＳＧ－７０８－６、ＷＳ－０２３　ＥＫ３０、ＳＧ－２８０　ＥＫ２３（いずれもナガセケムテックス株式会社製）が挙げられる。 Examples of the commercially available component (C) include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23 (all manufactured by Nagase ChemteX Corporation).
＜（Ｄ）第２のエラストマ＞
　（Ｄ）成分は、カルボキシ基及び水酸基を有しないエラストマである。熱硬化性樹脂組成物が（Ｄ）成分を含有することによって、経時安定性が良好となり得る。（Ｄ）成分は、エラストマを構成する重合体のガラス転移温度（Ｔｇ）が５０℃以下であるものが好ましい。 <(D) Second elastomer>
Component (D) is an elastomer having no carboxy group and no hydroxyl group. When the thermosetting resin composition contains the component (D), stability over time can be improved. The component (D) preferably has a glass transition temperature (Tg) of the polymer constituting the elastomer of 50 ° C. or lower.
　（Ｄ）成分は、カルボキシ基及び水酸基を有しないものであれば特に制限されないが、例えば、アクリル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、シリコーン樹脂、ブタジエン樹脂、アクリロニトリル樹脂及びこれらの変性体等であって、カルボキシ基及び水酸基を有しないものが挙げられる。 The component (D) is not particularly limited as long as it does not have a carboxy group and a hydroxyl group, and examples thereof include acrylic resins, polyester resins, polyamide resins, polyimide resins, silicone resins, butadiene resins, acrylonitrile resins, and modified products thereof. And what does not have a carboxy group and a hydroxyl group is mentioned.
　（Ｄ）成分は、溶剤への溶解性、流動性の観点から、カルボキシ基及び水酸基を有しないアクリル樹脂であってよい。アクリル樹脂は、上記と同義である。アクリル樹脂は、構成単位として、グリシジル基等のエポキシ基を有する官能性モノマー（（メタ）アクリル酸エステル等）を含むポリマーであることが好ましい。また、アクリル樹脂は、（メタ）アクリル酸エステルとアクリルニトリルとの共重合体等のアクリルゴムであってもよい。 The component (D) may be an acrylic resin having no carboxy group and no hydroxyl group from the viewpoint of solubility in a solvent and fluidity. The acrylic resin has the same meaning as described above. The acrylic resin is preferably a polymer containing a functional monomer (such as (meth) acrylic acid ester) having an epoxy group such as a glycidyl group as a structural unit. The acrylic resin may be an acrylic rubber such as a copolymer of (meth) acrylic acid ester and acrylonitrile.
　（Ｄ）成分のガラス転移温度（Ｔｇ）は、－５０～５０℃又は－３０～３０℃であってよい。アクリル樹脂のＴｇが－５０℃以上であると、熱硬化性樹脂組成物の柔軟性が高くなり過ぎることを防ぐことができる傾向にある。これにより、ウェハダイシング時にフィルム状接着剤を切断し易くなり、バリの発生を防ぐことが可能となる。アクリル樹脂のＴｇが５０℃以下であると、熱硬化性樹脂組成物の柔軟性の低下を抑えることができる傾向にある。これにより、フィルム状接着剤をウェハに貼り付ける際に、ボイドを充分に埋め込み易くなる傾向にある。また、ウェハの密着性の低下によるダイシング時のチッピングを防ぐことが可能となる。ここで、ガラス転移温度（Ｔｇ）は、ＤＳＣ（熱示差走査熱量計）（例えば、株式会社リガク製「Ｔｈｅｒｍｏ　Ｐｌｕｓ　２」）を用いて測定した値を意味する。 The glass transition temperature (Tg) of the component (D) may be −50 to 50 ° C. or −30 to 30 ° C. If the Tg of the acrylic resin is −50 ° C. or higher, the thermosetting resin composition tends to be prevented from becoming too flexible. Thereby, it becomes easy to cut | disconnect a film adhesive at the time of wafer dicing, and it becomes possible to prevent generation | occurrence | production of a burr | flash. It exists in the tendency which can suppress the fall of the softness | flexibility of a thermosetting resin composition as Tg of acrylic resin is 50 degrees C or less. Thereby, when sticking a film adhesive on a wafer, it exists in the tendency for a void to be embedded easily. Further, chipping during dicing due to a decrease in wafer adhesion can be prevented. Here, the glass transition temperature (Tg) means a value measured using a DSC (thermal differential scanning calorimeter) (for example, “Thermo Plus 2” manufactured by Rigaku Corporation).
　（Ｄ）成分の重量平均分子量（Ｍｗ）は、１０万～３００万又は５０万～２００万であってよい。アクリル樹脂のＭｗがこのような範囲にあると、フィルム形成性、フィルム状における強度、可撓性、タック性等を適切に制御することができると共に、リフロー性に優れ、埋め込み性を向上することができる。ここで、Ｍｗは、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）で測定し、標準ポリスチレンによる検量線を用いて換算した値を意味する。 The weight average molecular weight (Mw) of the component (D) may be 100,000 to 3 million or 500,000 to 2 million. When the Mw of the acrylic resin is in such a range, the film formability, strength in film form, flexibility, tackiness, etc. can be appropriately controlled, and the reflow property is excellent and the embedding property is improved. Can do. Here, Mw means a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.
　（Ｄ）成分の市販品としては、例えば、ＳＧ－Ｐ３、ＳＧ－８０Ｈ、ＨＴＲ－８６０Ｐ－３ＣＳＰ（いずれもナガセケムテックス株式会社製）が挙げられる。 Examples of the commercially available component (D) include SG-P3, SG-80H, and HTR-860P-3CSP (all manufactured by Nagase ChemteX Corporation).
　（Ｃ）成分及び（Ｄ）成分の合計の含有量は、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して、２０～１５０質量部、３０～１００質量部、又は４０～７０質量部であってよい。（Ｃ）成分及び（Ｄ）成分の合計の含有量が（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して、２０質量部以上であると、フィルム形成性により優れる傾向にある。（Ｃ）成分及び（Ｄ）成分の合計の含有量が（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して、１５０質量部以下であると、埋め込み性により優れる傾向にある。 The total content of the component (C) and the component (D) is 20 to 150 parts by mass, 30 to 100 parts by mass, or 40 to 70 with respect to 100 parts by mass of the total amount of the components (A) and (B). It may be a mass part. When the total content of the component (C) and the component (D) is 20 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A) and the component (B), the film formability tends to be more excellent. When the total content of the component (C) and the component (D) is 150 parts by mass or less with respect to 100 parts by mass of the total amount of the component (A) and the component (B), embedding tends to be more excellent.
