JP2008024920A5 - Epoxy compound, epoxy resin, photocationically polymerizable epoxy resin composition, microstructure, method for producing the same, and liquid discharge head - Google Patents

Epoxy compound, epoxy resin, photocationically polymerizable epoxy resin composition, microstructure, method for producing the same, and liquid discharge head Download PDF

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JP2008024920A5
JP2008024920A5 JP2007162486A JP2007162486A JP2008024920A5 JP 2008024920 A5 JP2008024920 A5 JP 2008024920A5 JP 2007162486 A JP2007162486 A JP 2007162486A JP 2007162486 A JP2007162486 A JP 2007162486A JP 2008024920 A5 JP2008024920 A5 JP 2008024920A5
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epoxy resin
epoxy
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photocationically polymerizable
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本発明の一例は、式（１）で表される多官能エポキシ化合物を単量体として、重合反応により生成する重合物であり、前記重合物の末端部位に複数のエポキシ基を有するハイパ−ブランチ型エポキシ樹脂である。   An example of the present invention is a polymer produced by a polymerization reaction using the polyfunctional epoxy compound represented by the formula (1) as a monomer, and has a plurality of epoxy branches at the terminal portion of the polymer. Type epoxy resin.

（但し、Ａはエポキシ基以外の求核性基を有する求核性有機基であり、Ｂは一つのエポキシ基を有するエポキシ含有基であり、Ｒはｎ＋１価の有機基、ｎは２もしくは３）(However, A is a nucleophilic organic group having a nucleophilic group other than an epoxy group, B is an epoxy-containing group having one epoxy group, R is an n + 1 valent organic group, and n is 2 or 3) )

Claims (11)

式（１）で表される多官能エポキシ化合物を単量体として、重合反応により生成する重合物であり、前記重合物の末端部位に複数のエポキシ基を有するハイパ−ブランチ型エポキシ樹脂。

（但し、Ａはエポキシ基以外の求核性基を有する求核性有機基であり、Ｂは一つのエポキシ基を有するエポキシ含有基であり、Ｒはｎ＋１価の有機基、ｎは２もしくは３） A hyper-branch type epoxy resin, which is a polymer produced by a polymerization reaction using a polyfunctional epoxy compound represented by formula (1) as a monomer, and has a plurality of epoxy groups at the terminal portion of the polymer.

