JP2015004009A5 - - Google Patents

Claims (18)

(A) a flame retardant having one or more vinyl groups or styryl groups and a phosphaphenanthrene skeleton in the molecule;
(B) a radical polymerizable resin having a functional group selected from one or more vinyl groups, styryl groups, allyl groups and acrylic groups in the molecule;
and,
(C) A resin composition for an insulating layer of a multilayer printed wiring board containing an inorganic filler, and when the resin component contained in the resin composition excluding the inorganic filler is 100% by mass, the phosphorus content is A resin composition for an insulating layer of a multilayer printed wiring board, which is 0.2 to 5% by mass. (B) The resin composition of Claim 1 whose component is a radically polymerizable resin represented by following formula (1).

Wherein _(1), R 1 ~R ₆ are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, A is a divalent hydrocarbon group containing an aromatic ring. ] The resin composition according to claim 2, wherein the A is represented by the following formula (2) or the following formula (3).

[In Formula (2), B is following formula (B-1), (B-2), or (B-3). ]

[In Formula (3), D is a following formula (4). ]

[In the formula (4), R _{7 to} R ₁₄ are each independently hydrogen, an alkyl group having 6 or less carbon atoms, or a phenyl group, a and b are integers of 0 to 100, at least one of which is not 0; Is the following formula (B-1), (B-2) or (B-3). ]

[In the formulas (B-1) to (B-3), R _{15 to} R ₃₄ are each independently hydrogen, an alkyl group having 6 or less carbon atoms, or a phenyl group, and E is a straight chain having 1 to 20 carbon atoms. , Branched or cyclic divalent hydrocarbon groups. ] The resin composition according to any one of claims 1 to 3, wherein the component (A) is represented by the following formula (5).

[In formula (5), X is represented by the following formula (6) or the following formula (7). ]

[In the formulas (6) and (7), R _{35 to} R ₄₀ are each independently hydrogen or a hydrocarbon group having 1 to 5 carbon atoms. ] The resin composition according to any one of claims 1 to 3, wherein the component (A) is represented by the following formula (8).

The resin composition of any one of Claims 1-5 whose (A) component is 0.5-15 mass% when the non-volatile component of the said resin composition is 100 mass%. The resin composition of any one of Claims 1-6 whose (B) component is 5-40 mass% when the non-volatile component of the said resin composition is 100 mass%. The resin composition according to claim 1, wherein the inorganic filler is silica. The surface treatment with the silane coupling agent which has the 1 or more types of functional group in which the said inorganic filler is chosen from an acryl, methacryl, styryl, amino, an epoxy, and vinyl is given in any one of Claims 1-8. The resin composition as described. The resin composition according to any one of claims 1 to 8, wherein the inorganic filler is surface-treated with a vinyl silane coupling agent or a styryl silane coupling agent. The resin composition of any one of Claims 1-10 whose (C) component is 30-80 mass% when the non-volatile component of the said resin composition is 100 mass%. A resin composition for a buildup layer of a multilayer printed wiring board, comprising the resin composition according to any one of claims 1 to 11. Characterized by containing a resin composition according to any one of claims 1 to 1 2, the sheet-like laminate material. The sheet-like laminate material according to the resin composition or claim 1 3 according to any one of claims 1 to 1 2 A cured product obtained by heat-curing, the dielectric loss tangent of the cured product is 0 Hardened | cured material which is 0.005 or less. The sheet-like laminate material according to the resin composition or claim 1 3 according to any one of claims 1 to 1 2 A cured product obtained by heat-curing, the linear thermal expansion coefficient of the cured product Hardened | cured material whose is 30 ppm or less. The sheet-like laminate material according to the resin composition or claim 1 3 according to any one of claims 1 to 1 2 A cured product obtained by heat-curing, glass transition temperature of the cured product Hardened | cured material which is 170 degreeC or more. Characterized in that it comprises an insulating layer obtained by thermally curing the sheet-like laminate material according to the resin composition or claim 1 3 according to any one of claims 1 to 1 2, the multilayer printed wiring Board. A semiconductor device comprising the multilayer printed wiring board according to claim 17 .