　熱硬化性樹脂組成物における（Ｃ）成分及び（Ｄ）成分の総量に対する（Ｃ）成分の質量比（（Ｃ）成分の含有量／（Ｃ）成分及び（Ｄ）成分の含有量の総量）は、０．０１～０．５０であってよい。質量比は、０．０２以上、０．０３以上、又は０．０５以上であってもよく、０．３０以下、０．２０以下、又は０．１０以下であってもよい。（Ｃ）成分及び（Ｄ）成分に対する（Ｃ）成分の質量比が０．０１以上であると、高温加圧処理時のブリード量の増加をより抑制することができる傾向にある。（Ｃ）成分及び（Ｄ）成分に対する（Ｃ）成分の質量比が０．５０以下であると、より良好な埋め込み性を維持することができる傾向にある。 Mass ratio of component (C) to the total amount of component (C) and component (D) in the thermosetting resin composition (content of component (C) / total amount of component (C) and component (D)) May be between 0.01 and 0.50. The mass ratio may be 0.02 or more, 0.03 or more, or 0.05 or more, and may be 0.30 or less, 0.20 or less, or 0.10 or less. When the mass ratio of the component (C) to the component (C) and the component (D) is 0.01 or more, the increase in the amount of bleed during the high-temperature pressure treatment tends to be further suppressed. When the mass ratio of the component (C) to the component (C) and the component (D) is 0.50 or less, better embedding property tends to be maintained.
＜（Ｅ）成分：無機フィラー＞
　本実施形態に係る熱硬化性樹脂組成物は、（Ｅ）無機フィラーをさらに含有していてもよい。無機フィラーとしては、例えば、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、酸化アルミニウム、窒化アルミニウム、ホウ酸アルミウィスカ、窒化ホウ素、結晶性シリカ、非晶性シリカ等が挙げられる。これらは１種を単独で用いてもよく、２種以上を組み合わせて用いてもよい。得られるフィルム状接着剤の熱伝導性がより向上する観点から、無機フィラーは、酸化アルミニウム、窒化アルミニウム、窒化ホウ素、結晶性シリカ又は非晶性シリカを含んでいてよい。また、熱硬化性樹脂組成物の溶融粘度を調整する観点及び熱硬化性樹脂組成物にチキソトロピック性を付与する観点から、無機フィラーは、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、酸化アルミニウム、結晶性シリカ又は非晶性シリカを含んでいてよい。 <(E) component: inorganic filler>
The thermosetting resin composition according to the present embodiment may further contain (E) an inorganic filler. Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystal Examples thereof include crystalline silica and amorphous silica. These may be used individually by 1 type and may be used in combination of 2 or more type. From the viewpoint of further improving the thermal conductivity of the obtained film adhesive, the inorganic filler may contain aluminum oxide, aluminum nitride, boron nitride, crystalline silica, or amorphous silica. Further, from the viewpoint of adjusting the melt viscosity of the thermosetting resin composition and from the viewpoint of imparting thixotropic properties to the thermosetting resin composition, the inorganic filler is aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, Calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystalline silica or amorphous silica may be included.
　（Ｅ）成分の平均粒径は、接着性がより向上する観点から、０．００５～０．５μｍ又は０．０５～０．３μｍであってよい。ここで、平均粒径は、ＢＥＴ比表面積から換算することによって求められる値を意味する。 The average particle diameter of the component (E) may be 0.005 to 0.5 μm or 0.05 to 0.3 μm from the viewpoint of further improving the adhesiveness. Here, an average particle diameter means the value calculated | required by converting from a BET specific surface area.
　（Ｅ）成分は、その表面と溶剤、他の成分等との相溶性、接着強度の観点から表面処理剤によって表面処理されていてよい。表面処理剤としては、例えば、シランカップリング剤等が挙げられる。シランカップリング剤の官能基としては、例えば、ビニル基、（メタ）アクリロイル基、エポキシ基、メルカプト基、アミノ基、ジアミノ基、アルコキシ基、エトキシ基等が挙げられる。 (E) The component may be surface-treated with a surface treatment agent from the viewpoint of compatibility between the surface and the solvent, other components, and the like, and adhesive strength. Examples of the surface treatment agent include a silane coupling agent. Examples of the functional group of the silane coupling agent include a vinyl group, a (meth) acryloyl group, an epoxy group, a mercapto group, an amino group, a diamino group, an alkoxy group, and an ethoxy group.
　（Ｅ）成分の含有量は、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、及び（Ｄ）成分の総量１００質量部に対して、１０～９０質量部又は１０～５０質量部であってよい。（Ｅ）成分の含有量が、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、及び（Ｄ）成分の総量１００質量部に対して、１０質量部以上であると、硬化前の接着層のダイシング性が向上し、硬化後の接着層の接着力が向上する傾向にある。（Ｅ）成分の含有量が、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、及び（Ｄ）成分の総量１００質量部に対して、９０質量部以下であると、流動性の低下を抑制でき、硬化後のフィルム状接着剤の弾性率が高くなり過ぎることを防ぐことが可能となる。 The content of the component (E) is 10 to 90 parts by mass or 10 to 50 parts by mass with respect to 100 parts by mass of the total amount of the components (A), (B), (C), and (D). It may be. Adhesion before hardening that content of (E) component is 10 mass parts or more with respect to 100 mass parts of total amounts of (A) component, (B) component, (C) component, and (D) component The dicing property of the layer is improved, and the adhesive force of the adhesive layer after curing tends to be improved. When the content of the component (E) is 90 parts by mass or less with respect to 100 parts by mass of the total amount of the components (A), (B), (C), and (D), the fluidity is lowered. And the elastic modulus of the cured film adhesive can be prevented from becoming too high.
＜（Ｆ）成分：硬化促進剤＞
　本実施形態に係る熱硬化性樹脂組成物は、（Ｆ）硬化促進剤をさらに含有していてもよい。硬化促進剤は、特に限定されず、一般に使用されるものを用いることができる。（Ｆ）成分としては、例えば、イミダゾール類及びその誘導体、有機リン系化合物、第二級アミン類、第三級アミン類、第四級アンモニウム塩等が挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。これらの中でも、反応性の観点から（Ｆ）成分はイミダゾール類及びその誘導体であってよい。 <(F) component: hardening accelerator>
The thermosetting resin composition according to this embodiment may further contain (F) a curing accelerator. A hardening accelerator is not specifically limited, What is generally used can be used. Examples of the component (F) include imidazoles and derivatives thereof, organic phosphorus compounds, secondary amines, tertiary amines, quaternary ammonium salts, and the like. You may use these individually by 1 type or in combination of 2 or more types. Among these, from the viewpoint of reactivity, the component (F) may be imidazoles and derivatives thereof.
　イミダゾール類としては、例えば、２－メチルイミダゾール、１－ベンジル－２－メチルイミダゾール、１－シアノエチル－２－フェニルイミダゾール、１－シアノエチル－２－メチルイミダゾール等が挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。 Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, and the like. You may use these individually by 1 type or in combination of 2 or more types.
　（Ｆ）成分の含有量は、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、及び（Ｄ）成分の総量１００質量部に対して、０．０４～３質量部又は０．０４～０．２質量部であってよい。（Ｆ）成分の含有量がこのような範囲にあると、硬化性と信頼性とを両立することができる傾向にある。 The content of the component (F) is 0.04 to 3 parts by mass or 0.04 to 0.04 to 100 parts by mass of the total amount of the components (A), (B), (C), and (D). It may be 0.2 parts by mass. When content of (F) component exists in such a range, it exists in the tendency which can make sclerosis | hardenability and reliability compatible.
