JP2008208315A5 - - Google Patents

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Publication number
JP2008208315A5
JP2008208315A5 JP2007049126A JP2007049126A JP2008208315A5 JP 2008208315 A5 JP2008208315 A5 JP 2008208315A5 JP 2007049126 A JP2007049126 A JP 2007049126A JP 2007049126 A JP2007049126 A JP 2007049126A JP 2008208315 A5 JP2008208315 A5 JP 2008208315A5
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Japan
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formula
hydrogen atom
carbon atoms
alkyl group
same
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JP2007049126A
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Japanese (ja)
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JP2008208315A (en
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Priority to JP2007049126A priority Critical patent/JP2008208315A/en
Priority claimed from JP2007049126A external-priority patent/JP2008208315A/en
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Description

Figure 2008208315
式中、Xは、一般式(2)、(3)、(4)、(5)から選ばれるものであり、かつ、少なくとも一般式(2)または一般式(3)の何れかは必須成分であり、Zは、水素原子または式(6)のいずれかであり、nの平均値は21以上の値である。
Figure 2008208315
In the formula, X is selected from the general formulas (2), (3), (4), and (5), and at least one of the general formula (2) or the general formula (3) is an essential component. Z is either a hydrogen atom or formula (6), and the average value of n is 21 or more.

Figure 2008208315
式中、Wは、一般式(2)、(3)、(4)、(5)から選ばれる少なくとも1種であり、mは0以上の整数を表す。
Figure 2008208315
In the formula, W is at least one selected from the general formulas (2), (3), (4), and (5), and m represents an integer of 0 or more.

Claims (2)

エポキシ樹脂(A)、一般式(1)で表されリン含有率が1重量%から6重量%であるリン含有フェノキシ樹脂(B)、硬化剤(C)および硬化促進剤(D)を必須成分として含有するノンハロゲン難燃性接着剤(a)。
Figure 2008208315
式中、Xは、一般式(2)、(3)、(4)、(5)から選ばれるものであり、かつ、少なくとも一般式(2)または一般式(3)の何れかは必須成分であり、Zは、水素原子または式(6)のいずれかであり、nの平均値は21以上の値である。
Figure 2008208315
式中、Yは、一般式(7)、(8)から選ばれるものであり、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
Figure 2008208315
式中、Yは、一般式(7)、(8)から選ばれるものであり、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
Figure 2008208315
式中、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
Figure 2008208315
式中、Aは、単結合、または、―CH―、−C(CH−、−CH(CH)−、−S−、−SO−、−O−、−CO−、一般式(9)のいずれかの2価の基から選ばれるものであり、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
Figure 2008208315
Figure 2008208315
式中、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
Figure 2008208315
式中、R〜R10は、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜R10のうちの2個以上が同一であっても良い。
Figure 2008208315
式中、R〜Rは、水素原子、炭素数1〜4のアルキル基、フェニル基のいずれかを表し、R〜Rのうちの2個以上が同一であっても良い。
The epoxy resin (A), the phosphorus-containing phenoxy resin (B) represented by the general formula (1) and having a phosphorus content of 1 to 6% by weight, a curing agent (C) and a curing accelerator (D) are essential components. Non-halogen flame retardant adhesive (a) contained as
Figure 2008208315
In the formula, X is selected from the general formulas (2), (3), (4), and (5), and at least one of the general formula (2) or the general formula (3) is an essential component. Z is either a hydrogen atom or formula (6), and the average value of n is 21 or more.
Figure 2008208315
Wherein, Y has the general formula (7) are those selected from (8), R 1 to R 3 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl radical, R Two or more of 1 to R 3 may be the same.
Figure 2008208315
Wherein, Y has the general formula (7) are those selected from (8), R 1 to R 4 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl radical, R Two or more of 1 to R 4 may be the same.
Figure 2008208315
In the formula, R 1 to R 4 each represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group, and two or more of R 1 to R 4 may be the same.
Figure 2008208315
In the formula, A is a single bond, or —CH 2 —, —C (CH 3 ) 2 —, —CH (CH 3 ) —, —S—, —SO 2 —, —O—, —CO—, formula (9) of those selected from any of the divalent groups, R 1 to R 8 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group, R 1 ~ Two or more of R 8 may be the same.
Figure 2008208315
Figure 2008208315
In the formula, R 1 to R 8 represent any of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, and a phenyl group, and two or more of R 1 to R 8 may be the same.
Figure 2008208315
In the formula, R 1 to R 10 each represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group, and two or more of R 1 to R 10 may be the same.
Figure 2008208315
In the formula, R 1 to R 8 represent any of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, and a phenyl group, and two or more of R 1 to R 8 may be the same.
エポキシ樹脂(A)が一般式(10)で表されるエポキシ樹脂で、かつゲルパーミエーションクロマトグラフィーを用いて測定した重合度m=0体の含有率がクロマトグラムの面積パーセントで50%以上である請求項1記載のノンハロゲン難燃性接着剤(a)。
Figure 2008208315
式中、Wは、一般式(2)、(3)、(4)、(5)から選ばれる少なくとも1種であり、mは0以上の整数を表す。
The epoxy resin (A) is an epoxy resin represented by the general formula (10), and the degree of polymerization m = 0 measured by gel permeation chromatography is 50% or more in terms of area percentage of the chromatogram. The non-halogen flame retardant adhesive (a) according to claim 1.
Figure 2008208315
In the formula, W is at least one selected from the general formulas (2), (3), (4), and (5), and m represents an integer of 0 or more.
JP2007049126A 2007-02-28 2007-02-28 Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same Pending JP2008208315A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007049126A JP2008208315A (en) 2007-02-28 2007-02-28 Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007049126A JP2008208315A (en) 2007-02-28 2007-02-28 Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same

