JP2008208315A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008208315A5 JP2008208315A5 JP2007049126A JP2007049126A JP2008208315A5 JP 2008208315 A5 JP2008208315 A5 JP 2008208315A5 JP 2007049126 A JP2007049126 A JP 2007049126A JP 2007049126 A JP2007049126 A JP 2007049126A JP 2008208315 A5 JP2008208315 A5 JP 2008208315A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- hydrogen atom
- carbon atoms
- alkyl group
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims 7
- 125000004432 carbon atoms Chemical group C* 0.000 claims 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive Effects 0.000 claims 2
- 239000003063 flame retardant Substances 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 2
- 229910052698 phosphorus Inorganic materials 0.000 claims 2
- 239000011574 phosphorus Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000005227 gel permeation chromatography Methods 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 0 Cc1c(*)c(I)c(C)c(*)c1* Chemical compound Cc1c(*)c(I)c(C)c(*)c1* 0.000 description 1
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007049126A JP2008208315A (en) | 2007-02-28 | 2007-02-28 | Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007049126A JP2008208315A (en) | 2007-02-28 | 2007-02-28 | Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008208315A JP2008208315A (en) | 2008-09-11 |
JP2008208315A5 true JP2008208315A5 (en) | 2010-04-30 |
Family
ID=39784904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007049126A Pending JP2008208315A (en) | 2007-02-28 | 2007-02-28 | Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008208315A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4995316B2 (en) * | 2009-12-28 | 2012-08-08 | 日東電工株式会社 | gasket |
JP2020125471A (en) * | 2019-02-06 | 2020-08-20 | 日鉄ケミカル&マテリアル株式会社 | Phenoxy resin and method for producing the same, its resin composition and cured product |
JP7412939B2 (en) * | 2019-09-24 | 2024-01-15 | 日鉄ケミカル&マテリアル株式会社 | Method for manufacturing phenoxy resin |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4434427B2 (en) * | 2000-04-27 | 2010-03-17 | 東都化成株式会社 | Thermoplastic polyhydroxypolyether resin and insulating film molded therefrom |
JP4530187B2 (en) * | 2000-06-21 | 2010-08-25 | 新日鐵化学株式会社 | Curable resin composition containing thermoplastic polyhydroxypolyether resin |
JP4109863B2 (en) * | 2001-12-12 | 2008-07-02 | 東海ゴム工業株式会社 | Flame retardant adhesive composition for flexible printed wiring board and flexible printed wiring board using the same |
JP2003286391A (en) * | 2002-03-28 | 2003-10-10 | Nippon Steel Chem Co Ltd | Epoxy resin composition, varnish, film adhesive made by using epoxy resin composition, and its cured material |
JP4665414B2 (en) * | 2004-03-24 | 2011-04-06 | 東レ株式会社 | Adhesive composition for semiconductor device and coverlay film, adhesive sheet, copper-clad polyimide film using the same |
JP4238172B2 (en) * | 2004-03-31 | 2009-03-11 | 株式会社有沢製作所 | Flame retardant resin composition and metal-clad laminate for flexible printed wiring board using the flame retardant resin composition |
JP5028756B2 (en) * | 2005-06-24 | 2012-09-19 | 住友ベークライト株式会社 | Semiconductor sealing resin composition and semiconductor device |
-
2007
- 2007-02-28 JP JP2007049126A patent/JP2008208315A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008133228A1 (en) | Silicon-containing compound, curable composition and cured product | |
ATE545665T1 (en) | POLYMER CONTAINING NITRILE GROUPS AND METHOD FOR SYNTHESIZING IT, COMPOSITION WITH POLYMER CONTAINING NITRILE GROUPS AND LAMINATE | |
JP2008299293A5 (en) | ||
RU2011129655A (en) | STABILIZERS FOR POLYMERS CONTAINING ALIPHATIC ADDITION BROWN | |
JP2009504862A5 (en) | ||
RU2012131166A (en) | CURABLE DENTAL COMPOSITIONS AND ARTICLES CONTAINING POLYMERIZABLE IONIC LIQUIDS | |
JP2007016214A5 (en) | ||
WO2008133229A1 (en) | Silicon-containing compound, curable composition and cured product | |
JP2013504653A5 (en) | ||
JP2003327610A5 (en) | ||
JP2006045507A5 (en) | ||
JP2013504652A5 (en) | ||
EP1454937A3 (en) | Epoxy resin curing agent, curable epoxy resin composition and cured products | |
WO2008133227A1 (en) | Silicon-containing compound, curable composition and cured product | |
ATE556111T1 (en) | THERMOPLASTIC POLYMER COMPOSITION | |
WO2008123238A1 (en) | Resin composition | |
JP2008506697A5 (en) | ||
JP2011256242A5 (en) | ||
JP2016530302A5 (en) | ||
JP2014500896A5 (en) | ||
JP2008208315A5 (en) | ||
MY138699A (en) | Epoxy compound, preparation method thereof, and use thereof | |
JP2007046049A5 (en) | ||
DE602004007068D1 (en) | Polyamideimide resin, process for its preparation, polyamideimide composition, film-forming material prepared therefrom and adhesive for electronic parts | |
JP2015529278A5 (en) |