＜その他の成分＞
　本実施形態に係る熱硬化性樹脂組成物は、その他の成分として、抗酸化剤、シランカップリング剤、レオロジーコントロール剤等をさらに含有していてもよい。これらの成分の含有量は、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、及び（Ｄ）成分の総量１００質量部に対して、０．０２～３質量部であってよい。 <Other ingredients>
The thermosetting resin composition according to the present embodiment may further contain an antioxidant, a silane coupling agent, a rheology control agent, and the like as other components. The content of these components may be 0.02 to 3 parts by mass with respect to 100 parts by mass as the total of components (A), (B), (C), and (D).
　本実施形態に係る接着剤組成物は、溶剤で希釈された接着剤ワニスとして用いてもよい。溶剤は、（Ｅ）成分以外の成分を溶解できるものであれば特に制限されない。溶剤としては、例えば、トルエン、キシレン、メシチレン、クメン、ｐ－シメン等の芳香族炭化水素；ヘキサン、ヘプタン等の脂肪族炭化水素；メチルシクロヘキサンなどの環状アルカン；テトラヒドロフラン、１，４－ジオキサン等の環状エーテル；アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン、４－ヒドロキシ－４－メチル－２－ペンタノン等のケトン；酢酸メチル、酢酸エチル、酢酸ブチル、乳酸メチル、乳酸エチル、γ－ブチロラクトン等のエステル；エチレンカーボネート、プロピレンカーボネート等の炭酸エステル；Ｎ，Ｎ－ジメチルホルムアミド、Ｎ，Ｎ－ジメチルアセトアミド、Ｎ－メチル－２－ピロリドン等のアミドなどが挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いてもよい。これらのうち、溶剤は、溶解性及び沸点の観点から、トルエン、キシレン、メチルエチルケトン、メチルイソブチルケトン、又はシクロヘキサンであってもよい。 The adhesive composition according to this embodiment may be used as an adhesive varnish diluted with a solvent. The solvent is not particularly limited as long as it can dissolve components other than the component (E). Examples of the solvent include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; aliphatic hydrocarbons such as hexane and heptane; cyclic alkanes such as methylcyclohexane; tetrahydrofuran, 1,4-dioxane and the like. Cyclic ether; ketone such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone; ester such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone; Examples thereof include carbonic acid esters such as ethylene carbonate and propylene carbonate; amides such as N, N-dimethylformamide, N, N-dimethylacetamide and N-methyl-2-pyrrolidone. You may use these individually by 1 type or in combination of 2 or more types. Among these, the solvent may be toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, or cyclohexane from the viewpoints of solubility and boiling point.
　接着剤ワニス中の固形成分濃度は、接着剤ワニスの全質量を基準として、１０～８０質量％であってよい。 The solid component concentration in the adhesive varnish may be 10 to 80% by mass based on the total mass of the adhesive varnish.
　接着剤ワニスは、（Ａ）成分、（Ｂ）成分、（Ｃ）成分、（Ｄ）成分及び溶剤、並びに、必要に応じて、（Ｅ）成分、（Ｆ）成分、及びその他の成分を混合、混練することによって調製することができる。混合及び混練は、通常の撹拌機、らいかい機、三本ロール、ボールミル、ビーズミル等の分散機を適宜、組み合わせて行うことができる。（Ｅ）成分を含有する場合、（Ｅ）成分と低分子量成分を予め混合した後、高分子量成分を配合することによって、混合する時間を短縮することができる。また、接着剤ワニスを調製した後、真空脱気等によってワニス中の気泡を除去してよい。 Adhesive varnish mixes (A) component, (B) component, (C) component, (D) component and solvent, and (E) component, (F) component, and other components as necessary It can be prepared by kneading. Mixing and kneading can be performed by appropriately combining dispersers such as a normal stirrer, a raking machine, a triple roll, a ball mill, and a bead mill. When the component (E) is contained, the mixing time can be reduced by mixing the component (E) and the low molecular weight component in advance and then blending the high molecular weight component. Further, after the adhesive varnish is prepared, bubbles in the varnish may be removed by vacuum degassing or the like.
［フィルム状接着剤］
　図１は、一実施形態に係るフィルム状接着剤を示す模式断面図である。フィルム状接着剤１０は、上述の接着剤組成物をフィルム状に形成してなるものである。フィルム状接着剤１０は、半硬化（Ｂステージ）状態であってよい。このようなフィルム状接着剤１０は、接着剤組成物を支持フィルムに塗布することによって形成することができる。接着剤ワニスを用いる場合は、接着剤ワニスを支持フィルムに塗布し、溶剤を加熱乾燥して除去することによってフィルム状接着剤１０を形成することができる。 [Film adhesive]
FIG. 1 is a schematic cross-sectional view showing a film adhesive according to an embodiment. The film adhesive 10 is formed by forming the above-described adhesive composition into a film. The film adhesive 10 may be in a semi-cured (B stage) state. Such a film adhesive 10 can be formed by applying an adhesive composition to a support film. In the case of using an adhesive varnish, the film adhesive 10 can be formed by applying the adhesive varnish to a support film and removing the solvent by heating and drying.
　支持フィルムとしては、特に制限はなく、例えば、ポリテトラフルオロエチレン、ポリエチレン、ポリプロピレン、ポリメチルペンテン、ポリエチレンテレフタレート、ポリイミド等のフィルムが挙げられる。支持フィルムの厚さは、例えば、６０～２００μｍ又は７０～１７０μｍであってよい。 The support film is not particularly limited, and examples thereof include films of polytetrafluoroethylene, polyethylene, polypropylene, polymethylpentene, polyethylene terephthalate, polyimide, and the like. The thickness of the support film may be, for example, 60 to 200 μm or 70 to 170 μm.
　接着剤ワニスを支持フィルムに塗布する方法としては、公知の方法を用いることができ、例えば、ナイフコート法、ロールコート法、スプレーコート法、グラビアコート法、バーコート法、カーテンコート法等が挙げられる。加熱乾燥の条件は、使用した溶剤が充分に揮発する条件であれば特に制限はないが、例えば、５０～２００℃で０．１～９０分間であってもよい。 As a method of applying the adhesive varnish to the support film, a known method can be used, for example, knife coating method, roll coating method, spray coating method, gravure coating method, bar coating method, curtain coating method, etc. It is done. The conditions for the heat drying are not particularly limited as long as the solvent used is sufficiently volatilized, but may be, for example, 50 to 200 ° C. for 0.1 to 90 minutes.
　フィルム状接着剤の厚さは、用途に合わせて、適宜調整することができる。フィルム状接着剤の厚さは、半導体チップ、ワイヤ、基板の配線回路等の凹凸などを充分に埋め込む観点から、２０～２００μｍ、３０～２００μｍ、又は４０～１５０μｍであってよい。 The thickness of the film adhesive can be appropriately adjusted according to the application. The thickness of the film adhesive may be 20 to 200 μm, 30 to 200 μm, or 40 to 150 μm from the viewpoint of sufficiently embedding irregularities such as a semiconductor chip, a wire, and a wiring circuit of a substrate.
