JP2008020838A5 - - Google Patents

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JP2008020838A5
JP2008020838A5 JP2006194587A JP2006194587A JP2008020838A5 JP 2008020838 A5 JP2008020838 A5 JP 2008020838A5 JP 2006194587 A JP2006194587 A JP 2006194587A JP 2006194587 A JP2006194587 A JP 2006194587A JP 2008020838 A5 JP2008020838 A5 JP 2008020838A5
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resin composition
photosensitive resin
pattern
exposed
cured
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JP2006194587A
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JP4789725B2 (en
JP2008020838A (en
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Claims (8)

スルホニウムトリス（ペンタフルオロエチル）トリフルオロホスフェートである光カチオン重合開始剤（Ａ）と下記一般式（１）で表される多官能エポキシ樹脂（Ｂ）
Figure 2008020838
（式中Ｒ１、Ｒ２はそれぞれ独立に水素原子、またはメチル基を示し、ｔ及びｕ並びにｖはそれぞれ平均値であり独立に１以上の実数を表し、その和は３〜３０の実数を表す）
を含有してなる感光性樹脂組成物。 Photocationic polymerization initiator (A) which is sulfonium tris (pentafluoroethyl) trifluorophosphate and polyfunctional epoxy resin (B) represented by the following general formula (1)
Figure 2008020838
(Wherein R 1 and R 2 each independently represent a hydrogen atom or a methyl group, t, u and v are each an average value and independently represent a real number of 1 or more, and the sum represents a real number of 3 to 30. To express)
A photosensitive resin composition comprising: 請求項１記載の光カチオン重合開始剤（Ａ）が、下記式（２）で表される化合物（Ａ−１）
Figure 2008020838
であることを特徴とする感光性樹脂組成物。 The photocationic polymerization initiator (A) according to claim 1 is a compound (A-1) represented by the following formula (2):
Figure 2008020838
The photosensitive resin composition characterized by the above-mentioned. 反応性エポキシモノマー（Ｃ）を含有することを特徴とする請求項１及び２記載の感光性樹脂組成物。   The reactive epoxy monomer (C) is contained, The photosensitive resin composition of Claim 1 and 2 characterized by the above-mentioned. 溶剤（Ｄ）を含有する感光性樹脂組成物において、その固形分濃度が５〜９５重量％であることを特徴とする請求項１〜３記載の感光性樹脂組成物。   4. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition containing the solvent (D) has a solid content concentration of 5 to 95% by weight. 請求項１〜４記載の感光性樹脂組成物を基材で挟み込んだ感光性樹脂組成物積層体。 The photosensitive resin composition laminated body which pinched | interposed the photosensitive resin composition of Claims 1-4 with the base material. 請求項１〜４記載の感光性樹脂組成物の硬化物。 Hardened | cured material of the photosensitive resin composition of Claims 1-4 . 請求項１〜４記載のいずれかの感光性樹脂組成物を所望の支持体上に塗布し、乾燥後、前記感光性樹脂組成物層を所定のパターンに露光し、露光後ベークし、樹脂組成物層を現像し、得られた樹脂パターンを加熱処理して、所定形状の硬化樹脂パターンを得ることを特徴とするパターン形成方法。   The photosensitive resin composition according to any one of claims 1 to 4 is applied onto a desired support, dried, and then exposed to a predetermined pattern, and then exposed to light and baked to form a resin composition. A pattern forming method characterized by developing a physical layer and heat-treating the obtained resin pattern to obtain a cured resin pattern having a predetermined shape. 請求項５記載の積層体の基材を除去し、前記所望の支持体上に貼り付け、前記感光性樹脂組成物層を所定のパターンに露光し、露光後ベークし、樹脂組成物を現像し、得られた樹脂パターンを加熱処理して、所定形状の硬化樹脂パターンを得ることを特徴とするパターン形成方法。   The base material of the laminated body of Claim 5 is removed, it affixes on the said desired support body, the said photosensitive resin composition layer is exposed to a predetermined pattern, a post-exposure baking is carried out, and the resin composition is developed. Then, the obtained resin pattern is heat-treated to obtain a cured resin pattern having a predetermined shape.
JP2006194587A 2006-07-14 2006-07-14 Photosensitive resin composition, laminate thereof, cured product thereof, and pattern forming method using the composition Active JP4789725B2 (en)

Priority Applications (1)

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JP2006194587A JP4789725B2 (en) 2006-07-14 2006-07-14 Photosensitive resin composition, laminate thereof, cured product thereof, and pattern forming method using the composition

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JP2006194587A JP4789725B2 (en) 2006-07-14 2006-07-14 Photosensitive resin composition, laminate thereof, cured product thereof, and pattern forming method using the composition

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JP2008020838A JP2008020838A (en) 2008-01-31
JP2008020838A5 true JP2008020838A5 (en) 2009-05-14
JP4789725B2 JP4789725B2 (en) 2011-10-12

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095385A1 (en) 2009-02-20 2010-08-26 サンアプロ株式会社 Sulfonium salt, photo-acid generator, and photosensitive resin composition
JP5827791B2 (en) * 2009-05-15 2015-12-02 富士フイルム株式会社 Negative pattern forming method
JP5630068B2 (en) * 2010-04-28 2014-11-26 Jsr株式会社 Positive radiation-sensitive composition, interlayer insulating film and method for forming the same
JP5901070B2 (en) * 2012-10-26 2016-04-06 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP5967824B2 (en) * 2012-10-26 2016-08-10 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP5939964B2 (en) 2012-11-22 2016-06-29 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP5939963B2 (en) * 2012-11-22 2016-06-29 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP6021180B2 (en) * 2012-11-22 2016-11-09 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP5939965B2 (en) * 2012-11-22 2016-06-29 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP6066413B2 (en) * 2012-11-22 2017-01-25 日本化薬株式会社 Photosensitive resin composition, resist laminate and cured product thereof
JP6920205B2 (en) * 2015-03-20 2021-08-18 ブルー キューブ アイピー エルエルシー Curable composition
WO2022130796A1 (en) 2020-12-14 2022-06-23 サンアプロ株式会社 Photoacid generator, and photosensitive composition using same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209718A (en) * 2000-01-24 2001-08-03 Soriton Syst:Kk Method for securing and releasing reservation
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
US7709598B2 (en) * 2004-05-28 2010-05-04 San-Apro Limited Fluorinated alkyl fluorophoshoric acid salts of onium and transition metal complex

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