JP2019178209A5 - - Google Patents

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Publication number
JP2019178209A5
JP2019178209A5 JP2018067531A JP2018067531A JP2019178209A5 JP 2019178209 A5 JP2019178209 A5 JP 2019178209A5 JP 2018067531 A JP2018067531 A JP 2018067531A JP 2018067531 A JP2018067531 A JP 2018067531A JP 2019178209 A5 JP2019178209 A5 JP 2019178209A5
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JP
Japan
Prior art keywords
resin composition
optical semiconductor
composition according
epoxy resin
cured product
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JP2018067531A
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Japanese (ja)
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JP7047539B2 (en
JP2019178209A (en
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Claims (9)

下記の（Ａ）〜（Ｃ）成分を含む、樹脂組成物。
（Ａ）窒素原子を含有するエポキシ樹脂
（Ｂ）合成フッ素金雲母
（Ｃ）エポキシ樹脂硬化剤 A resin composition containing the following components (A) to (C).
(A) an epoxy resin (B) containing a nitrogen atom synthetic fluorine gold cloud base (C) Epoxy resin curing agent （Ａ）窒素原子を含有するエポキシ樹脂が、グリシジルアミン型エポキシ樹脂及び／又はトリアジン誘導体エポキシ樹脂を含む、請求項１記載の樹脂組成物。 (A) The resin composition according to claim 1, wherein the epoxy resin containing a nitrogen atom contains a glycidylamine type epoxy resin and / or a triazine derivative epoxy resin. さらに（Ｅ）熱可塑性樹脂を含有する、請求項１又は２記載の樹脂組成物。 The resin composition according to claim 1 or 2, further containing (E) a thermoplastic resin. 光半導体素子の封止用である、請求項１〜３のいずれか１項記載の樹脂組成物。 The resin composition according to any one of claims 1 to 3, which is used for encapsulating an optical semiconductor element. 支持体と、該支持体上に形成された、請求項１〜４のいずれか１項記載の樹脂組成物の層とを含む、樹脂組成物シート。 A resin composition sheet comprising a support and a layer of the resin composition according to any one of claims 1 to 4 formed on the support. 請求項１〜３のいずれか１項記載の樹脂組成物の硬化体。 A cured product of the resin composition according to any one of claims 1 to 3. 光半導体デバイスの光透過部位用である、請求項６記載の硬化体。 The cured product according to claim 6, which is used for a light transmitting portion of an optical semiconductor device. 光透過部位に請求項６記載の硬化体を含む、光半導体デバイス。 An optical semiconductor device comprising the cured product according to claim 6 in a light transmitting portion. 光半導体素子の封止材として請求項６記載の硬化体を含む、光半導体デバイス。 An optical semiconductor device including the cured product according to claim 6 as a sealing material for the optical semiconductor element.
JP2018067531A 2018-03-30 2018-03-30 Resin composition and its cured product Active JP7047539B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018067531A JP7047539B2 (en) 2018-03-30 2018-03-30 Resin composition and its cured product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018067531A JP7047539B2 (en) 2018-03-30 2018-03-30 Resin composition and its cured product

Publications (3)

Publication Number Publication Date
JP2019178209A JP2019178209A (en) 2019-10-17
JP2019178209A5 true JP2019178209A5 (en) 2020-12-03
JP7047539B2 JP7047539B2 (en) 2022-04-05

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JP2018067531A Active JP7047539B2 (en) 2018-03-30 2018-03-30 Resin composition and its cured product

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7368202B2 (en) * 2019-11-29 2023-10-24 リンテック株式会社 Sealing sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571719A (en) * 1978-11-27 1980-05-30 Hitachi Ltd Epoxy resin composition having improved crack resistance
JPH03170545A (en) * 1989-11-30 1991-07-24 Somar Corp Liquid epoxy resin composition
TW201529709A (en) * 2009-01-23 2015-08-01 Ajinomoto Kk Resin composition
JP5869211B2 (en) * 2010-05-31 2016-02-24 株式会社ブリヂストン Solar cell sealing film and solar cell using the same
JP6460985B2 (en) * 2013-06-03 2019-01-30 株式会社ダイセル Curable epoxy resin composition
WO2015011925A1 (en) * 2013-07-24 2015-01-29 コニカミノルタ株式会社 Led device production method
JP2015195269A (en) * 2014-03-31 2015-11-05 コニカミノルタ株式会社 Light-emitting device and method of manufacturing the same
JP2017057339A (en) * 2015-09-18 2017-03-23 日立化成株式会社 Translucent gas barrier composition and sulfidation prevention layer, and optical semiconductor device provided with the same and method for manufacturing optical semiconductor device

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