［接着シート］
　図２は、一実施形態に係る接着シートを示す模式断面図である。接着シート１００は、基材２０と基材上に設けられた上述のフィルム状接着剤１０とを備える。 [Adhesive sheet]
FIG. 2 is a schematic cross-sectional view showing an adhesive sheet according to an embodiment. The adhesive sheet 100 includes a base material 20 and the above-described film adhesive 10 provided on the base material.
　基材２０は、特に制限されないが、基材フィルムであってよい。基材フィルムは、上述の支持フィルムと同様のものであってよい。 The substrate 20 is not particularly limited, but may be a substrate film. The base film may be the same as the above support film.
　基材２０は、ダイシングテープであってもよい。このような接着シートは、ダイシングダイボンディング一体型接着シートとして使用することができる。この場合、半導体ウェハへのラミネート工程が１回となることから、作業の効率化が可能である。 The base material 20 may be a dicing tape. Such an adhesive sheet can be used as a dicing die bonding integrated adhesive sheet. In this case, since the lamination process to the semiconductor wafer is performed once, the work efficiency can be improved.
　ダイシングテープとしては、例えば、ポリテトラフルオロエチレンフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリメチルペンテンフィルム、ポリイミドフィルム等のプラスチックフィルム等が挙げられる。また、ダイシングテープは、必要に応じて、プライマー塗布、ＵＶ処理、コロナ放電処理、研磨処理、エッチング処理等の表面処理が行われていてもよい。ダイシングテープは、粘着性を有するものであることが好ましい。このようなダイシングテープは、上述のプラスチックフィルムに粘着性を付与したものであってもよく、上述のプラスチックフィルムの片面に粘着剤層を設けたものであってもよい。 Examples of the dicing tape include plastic films such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyimide film. In addition, the dicing tape may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment as necessary. The dicing tape is preferably one having adhesiveness. Such a dicing tape may be one obtained by imparting adhesiveness to the above-mentioned plastic film, or may be one obtained by providing an adhesive layer on one side of the above-mentioned plastic film.
　接着シート１００は、上述のフィルム状接着剤を形成する方法と同様に、接着剤組成物を基材フィルムに塗布することによって形成することができる。接着剤組成物を基材２０に塗布する方法は、上述の接着剤組成物を支持フィルムに塗布する方法と同様であってよい。 The adhesive sheet 100 can be formed by applying an adhesive composition to a base film in the same manner as the above-described method for forming a film adhesive. The method for applying the adhesive composition to the substrate 20 may be the same as the method for applying the adhesive composition to the support film.
　接着シート１００は、予め作製したフィルム状接着剤を用いて形成してもよい。この場合、接着シート１００は、ロールラミネーター、真空ラミネーター等を用いて所定条件（例えば、室温（２０℃）又は加熱状態）でラミネートすることによって形成することができる。接着シート１００は、連続的に製造ができ、効率が良いことから、加熱状態でロールラミネーターを用いて形成することが好ましい。 The adhesive sheet 100 may be formed using a film adhesive prepared in advance. In this case, the adhesive sheet 100 can be formed by laminating under a predetermined condition (for example, room temperature (20 ° C.) or a heated state) using a roll laminator, a vacuum laminator, or the like. Since the adhesive sheet 100 can be continuously manufactured and has high efficiency, it is preferably formed using a roll laminator in a heated state.
　フィルム状接着剤１０の厚さは、半導体チップ、ワイヤ、基板の配線回路等の凹凸などの埋め込み性の観点から、２０～２００μｍ、３０～２００μｍ、又は４０～１５０μｍであってよい。フィルム状接着剤１０の厚さが２０μｍ以上であると、より充分な接着力が得られる傾向にあり、フィルム状接着剤１０の厚さが２００μｍ以下であると、経済的であり、かつ半導体装置の小型化の要求に応えることが可能となる。 The thickness of the film adhesive 10 may be 20 to 200 μm, 30 to 200 μm, or 40 to 150 μm from the viewpoint of embedding properties such as unevenness of a semiconductor chip, a wire, a wiring circuit of a substrate, and the like. When the thickness of the film adhesive 10 is 20 μm or more, a sufficient adhesive force tends to be obtained, and when the thickness of the film adhesive 10 is 200 μm or less, it is economical and the semiconductor device It is possible to meet the demand for downsizing.
　図３は、他の実施形態に係る接着シートを示す模式断面図である。接着シート１１０は、フィルム状接着剤１０の基材２０とは反対側の面に積層された保護フィルム３０をさらに備える。保護フィルム３０は、上述の支持フィルムと同様のものであってよい。保護フィルムの厚さは、例えば、１５～２００μｍ又は７０～１７０μｍであってよい。 FIG. 3 is a schematic cross-sectional view showing an adhesive sheet according to another embodiment. The adhesive sheet 110 further includes a protective film 30 laminated on the surface of the film adhesive 10 opposite to the base 20. The protective film 30 may be the same as the above support film. The thickness of the protective film may be, for example, 15 to 200 μm or 70 to 170 μm.
［半導体装置］
　図４は、一実施形態に係る半導体装置を示す模式断面図である。半導体装置２００は、基板１４に、第１のワイヤ８８を介して１段目の第１の半導体素子Ｗａがワイヤボンディング接続されると共に、第１の半導体素子Ｗａ上に、第２の半導体素子Ｗａａがフィルム状接着剤１０を介して圧着されることで、第１のワイヤ８８の少なくとも一部がフィルム状接着剤１０に埋め込まれてなる半導体装置である。半導体装置は、第１のワイヤ８８の少なくとも一部が埋め込まれてなるワイヤ埋め込み型の半導体装置であっても、第１のワイヤ８８及び第１の半導体素子Ｗａが埋め込まれてなる半導体装置であってもよい。また、半導体装置２００では、基板１４と第２の半導体素子Ｗａａとがさらに第２のワイヤ９８を介して電気的に接続されると共に、第２の半導体素子Ｗａａが封止材４２により封止されている。 [Semiconductor device]
FIG. 4 is a schematic cross-sectional view showing a semiconductor device according to an embodiment. In the semiconductor device 200, the first semiconductor element Wa in the first stage is wire-bonded to the substrate 14 via the first wire 88, and the second semiconductor element Waa is formed on the first semiconductor element Wa. Is a semiconductor device in which at least a part of the first wire 88 is embedded in the film adhesive 10 by being pressure-bonded via the film adhesive 10. The semiconductor device is a semiconductor device in which the first wire 88 and the first semiconductor element Wa are embedded even if the semiconductor device is a wire embedded type semiconductor device in which at least a part of the first wire 88 is embedded. May be. In the semiconductor device 200, the substrate 14 and the second semiconductor element Waa are further electrically connected via the second wire 98, and the second semiconductor element Waa is sealed with the sealing material 42. ing.
