JP2015168757A5 - - Google Patents
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- JP2015168757A5 JP2015168757A5 JP2014044476A JP2014044476A JP2015168757A5 JP 2015168757 A5 JP2015168757 A5 JP 2015168757A5 JP 2014044476 A JP2014044476 A JP 2014044476A JP 2014044476 A JP2014044476 A JP 2014044476A JP 2015168757 A5 JP2015168757 A5 JP 2015168757A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- compound represented
- active energy
- energy ray
- hydrocarbon group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000001875 compounds Chemical class 0.000 claims 4
- 125000002723 alicyclic group Chemical group 0.000 claims 3
- 125000003700 epoxy group Chemical group 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 239000011342 resin composition Substances 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M Triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims 1
- ATMLPEJAVWINOF-UHFFFAOYSA-N acrylic acid acrylic acid Chemical compound OC(=O)C=C.OC(=O)C=C ATMLPEJAVWINOF-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 125000005647 linker group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000002952 polymeric resin Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- -1 unsaturated alicyclic epoxy ester compound Chemical class 0.000 claims 1
Claims (5)
一般式(1)
A1は、単結合、−O−、−S−、−N(R3)−、−CO−、−SO−、−SO2−、またはこれらの組合せからなる2価の結合基を表す。
E1は、脂環式エポキシ基を表す。
R1は、単結合または2価の炭化水素基を表し、
R2は、単結合または2価の炭化水素基を表し、
R3は、水素原子または1価の炭化水素基を表し、
m、nは1以上の整数を表す。分子内に含まれるn個のR1、m×n個のA1、m×n個のR2、n個のE1、m×n個のR3は同一であっても異なっていてもよい。) (A) Obtained by adding 0.5 to 1.1 equivalents of acrylic acid or methacrylic acid to 1 equivalent of epoxy group of an aromatic ring-containing alicyclic epoxy compound represented by the following general formula (1) An active energy ray-polymerizable resin composition comprising: an unsaturated alicyclic epoxy ester compound to be produced; and (b) a photopolymerization initiator and / or a photoacid generator.
General formula (1)
A 1 represents a divalent linking group consisting of a single bond, —O—, —S—, —N (R 3 ) —, —CO—, —SO—, —SO 2 —, or a combination thereof.
E 1 represents an alicyclic epoxy group.
R 1 represents a single bond or a divalent hydrocarbon group,
R 2 represents a single bond or a divalent hydrocarbon group,
R 3 represents a hydrogen atom or a monovalent hydrocarbon group,
m and n represent an integer of 1 or more. N R 1 , m × n A 1 , m × n R 2 , n E 1 , m × n R 3 contained in the molecule may be the same or different. Good. )
一般式(2)
Xは2価の脂肪族炭化水素基を、
nは1〜6の整数を表す) The compound represented by the general formula (1) is a compound represented by the following general formula (2), a compound represented by the following general formula (3), and a compound represented by the following general formula (4). The active energy ray polymerizable resin composition according to claim 2, wherein the composition is any one.
General formula (2)
X represents a divalent aliphatic hydrocarbon group,
n represents an integer of 1 to 6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014044476A JP6337523B2 (en) | 2014-03-07 | 2014-03-07 | Active energy ray polymerizable resin composition and laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014044476A JP6337523B2 (en) | 2014-03-07 | 2014-03-07 | Active energy ray polymerizable resin composition and laminate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015168757A JP2015168757A (en) | 2015-09-28 |
JP2015168757A5 true JP2015168757A5 (en) | 2016-12-22 |
JP6337523B2 JP6337523B2 (en) | 2018-06-06 |
Family
ID=54201798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014044476A Expired - Fee Related JP6337523B2 (en) | 2014-03-07 | 2014-03-07 | Active energy ray polymerizable resin composition and laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6337523B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6993766B2 (en) | 2016-03-30 | 2022-01-14 | 株式会社Adeka | Curable composition, method for producing cured product, and cured product thereof |
WO2017170881A1 (en) | 2016-03-30 | 2017-10-05 | 株式会社Adeka | Curable composition, cured product production method, and cured product therefrom |
JP7216470B2 (en) | 2016-03-30 | 2023-02-01 | 株式会社Adeka | Curable composition, method for producing cured product, and cured product thereof |
KR102265025B1 (en) | 2016-03-31 | 2021-06-14 | 가부시키가이샤 아데카 | Curable composition, manufacturing method of cured product, and cured product thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5225880B2 (en) * | 1972-09-12 | 1977-07-11 | ||
US4389520A (en) * | 1982-04-05 | 1983-06-21 | Ciba-Geigy Corporation | Advancement catalysts for epoxy resins |
JP2962805B2 (en) * | 1990-11-02 | 1999-10-12 | ダイセル化学工業株式会社 | Curable resin composition |
EP0506616B1 (en) * | 1991-03-27 | 1998-01-21 | Ciba SC Holding AG | Photosensitive acrylate mixture |
JP2005343868A (en) * | 2004-06-07 | 2005-12-15 | Daicel Chem Ind Ltd | Method for producing dieopoxidized oxalic ester compound |
JP4511439B2 (en) * | 2005-09-28 | 2010-07-28 | 日東電工株式会社 | Photosensitive epoxy resin adhesive film |
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2014
- 2014-03-07 JP JP2014044476A patent/JP6337523B2/en not_active Expired - Fee Related