JP2019178209A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019178209A5 JP2019178209A5 JP2018067531A JP2018067531A JP2019178209A5 JP 2019178209 A5 JP2019178209 A5 JP 2019178209A5 JP 2018067531 A JP2018067531 A JP 2018067531A JP 2018067531 A JP2018067531 A JP 2018067531A JP 2019178209 A5 JP2019178209 A5 JP 2019178209A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- optical semiconductor
- composition according
- epoxy resin
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 7
- 239000003822 epoxy resin Substances 0.000 claims 5
- 230000003287 optical effect Effects 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- KZKGLGIVGQYOTG-UHFFFAOYSA-N [F].[Au] Chemical compound [F].[Au] KZKGLGIVGQYOTG-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 150000003918 triazines Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018067531A JP7047539B2 (ja) | 2018-03-30 | 2018-03-30 | 樹脂組成物及びその硬化体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018067531A JP7047539B2 (ja) | 2018-03-30 | 2018-03-30 | 樹脂組成物及びその硬化体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019178209A JP2019178209A (ja) | 2019-10-17 |
| JP2019178209A5 true JP2019178209A5 (https=) | 2020-12-03 |
| JP7047539B2 JP7047539B2 (ja) | 2022-04-05 |
Family
ID=68277871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018067531A Active JP7047539B2 (ja) | 2018-03-30 | 2018-03-30 | 樹脂組成物及びその硬化体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7047539B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7368202B2 (ja) * | 2019-11-29 | 2023-10-24 | リンテック株式会社 | 封止シート |
| JP2021161413A (ja) * | 2020-03-31 | 2021-10-11 | 太陽インキ製造株式会社 | 封止材組成物、ドライフィルム、硬化物および封止構造体 |
| US11852945B2 (en) * | 2020-10-14 | 2023-12-26 | Vitro Flat Glass Llc | Seal for electrochromic device |
| JP2023096752A (ja) * | 2021-12-27 | 2023-07-07 | 株式会社レゾナック | 車載モーターの製造方法、及び車載モーターを含む電動コンプレッサの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571719A (en) * | 1978-11-27 | 1980-05-30 | Hitachi Ltd | Epoxy resin composition having improved crack resistance |
| JPH03170545A (ja) * | 1989-11-30 | 1991-07-24 | Somar Corp | 液状エポキシ樹脂組成物 |
| TW201529709A (zh) * | 2009-01-23 | 2015-08-01 | Ajinomoto Kk | 樹脂組成物 |
| JP5869211B2 (ja) * | 2010-05-31 | 2016-02-24 | 株式会社ブリヂストン | 太陽電池用封止膜及びこれを用いた太陽電池 |
| WO2014196515A1 (ja) * | 2013-06-03 | 2014-12-11 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
| JPWO2015011925A1 (ja) * | 2013-07-24 | 2017-03-02 | コニカミノルタ株式会社 | Ｌｅｄ装置の製造方法 |
| JP2015195269A (ja) * | 2014-03-31 | 2015-11-05 | コニカミノルタ株式会社 | 発光装置及びその製造方法 |
| JP2017057339A (ja) * | 2015-09-18 | 2017-03-23 | 日立化成株式会社 | 透光性ガスバリア組成物及び硫化防止層、並びに前記硫化防止層を備える光半導体装置及びその製造方法 |
-
2018
- 2018-03-30 JP JP2018067531A patent/JP7047539B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019178209A5 (https=) | ||
| JP2017143067A5 (https=) | ||
| JP2010199541A5 (https=) | ||
| PH12017501624A1 (en) | Semiconductor device and image sensor module | |
| PH12017501228A1 (en) | Film, method for its production, and method for producing semiconductor element using the film | |
| JP2010199542A5 (https=) | ||
| EP4036144A4 (en) | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device | |
| JP2016041812A5 (https=) | ||
| WO2016052521A3 (ja) | シリコーンゴム組成物およびシリコーンゴム架橋体ならびに一体成形体および一体成形体の製造方法 | |
| SG11201900617YA (en) | Method for manufacturing semiconductor device | |
| MY187016A (en) | First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip | |
| JP2017107234A5 (https=) | ||
| SG11201808375SA (en) | Method for manufacturing semiconductor device | |
| JP2013145883A5 (ja) | 発光素子パッケージ、表示装置及び樹脂物 | |
| JP2017220543A5 (https=) | ||
| PH12018500851B1 (en) | First protective film forming sheet | |
| KR102482629B9 (ko) | 반도체 장치, 그리고 그 제조에 사용하는 열경화성 수지 조성물 및 다이싱 다이 본딩 일체형 테이프 | |
| EP3747933C0 (en) | COMPOSITION OF RESIN AND HARDENED MATERIAL THEREOF, ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | |
| JP2014096577A5 (ja) | 表示装置の作製方法 | |
| JP2016221967A5 (https=) | ||
| JP2016064641A5 (https=) | ||
| MY179938A (en) | Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element | |
| EP3744789A4 (en) | RESIN COMPOSITION, SEMICONDUCTOR SEAL MATERIAL, ONE-PIECE ADHESIVE AND ADHESIVE FILM | |
| RU2020123715A (ru) | Обёрнутый в плёнку термоплавкий клей | |
| JP2017535638A5 (https=) |