　第１の半導体素子Ｗａの厚さは、１０～１７０μｍであってもよく、第２の半導体素子Ｗａａの厚さは、２０～４００μｍであってもよい。フィルム状接着剤１０内部に埋め込まれている第１の半導体素子Ｗａは、半導体装置２００を駆動するためのコントローラチップである。 The thickness of the first semiconductor element Wa may be 10 to 170 μm, and the thickness of the second semiconductor element Waa may be 20 to 400 μm. The first semiconductor element Wa embedded in the film adhesive 10 is a controller chip for driving the semiconductor device 200.
　基板１４は、表面に回路パターン８４、９４がそれぞれ二箇所ずつ形成された有機基板９０からなる。第１の半導体素子Ｗａは、回路パターン９４上に接着剤４１を介して圧着されている。第２の半導体素子Ｗａａは、第１の半導体素子Ｗａが圧着されていない回路パターン９４、第１の半導体素子Ｗａ、及び回路パターン８４の一部が覆われるようにフィルム状接着剤１０を介して基板１４に圧着されている。基板１４上の回路パターン８４、９４に起因する凹凸の段差には、フィルム状接着剤１０が埋め込まれている。そして、樹脂製の封止材４２により、第２の半導体素子Ｗａａ、回路パターン８４及び第２のワイヤ９８が封止されている。 The substrate 14 is composed of an organic substrate 90 having two circuit patterns 84 and 94 formed on the surface thereof. The first semiconductor element Wa is pressure-bonded onto the circuit pattern 94 via an adhesive 41. The second semiconductor element Waa is interposed via the film adhesive 10 so that the circuit pattern 94, the first semiconductor element Wa, and the circuit pattern 84 to which the first semiconductor element Wa is not bonded are covered. Crimped to the substrate 14. A film adhesive 10 is embedded in the uneven steps due to the circuit patterns 84 and 94 on the substrate 14. The second semiconductor element Waa, the circuit pattern 84, and the second wire 98 are sealed with a resin sealing material 42.
［半導体装置の製造方法］
　本実施形態に係る半導体装置の製造方法は、基板上に第１のワイヤを介して第１の半導体素子を電気的に接続する第１のワイヤボンディング工程と、第２の半導体素子の片面に、上述のフィルム状接着剤を貼付するラミネート工程と、フィルム状接着剤が貼付された第２の半導体素子を、フィルム状接着剤を介して圧着することで、第１のワイヤの少なくとも一部をフィルム状接着剤に埋め込むダイボンド工程と、を備える。 [Method for Manufacturing Semiconductor Device]
In the method for manufacturing a semiconductor device according to the present embodiment, a first wire bonding step of electrically connecting a first semiconductor element on a substrate via a first wire, and a second surface of the second semiconductor element, At least a part of the first wire is film-formed by pressure-bonding the above-described laminating step for attaching the film adhesive and the second semiconductor element to which the film adhesive is attached via the film adhesive. A die-bonding step embedded in the adhesive.
　図５～９は、一実施形態に係る半導体装置の製造方法の一連の工程を示す模式断面図である。本実施形態に係る半導体装置２００は、第１のワイヤ８８及び第１の半導体素子Ｗａが埋め込まれてなる半導体装置であり、以下の手順により製造される。まず、図５に示すとおり、基板１４上の回路パターン９４上に、接着剤４１を有する第１の半導体素子Ｗａを圧着し、第１のワイヤ８８を介して基板１４上の回路パターン８４と第１の半導体素子Ｗａとを電気的にボンディング接続する（第１のワイヤボンディング工程）。 5 to 9 are schematic cross-sectional views showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment. The semiconductor device 200 according to this embodiment is a semiconductor device in which a first wire 88 and a first semiconductor element Wa are embedded, and is manufactured by the following procedure. First, as shown in FIG. 5, the first semiconductor element Wa having the adhesive 41 is crimped onto the circuit pattern 94 on the substrate 14, and the circuit pattern 84 on the substrate 14 and the first pattern are connected to each other via the first wire 88. The first semiconductor element Wa is electrically bonded and connected (first wire bonding step).
　次に、半導体ウェハ（例えば、厚さ１００μｍ、サイズ：８インチ）の片面に、接着シート１００をラミネートし、基材２０を剥がすことによって、半導体ウェハの片面にフィルム状接着剤１０（例えば、厚さ１１０μｍ）を貼り付ける。そして、フィルム状接着剤１０にダイシングテープを貼り合わせた後、所定の大きさ（例えば、７．５ｍｍ角）にダイシングすることにより、図６に示すとおり、フィルム状接着剤１０が貼付した第２の半導体素子Ｗａａを得る（ラミネート工程）。 Next, the adhesive sheet 100 is laminated on one side of a semiconductor wafer (for example, thickness 100 μm, size: 8 inches), and the base material 20 is peeled off, whereby the film-like adhesive 10 (for example, thickness) is applied to one side of the semiconductor wafer. 110 μm). Then, after the dicing tape is bonded to the film adhesive 10, the dicing tape is diced to a predetermined size (for example, 7.5 mm square), whereby the second film adhesive 10 is applied as shown in FIG. The semiconductor element Waa is obtained (laminating step).
　ラミネート工程の温度条件は、５０～１００℃又は６０～８０℃であってよい。ラミネート工程の温度が５０℃以上であると、半導体ウェハと良好な密着性を得ることができる。ラミネート工程の温度が１００℃以下であると、ラミネート工程中にフィルム状接着剤１０が過度に流動することが抑えられるため、厚さの変化等を引き起こすことを防止できる。 The temperature condition of the laminating process may be 50-100 ° C or 60-80 ° C. When the temperature in the laminating step is 50 ° C. or higher, good adhesion to the semiconductor wafer can be obtained. When the temperature of the laminating process is 100 ° C. or lower, the film-like adhesive 10 can be prevented from flowing excessively during the laminating process, so that it is possible to prevent a change in thickness and the like.
　ダイシング方法としては、例えば、回転刃を用いるブレードダイシング、レーザーによってフィルム状接着剤又はウェハとフィルム状接着剤の両方を切断する方法等が挙げられる。 Examples of the dicing method include blade dicing using a rotary blade, and a method of cutting a film adhesive or both a wafer and a film adhesive with a laser.