(However, A is a nucleophilic organic group having a nucleophilic group other than an epoxy group, B is an epoxy-containing group having one epoxy group, R is an n + 1 valent organic group, and n is 2 or 3) ) 前記エポキシ含有基Ｂが、下記式（４０）に示す構造を有することを特徴とする請求項１に記載のハイパ−ブランチ型エポキシ樹脂。The hyper-branch type epoxy resin according to claim 1, wherein the epoxy-containing group B has a structure represented by the following formula (40).
前記エポキシ含有基Ｂは、式（４１）に示す構造を有することを特徴とする請求項１に記載のハイパ−ブランチ型エポキシ樹脂。The hyper-branch type epoxy resin according to claim 1, wherein the epoxy-containing group B has a structure represented by the formula (41).
前記求核性有機基Ａが芳香族水酸基であることを特徴とする請求項１乃至３のいずれか１項に記載のハイパ−ブランチ型エポキシ樹脂。The hyper-branch type epoxy resin according to any one of claims 1 to 3, wherein the nucleophilic organic group A is an aromatic hydroxyl group. 前記求核性有機基Ａがカルボキシル基であることを特徴とする請求項１乃至３のいずれか１項に記載のハイパ−ブランチ型エポキシ樹脂。The hyper-branch type epoxy resin according to any one of claims 1 to 3, wherein the nucleophilic organic group A is a carboxyl group. 請求項１に記載のハイパーブランチ型エポキシ樹脂と、光カチオン重合開始剤と、を含む光カチオン重合性エポキシ樹脂組成物。A photocationically polymerizable epoxy resin composition comprising the hyperbranched epoxy resin according to claim 1 and a photocationic polymerization initiator. 基板上に形成される微細構造体であって、該微細構造体が請求項６に記載の光カチオン重合性エポキシ樹脂組成物の硬化物であることを特徴とする微細構造体。A microstructure formed on a substrate, wherein the microstructure is a cured product of the photocationically polymerizable epoxy resin composition according to claim 6. 基板上に形成される微細構造体の製造方法であって、A manufacturing method of a fine structure formed on a substrate,
前記基板上に請求項６に記載の光カチオン重合性エポキシ樹脂組成物を用いて層を形成する工程と、Forming a layer on the substrate using the photocationically polymerizable epoxy resin composition according to claim 6;
該層を露光および現像することによりパターンを形成する工程と、Forming a pattern by exposing and developing the layer; and
を有することを特徴とする微細構造体の製造方法。A method for producing a fine structure characterized by comprising: 液体を吐出するために利用されるエネルギーを発生するエネルギー発生素子と、液体を吐出するための吐出口と、該吐出口へ液体を供給するための流路と、を備える液体吐出ヘッドであって、A liquid discharge head comprising: an energy generating element that generates energy used for discharging a liquid; a discharge port for discharging the liquid; and a flow path for supplying liquid to the discharge port. ,
前記吐出口を形成する吐出口形成部材が、請求項６に記載の光カチオン重合性エポキシ樹脂の硬化物によって形成されていることを特徴とする液体吐出ヘッド。A liquid discharge head, wherein a discharge port forming member that forms the discharge port is formed of a cured product of a photocationically polymerizable epoxy resin according to claim 6. 式（３５）で表される構造を有するエポキシ化合物。An epoxy compound having a structure represented by formula (35).
式（３７）で表される構造を有するエポキシ化合物。An epoxy compound having a structure represented by formula (37).
JP2007162486A 2006-06-23 2007-06-20 MICROSTRUCTURE, ITS MANUFACTURING METHOD, AND LIQUID DISCHARGE HEAD Expired - Fee Related JP5300218B2 (en)

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JP4973876B2 (en) 2007-08-22 2012-07-11 信越化学工業株式会社 Pattern forming method and pattern surface coating material used therefor
JP7375610B2 (en) * 2020-02-27 2023-11-08 味の素株式会社 resin composition
JP2022029427A (en) 2020-08-04 2022-02-17 信越化学工業株式会社 Negative type photosensitive resin composition, pattern formation method, cured film formation method, interlayer insulating film, surface protective film, and electronic component
JP2022151614A (en) 2021-03-23 2022-10-07 信越化学工業株式会社 Negative type photosensitive resin composition, pattern formation method, cured film formation method, interlayer insulating film, surface protective film, and electronic component
CN115073652B (en) * 2022-07-20 2023-09-19 智仑超纯环氧树脂(西安)有限公司 Polar adsorbent for removing chlorine from epoxy resin, preparation method thereof and method for preparing ultra-high purity epoxy resin by using polar adsorbent

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BE787169A (en) * 1971-08-13 1973-02-05 Shell Int Research PROCEDURE FOR EPOXYDERING OLEFINS WITH HYDROGEN PEROXIDE
SE503342C2 (en) * 1994-10-24 1996-05-28 Perstorp Ab Polyester-type hyperbranched macromolecule and process for its preparation
US20040054036A1 (en) * 2000-10-26 2004-03-18 Hatton Kevin Brian High functional polymers
JP4609032B2 (en) * 2004-10-20 2011-01-12 チッソ株式会社 Photopolymerizable compound and composition containing the same
JP4839627B2 (en) * 2005-02-16 2011-12-21 Ｊｎｃ株式会社 Tetrahydroxybenzene tetraester derivative and polymer thereof
JP2007246483A (en) * 2006-03-17 2007-09-27 Hakuto Co Ltd Polymerizable dendrimer and photocurable resin composition

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