CN114729215A - 喷墨用硬化性组成物、硬化物及柔性印刷电路板 - Google Patents

喷墨用硬化性组成物、硬化物及柔性印刷电路板 Download PDF

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CN114729215A
CN114729215A CN202080078808.5A CN202080078808A CN114729215A CN 114729215 A CN114729215 A CN 114729215A CN 202080078808 A CN202080078808 A CN 202080078808A CN 114729215 A CN114729215 A CN 114729215A
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meth
acrylate
curable composition
bis
inkjet
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CN114729215B (zh
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赖柏宏
史谕樵
黄堂杰
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Microcosm Technology Co Ltd
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Microcosm Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
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  • Polymers & Plastics (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)

Abstract

本发明提供一种喷墨用硬化性组成物、硬化物及柔性印刷电路板。所述喷墨用硬化性组成物包括可溶性聚酰亚胺树脂、光硬化丙烯酸酯化合物、光聚合起始剂以及热硬化树脂。所述喷墨用硬化性组成物的柔软性优异，且在厚度小于20μm时仍具有大于2kV的耐电压性。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN202080078808.5A 2020-10-20 2020-10-20 喷墨用硬化性组成物、硬化物及柔性印刷电路板 Active CN114729215B (zh)

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PCT/CN2020/122151 WO2022082425A1 (zh) 2020-10-20 2020-10-20 喷墨用硬化性组成物、硬化物及柔性印刷电路板

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Citations (9)

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Publication number Priority date Publication date Assignee Title
CN102762621A (zh) * 2009-11-30 2012-10-31 日立化成工业株式会社 感光性树脂组合物、感光性树脂清漆、感光性树脂膜和感光性树脂固化物
CN103145988A (zh) * 2013-02-28 2013-06-12 中山大学 一种聚酰亚胺低聚物及液态感光阻焊油墨
EP2657307A2 (en) * 2012-04-25 2013-10-30 JNC Corporation Inkjet Ink
JP2015110765A (ja) * 2013-11-05 2015-06-18 太陽インキ製造株式会社 硬化型組成物、これを用いた硬化塗膜及びプリント配線板
CN106893101A (zh) * 2017-03-23 2017-06-27 上达电子（深圳）股份有限公司 桐油基光敏性聚酰亚胺的感光油墨、其制备方法及其应用
CN108884345A (zh) * 2016-03-31 2018-11-23 太阳油墨制造株式会社 喷墨用固化性组合物、固化物和印刷电路板
CN109337437A (zh) * 2018-10-12 2019-02-15 楼乐超 一种可溶性环保油墨的制备工艺
CN110431483A (zh) * 2019-01-23 2019-11-08 律胜科技股份有限公司 感光性树脂组合物及其应用
CN110582546A (zh) * 2017-04-27 2019-12-17 捷恩智株式会社 光硬化性喷墨用墨水

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090110843A1 (en) * 2005-08-17 2009-04-30 Izhar Halahmi Thermosetting ink formulation for ink-jet applications
CN101807001B (zh) * 2010-03-17 2013-04-10 长兴化学工业股份有限公司 感光性树脂组合物及其应用
CN105085911B (zh) * 2014-05-07 2017-10-31 台虹科技股份有限公司 光感性聚酰亚胺组成物、其主剂、其主剂的制法及其制得的聚酰亚胺防焊薄膜
CN109270792A (zh) * 2018-10-30 2019-01-25 浙江福斯特新材料研究院有限公司 一种高韧性、高耐热、可弱碱水显影的聚酰亚胺/光敏环氧丙烯酸树脂组合物
CN111154327A (zh) * 2020-01-08 2020-05-15 江门市阪桥电子材料有限公司 一种低介电常数的poss改性感光阻焊油墨及其制备方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762621A (zh) * 2009-11-30 2012-10-31 日立化成工业株式会社 感光性树脂组合物、感光性树脂清漆、感光性树脂膜和感光性树脂固化物
EP2657307A2 (en) * 2012-04-25 2013-10-30 JNC Corporation Inkjet Ink
CN103145988A (zh) * 2013-02-28 2013-06-12 中山大学 一种聚酰亚胺低聚物及液态感光阻焊油墨
JP2015110765A (ja) * 2013-11-05 2015-06-18 太陽インキ製造株式会社 硬化型組成物、これを用いた硬化塗膜及びプリント配線板
CN108884345A (zh) * 2016-03-31 2018-11-23 太阳油墨制造株式会社 喷墨用固化性组合物、固化物和印刷电路板
CN106893101A (zh) * 2017-03-23 2017-06-27 上达电子（深圳）股份有限公司 桐油基光敏性聚酰亚胺的感光油墨、其制备方法及其应用
CN110582546A (zh) * 2017-04-27 2019-12-17 捷恩智株式会社 光硬化性喷墨用墨水
CN109337437A (zh) * 2018-10-12 2019-02-15 楼乐超 一种可溶性环保油墨的制备工艺
CN110431483A (zh) * 2019-01-23 2019-11-08 律胜科技股份有限公司 感光性树脂组合物及其应用

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CN114729215B (zh) 2023-11-10
WO2022082425A1 (zh) 2022-04-28

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