　そして、フィルム状接着剤１０が貼付した第２の半導体素子Ｗａａを、第１の半導体素子Ｗａが第１のワイヤ８８を介してボンディング接続された基板１４に圧着する。具体的には、図７に示すとおり、フィルム状接着剤１０が貼付された第２の半導体素子Ｗａａを、フィルム状接着剤１０によって第１のワイヤ８８及び第１の半導体素子Ｗａが覆われるように載置し、次いで、図８に示すとおり、第２の半導体素子Ｗａａを基板１４に圧着させることで基板１４に第２の半導体素子Ｗａａを固定する（ダイボンド工程）。ダイボンド工程は、フィルム状接着剤１０を８０～１８０℃、０．０１～０．５０ＭＰａの条件で０．５～３．０秒間圧着することが好ましい。ダイボンド工程の後、フィルム状接着剤１０を６０～１７５℃、０．３～０．７ＭＰａの条件で、５分間以上加圧及び加熱する。 Then, the second semiconductor element Waa to which the film adhesive 10 is attached is pressure-bonded to the substrate 14 to which the first semiconductor element Wa is bonded via the first wire 88. Specifically, as shown in FIG. 7, the first wire 88 and the first semiconductor element Wa are covered with the second semiconductor element Waa to which the film-like adhesive 10 is attached by the film-like adhesive 10. Next, as shown in FIG. 8, the second semiconductor element Waa is fixed to the substrate 14 by pressing the second semiconductor element Waa to the substrate 14 (die bonding step). In the die bonding step, the film adhesive 10 is preferably pressure-bonded for 0.5 to 3.0 seconds under conditions of 80 to 180 ° C. and 0.01 to 0.50 MPa. After the die bonding step, the film adhesive 10 is pressed and heated for 5 minutes or more under the conditions of 60 to 175 ° C. and 0.3 to 0.7 MPa.
　次いで、図９に示すとおり、基板１４と第２の半導体素子Ｗａａとを第２のワイヤ９８を介して電気的に接続した後（第２のワイヤボンディング工程）、回路パターン８４、第２のワイヤ９８及び第２の半導体素子Ｗａａを封止材４２で封止する。このような工程を経ることで半導体装置２００を製造することができる。 Next, as shown in FIG. 9, after electrically connecting the substrate 14 and the second semiconductor element Waa via the second wire 98 (second wire bonding step), the circuit pattern 84, the second wire 98 and the second semiconductor element Waa are sealed with a sealing material 42. The semiconductor device 200 can be manufactured through such steps.
　他の実施形態として、半導体装置は、第１のワイヤ８８の少なくとも一部が埋め込まれてなるワイヤ埋め込み型の半導体装置であってもよい。 As another embodiment, the semiconductor device may be a wire embedded type semiconductor device in which at least a part of the first wire 88 is embedded.
　以下、本発明について実施例を挙げてより具体的に説明する。ただし、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.
（実施例１～５及び比較例１～３）
＜接着シートの作製＞
　以下に示す各成分を表１に示した配合割合（質量部）で混合し、溶媒としてシクロヘキサノンを用いて固形分４０質量％の熱硬化性樹脂組成物のワニスを調製した。次に、得られたワニスを１００メッシュのフィルターでろ過し、真空脱泡した。真空脱泡後のワニスを、基材フィルムとして、厚さ３８μｍの離型処理を施したポリエチレンテレフタレート（ＰＥＴ）フィルム上に塗布した。塗布したワニスを、９０℃で５分間、続いて１４０℃で５分間の２段階で加熱乾燥した。このようにして、基材フィルム上に、半硬化（Ｂステージ）状態にある厚さ１１０μｍのフィルム状接着剤を備える接着シートを得た。 (Examples 1 to 5 and Comparative Examples 1 to 3)
<Preparation of adhesive sheet>
Each component shown below was mixed at a blending ratio (parts by mass) shown in Table 1, and a varnish of a thermosetting resin composition having a solid content of 40% by mass was prepared using cyclohexanone as a solvent. Next, the obtained varnish was filtered through a 100-mesh filter and vacuum degassed. The varnish after vacuum defoaming was applied as a base film onto a polyethylene terephthalate (PET) film that had been subjected to a release treatment with a thickness of 38 μm. The applied varnish was heat-dried in two stages of 90 ° C. for 5 minutes, followed by 140 ° C. for 5 minutes. Thus, an adhesive sheet provided with a film adhesive having a thickness of 110 μm in a semi-cured (B stage) state was obtained on the base film.
　なお、表１中の各成分は以下のとおりである。 In addition, each component in Table 1 is as follows.
（Ａ）エポキシ樹脂
　Ａ－１：ジシクロペンタジエン骨格含有エポキシ樹脂、ＤＩＣ株式会社製、商品名：ＨＰ－７２００Ｌ、エポキシ当量：２４２～２５２ｇ／ｅｑ
　Ａ－２：クレゾールノボラック型エポキシ樹脂、新日鉄住金化学株式会社製、商品名：ＹＤＣＮ－７００－１０、エポキシ当量：２０９ｇ／ｅｑ
　Ａ－３：ビスフェノールＦ型エポキシ樹脂（２５℃で液体）、ＤＩＣ株式会社製、商品名：ＥＸＡ－８３０ＣＲＰ、エポキシ当量：１５９ｇ／ｅｑ
（Ｂ）硬化剤
　Ｂ－１：ビフェニルアラルキル型フェノール樹脂、エア・ウォーター株式会社製、商品名：ＨＥ－２００Ｃ－１０、水酸基当量：２０５ｇ／ｅｑ
　Ｂ－２：フェニルアラルキル型フェノール樹脂、エア・ウォーター株式会社製、商品名：ＨＥ１００Ｃ－３０、水酸基当量：１７５ｇ／ｅｑ
（Ｃ）第１のエラストマ
　Ｃ－１：アクリルゴム、ナガセケムテックス株式会社製、商品名：ＷＳ－０２３　ＥＫ３０、重量平均分子量：５０万、酸価：２０ｍｇＫＯＨ／ｇ、Ｔｇ：－１０℃
　Ｃ－２：アクリルゴム、ナガセケムテックス株式会社製、商品名：ＳＧ－７０８－６、重量平均分子量：７０万、酸価：９ｍｇＫＯＨ／ｇ、Ｔｇ：４℃
　Ｃ－３：アクリルゴム、ナガセケムテックス株式会社製、商品名：ＳＧ－２８０　ＥＫ２３、重量平均分子量：９０万、酸価：３０ｍｇＫＯＨ／ｇ、Ｔｇ：－２９℃
（Ｄ）第２のエラストマ
　Ｄ－１：アクリルゴム、ナガセケムテックス株式会社製、商品名：ＨＴＲ－８６０Ｐ－３ＣＳＰ、重量平均分子量：８０万、グリシジル基含有モノマー比率：３％、Ｔｇ：－７℃
（Ｅ）無機フィラー
　Ｅ－１：シリカフィラー分散液、溶融シリカ、株式会社アドマテックス製、商品名：ＳＣ２０５０－ＨＬＧ、平均粒径：０．５０μｍ
（Ｆ）硬化促進剤
　Ｆ－１：１－シアノエチル－２－フェニルイミダゾール、四国化成工業株式会社製、商品名：キュアゾール２ＰＺ－ＣＮ (A) Epoxy resin A-1: Dicyclopentadiene skeleton-containing epoxy resin, manufactured by DIC Corporation, trade name: HP-7200L, epoxy equivalent: 242 to 252 g / eq
A-2: Cresol novolac type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name: YDCN-700-10, epoxy equivalent: 209 g / eq
A-3: Bisphenol F type epoxy resin (liquid at 25 ° C.), manufactured by DIC Corporation, trade name: EXA-830CRP, epoxy equivalent: 159 g / eq
(B) Curing agent B-1: Biphenyl aralkyl type phenol resin, manufactured by Air Water Co., Ltd., trade name: HE-200C-10, hydroxyl group equivalent: 205 g / eq
B-2: Phenylaralkyl type phenol resin, manufactured by Air Water Co., Ltd., trade name: HE100C-30, hydroxyl group equivalent: 175 g / eq
(C) First elastomer C-1: Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: WS-023 EK30, weight average molecular weight: 500,000, acid value: 20 mgKOH / g, Tg: −10 ° C.