Publications (2)

Publication Number Publication Date
JP2008208315A JP2008208315A (en) 2008-09-11
JP2008208315A5 true JP2008208315A5 (en) 2010-04-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007049126A Pending JP2008208315A (en) 2007-02-28 2007-02-28 Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same

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JP (1) JP2008208315A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4995316B2 (en) * 2009-12-28 2012-08-08 日東電工株式会社 gasket
JP2020125471A (en) * 2019-02-06 2020-08-20 日鉄ケミカル&マテリアル株式会社 Phenoxy resin and method for producing the same, its resin composition and cured product
JP7412939B2 (en) * 2019-09-24 2024-01-15 日鉄ケミカル&マテリアル株式会社 Method for manufacturing phenoxy resin

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434427B2 (en) * 2000-04-27 2010-03-17 東都化成株式会社 Thermoplastic polyhydroxypolyether resin and insulating film molded therefrom
JP4530187B2 (en) * 2000-06-21 2010-08-25 新日鐵化学株式会社 Curable resin composition containing thermoplastic polyhydroxypolyether resin
JP4109863B2 (en) * 2001-12-12 2008-07-02 東海ゴム工業株式会社 Flame retardant adhesive composition for flexible printed wiring board and flexible printed wiring board using the same
JP2003286391A (en) * 2002-03-28 2003-10-10 Nippon Steel Chem Co Ltd Epoxy resin composition, varnish, film adhesive made by using epoxy resin composition, and its cured material
JP4665414B2 (en) * 2004-03-24 2011-04-06 東レ株式会社 Adhesive composition for semiconductor device and coverlay film, adhesive sheet, copper-clad polyimide film using the same
JP4238172B2 (en) * 2004-03-31 2009-03-11 株式会社有沢製作所 Flame retardant resin composition and metal-clad laminate for flexible printed wiring board using the flame retardant resin composition
JP5028756B2 (en) * 2005-06-24 2012-09-19 住友ベークライト株式会社 Semiconductor sealing resin composition and semiconductor device

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