C-2: Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: SG-708-6, weight average molecular weight: 700,000, acid value: 9 mgKOH / g, Tg: 4 ° C.
C-3: Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: SG-280 EK23, weight average molecular weight: 900,000, acid value: 30 mgKOH / g, Tg: -29 ° C
(D) Second elastomer D-1: Acrylic rubber, manufactured by Nagase ChemteX Corporation, trade name: HTR-860P-3CSP, weight average molecular weight: 800,000, glycidyl group-containing monomer ratio: 3%, Tg: -7 ℃
(E) Inorganic filler E-1: Silica filler dispersion, fused silica, manufactured by Admatechs Co., Ltd., trade name: SC2050-HLG, average particle size: 0.50 μm
(F) Curing accelerator F-1: 1-cyanoethyl-2-phenylimidazole, manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name: Curesol 2PZ-CN
＜各種物性の評価＞
　得られた接着シートについて、埋め込み性及びブリード量の評価を行った。 <Evaluation of various physical properties>
About the obtained adhesive sheet, embedding property and bleed amount were evaluated.
［埋め込み性評価］
　接着シートの埋め込み性を以下の評価サンプルを作製して評価した。上記で得られたフィルム状接着剤（厚さ１１０μｍ）を、基材フィルムを剥がし、ダイシングテープに貼り付け、ダイシングダイボンディング一体型接着シートを得た。次に、厚さ１００μｍの半導体ウェハ（８インチ）を、接着剤側に７０℃に加熱して貼り付けた。その後、この半導体ウェハを７．５ｍｍ角にダイシングすることによって、半導体チップＡを得た。次に、ダイシングダイボンディング一体型接着シート（日立化成株式会社、商品名：ＨＲ９００４－１０）（厚さ１０μｍ）を用意し、厚さ５０μｍの半導体ウェハ（８インチ）に７０℃に加熱して貼り付けた。その後、この半導体ウェハを４．５ｍｍ角にダイシングすることによって、ダイボンディングフィルム付きの半導体チップＢを得た。次いで、ソルダーレジスト（太陽日酸株式会社、商品名：ＡＵＳ３０８）を塗布した総厚さ２６０μｍの評価用基板を用意し、ダイボンディングフィルム付きの半導体チップＢのダイボンディングフィルムと評価用基板のソルダーレジストとが接するように、１２０℃、０．２０ＭＰａ、２秒間の条件で圧着した。その後、半導体チップＡのフィルム状接着剤と半導体チップＢの半導体ウェハとが接するように、１２０℃、０．２０ＭＰａ、１．５秒間の条件で圧着し、評価サンプルを得た。この際、先に圧着している半導体チップＢが半導体チップＡの中央となるように位置合わせを行った。このようにして得られた評価サンプルを超音波デジタル画像診断装置（インサイト株式会社製、プローブ：７５ＭＨｚ）にてボイドの観測の有無を観測し、ボイドが観測された場合は、単位面積あたりのボイドの面積の割合を算出し、これらの分析結果を埋め込み性として評価した。評価基準は、以下のとおりである。結果を表１に示す。
　Ａ：ボイドが観測されなかった。
　Ｂ：ボイドが観測されたが、その割合が５面積％未満であった。
　Ｃ：ボイドが観測され、その割合が５面積％以上であった。 [Embeddability evaluation]
The following evaluation samples were prepared and evaluated for the embedding property of the adhesive sheet. The film-like adhesive (thickness: 110 μm) obtained above was peeled off from the base film and attached to a dicing tape to obtain a dicing die bonding integrated adhesive sheet. Next, a semiconductor wafer (8 inches) having a thickness of 100 μm was attached to the adhesive side by heating to 70 ° C. Then, the semiconductor chip A was obtained by dicing this semiconductor wafer into 7.5 mm square. Next, a dicing die bonding integrated adhesive sheet (Hitachi Chemical Co., Ltd., trade name: HR9004-10) (thickness 10 μm) is prepared and heated to 70 ° C. and attached to a semiconductor wafer (8 inches) having a thickness of 50 μm. I attached. Thereafter, this semiconductor wafer was diced to 4.5 mm square to obtain a semiconductor chip B with a die bonding film. Next, an evaluation substrate having a total thickness of 260 μm coated with a solder resist (Taiyo Nisso Corporation, trade name: AUS308) was prepared, and the die bonding film of the semiconductor chip B with the die bonding film and the solder resist of the evaluation substrate Were pressed under the conditions of 120 ° C., 0.20 MPa, and 2 seconds. Thereafter, the film adhesive of the semiconductor chip A and the semiconductor wafer of the semiconductor chip B were pressure-bonded under the conditions of 120 ° C., 0.20 MPa, and 1.5 seconds to obtain an evaluation sample. At this time, alignment was performed so that the semiconductor chip B that was previously crimped was in the center of the semiconductor chip A. The evaluation sample thus obtained was observed for the presence or absence of observation of voids with an ultrasonic digital diagnostic imaging apparatus (Insight Inc., probe: 75 MHz), and when voids were observed, The ratio of the void area was calculated, and these analysis results were evaluated as embeddability. The evaluation criteria are as follows. The results are shown in Table 1.
A: No void was observed.
B: Although voids were observed, the ratio was less than 5 area%.
C: A void was observed, and the ratio was 5 area% or more.
［ブリード量評価］
　上記埋め込み性評価で「Ａ」又は「Ｂ」評価であったもののみをブリード量評価を行った。上記埋め込み性評価で作製した評価サンプルと同様の手順で、評価サンプルを作製した。半導体チップＡのフィルム状接着剤と半導体チップＢの半導体ウェハとを、１２０℃、０．２０ＭＰａ、１．５秒間の条件で圧着した。次いで、加圧オーブンを用いて、１４０℃、０．７ＭＰa、３０分の条件で高温加圧処理（加圧キュア）を行い、加圧キュア前後において、評価サンプルを顕微鏡で観察し、評価サンプルの４辺の中心から、フィルム状接着剤のブリード量（はみ出し量）をそれぞれ測定した。加圧キュア前のブリード量をＬ１、加圧キュア後のブリード量をＬ２とし、以下の式に基づき、ブリード量増加率を算出した。結果を表１に示す。
　ブリード量増加率（％）＝（Ｌ２－Ｌ１）／Ｌ１×１００ [Bleed amount evaluation]
Only the evaluation of “A” or “B” in the embeddability evaluation was performed to evaluate the bleed amount. An evaluation sample was produced in the same procedure as the evaluation sample produced by the above embeddability evaluation. The film adhesive of the semiconductor chip A and the semiconductor wafer of the semiconductor chip B were pressure-bonded under the conditions of 120 ° C., 0.20 MPa, and 1.5 seconds. Next, using a pressure oven, high-temperature pressure treatment (pressure cure) is performed under conditions of 140 ° C., 0.7 MPa, 30 minutes, and before and after the pressure cure, the evaluation sample is observed with a microscope. From the center of the four sides, the bleed amount (the amount of protrusion) of the film adhesive was measured. The bleed amount before pressure curing was L1, the bleed amount after pressure curing was L2, and the bleed amount increase rate was calculated based on the following formula. The results are shown in Table 1.
Bleed amount increase rate (%) = (L2-L1) / L1 × 100
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すとおり、第１のエラストマ及び第２のエラストマを含有する実施例１～５は、第１のエラストマ又は第２のエラストマのいずれか一方しかを含有しない比較例１～３に比べて、埋め込み性に優れ、高温加圧処理時のブリード量増加率も低かった。これらの結果から、本発明に係る熱硬化性樹脂組成物が、熱圧着時に良好な埋め込み性を有しつつ、高温加圧処理時のブリード量の増加を抑制することが可能であることが確認された。 As shown in Table 1, Examples 1 to 5 containing the first elastomer and the second elastomer are compared with Comparative Examples 1 to 3 containing only one of the first elastomer and the second elastomer. Excellent embeddability, and the rate of increase in bleed amount during high-temperature pressure treatment was also low. From these results, it is confirmed that the thermosetting resin composition according to the present invention can suppress an increase in the amount of bleed during high-temperature pressure treatment while having good embedding property during thermocompression bonding. It was done.
　以上の結果のとおり、本発明に係る熱硬化性樹脂組成物は、熱圧着時に良好な埋め込み性を有しつつ、高温加圧処理時のブリード量の増加を抑制できることから、熱硬化性樹脂組成物をフィルム状に形成してなるフィルム状接着剤は、チップ埋め込み型フィルム状接着剤であるＦＯＤ（Ｆｉｌｍ　Ｏｖｅｒ　Ｄｉｅ）又はワイヤ埋め込み型フィルム状接着剤であるＦＯＷ（Ｆｉｌｍ　Ｏｖｅｒ　Ｗｉｒｅ）として有用となり得る。 As described above, the thermosetting resin composition according to the present invention has a good embedding property at the time of thermocompression bonding, and can suppress an increase in the amount of bleed at the time of high-temperature pressure treatment. A film-like adhesive formed by forming a product into a film can be useful as a chip-embedded film-like adhesive FOD (Film Over Die) or a wire-embedded film-like adhesive FOW (Film Over Wire) .
　１０…フィルム状接着剤、１４…基板、２０…基材、３０…保護フィルム、４１…接着剤、４２…封止材、８４、９４…回路パターン、８８…第１のワイヤ、９０…有機基板、９８…第２のワイヤ、１００、１１０…接着シート、２００…半導体装置、Ｗａ…第１の半導体素子、Ｗａａ…第２の半導体素子。 DESCRIPTION OF SYMBOLS 10 ... Film adhesive, 14 ... Substrate, 20 ... Base material, 30 ... Protective film, 41 ... Adhesive, 42 ... Sealing material, 84, 94 ... Circuit pattern, 88 ... First wire, 90 ... Organic substrate 98, second wire, 100, 110, adhesive sheet, 200, semiconductor device, Wa, first semiconductor element, Waa, second semiconductor element.

Claims (12)

  1. 　エポキシ樹脂と、
    　硬化剤と、
    　カルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有する第１のエラストマと、
    　カルボキシ基及び水酸基を有しない第２のエラストマと、
    を含有する、熱硬化性樹脂組成物。     Epoxy resin,
    A curing agent;
    A first elastomer having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group;
    A second elastomer having no carboxy group and no hydroxyl group;
    Containing a thermosetting resin composition.
  2. 　前記硬化剤がフェノール樹脂を含む、請求項１に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to claim 1, wherein the curing agent includes a phenol resin.
  3. 　前記第１のエラストマがカルボキシ基及び水酸基からなる群より選ばれる少なくとも１種の官能基を有するアクリル樹脂である、請求項１又は２に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to claim 1 or 2, wherein the first elastomer is an acrylic resin having at least one functional group selected from the group consisting of a carboxy group and a hydroxyl group.
  4. 　前記第２のエラストマがカルボキシ基及び水酸基を有しないアクリル樹脂である、請求項１～３のいずれか一項に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to any one of claims 1 to 3, wherein the second elastomer is an acrylic resin having no carboxy group and no hydroxyl group.
  5. 　前記エポキシ樹脂が２５℃で液体のエポキシ樹脂を含む、請求項１～４のいずれか一項に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to any one of claims 1 to 4, wherein the epoxy resin contains an epoxy resin that is liquid at 25 ° C.
  6. 　無機フィラーをさらに含有する、請求項１～５のいずれか一項に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to any one of claims 1 to 5, further comprising an inorganic filler.
  7. 　硬化促進剤をさらに含有する、請求項１～６のいずれか一項に記載の熱硬化性樹脂組成物。 The thermosetting resin composition according to any one of claims 1 to 6, further comprising a curing accelerator.
  8. 　請求項１～７のいずれか一項に記載の熱硬化性樹脂組成物をフィルム状に形成してなる、フィルム状接着剤。 A film adhesive formed by forming the thermosetting resin composition according to any one of claims 1 to 7 into a film.
  9. 　基材と、
    　前記基材上に設けられた、請求項８に記載のフィルム状接着剤と、
    を備える、接着シート。     A substrate;
    The film adhesive according to claim 8 provided on the substrate;
    An adhesive sheet comprising:
  10. 　前記基材がダイシングテープである、請求項９に記載の接着シート。 The adhesive sheet according to claim 9, wherein the substrate is a dicing tape.
  11. 　前記フィルム状接着剤の前記基材とは反対側の面に積層された保護フィルムをさらに備える、請求項９又は１０に記載の接着シート。 The adhesive sheet according to claim 9 or 10, further comprising a protective film laminated on a surface of the film adhesive opposite to the substrate.
  12. 　基板上に第１のワイヤを介して第１の半導体素子を電気的に接続するワイヤボンディング工程と、
    　第２の半導体素子の片面に、請求項８に記載のフィルム状接着剤を貼付するラミネート工程と、
    　前記フィルム状接着剤が貼付された第２の半導体素子を、前記フィルム状接着剤を介して圧着することで、前記第１のワイヤの少なくとも一部を前記フィルム状接着剤に埋め込むダイボンド工程と、
    を備える、半導体装置の製造方法。     A wire bonding step of electrically connecting the first semiconductor element on the substrate via the first wire;
    A laminating step of applying the film adhesive according to claim 8 on one side of the second semiconductor element;
    A die bonding step of embedding at least a part of the first wire in the film adhesive by crimping the second semiconductor element to which the film adhesive is affixed via the film adhesive;
    A method for manufacturing a semiconductor device.
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