JP2011195712A5 - - Google Patents
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- Publication number
- JP2011195712A5 JP2011195712A5 JP2010064279A JP2010064279A JP2011195712A5 JP 2011195712 A5 JP2011195712 A5 JP 2011195712A5 JP 2010064279 A JP2010064279 A JP 2010064279A JP 2010064279 A JP2010064279 A JP 2010064279A JP 2011195712 A5 JP2011195712 A5 JP 2011195712A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- divided
- semiconductor wafer
- containing acrylic
- acrylic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (1)
前記エポキシ樹脂が極性基を有し、
前記エポキシ基含有アクリル樹脂の重量平均分子量が１万〜４０万であり、かつ
前記エポキシ基含有アクリル樹脂のガラス転移温度が６０℃以上である、硬化性組成物により形成された粘接着剤層と、該粘接着剤層の片面に積層された基材層とを備えるダイシング−ダイボンディングテープと、個々の半導体チップに分割されている分割後半導体ウェーハとを用いて、
前記分割後半導体ウェーハの片面に、前記粘接着剤層を積層する工程と、
前記粘接着剤層を引き延ばすことにより、前記粘接着剤層を前記分割後半導体ウェーハの切断部分に沿って切断し、かつ前記分割後半導体ウェーハにおける個々の前記半導体チップを離間させる工程と、
前記粘接着剤層が積層された状態で、前記粘接着剤層付き半導体チップを取り出す工程とを備え、
前記粘接着剤層を引き延ばす前又は間に、前記粘接着剤層を改質するために、前記粘接着剤層を加熱及び冷却せず、かつレーザー光を照射しない
粘接着剤層付き半導体チップの製造方法。 An epoxy resin, an epoxy resin curing agent, and an epoxy group-containing acrylic resin,
The epoxy resin has a polar group;
The epoxy group-containing acrylic resin has a weight average molecular weight of 10,000 to 400,000, and
The epoxy group-containing acrylic resin has a glass transition temperature of 60 ° C. or more and an adhesive layer formed of a curable composition, and a base material layer laminated on one side of the adhesive layer. Using a dicing die bonding tape and a divided semiconductor wafer divided into individual semiconductor chips,
Laminating the adhesive layer on one side of the divided semiconductor wafer,
Cutting the adhesive layer along the cut portion of the divided semiconductor wafer by stretching the adhesive layer, and separating the individual semiconductor chips in the divided semiconductor wafer;
In the state where the adhesive layer is laminated, the step of taking out the semiconductor chip with the adhesive layer,
Before or during stretching of the adhesive layer, the adhesive layer is not heated and cooled and laser light is not irradiated to modify the adhesive layer. Manufacturing method of semiconductor chip with adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010064279A JP5580631B2 (en) | 2010-03-19 | 2010-03-19 | Curable composition, dicing die-bonding tape, connection structure, and method for producing semiconductor chip with adhesive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010064279A JP5580631B2 (en) | 2010-03-19 | 2010-03-19 | Curable composition, dicing die-bonding tape, connection structure, and method for producing semiconductor chip with adhesive layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011195712A JP2011195712A (en) | 2011-10-06 |
| JP2011195712A5 true JP2011195712A5 (en) | 2013-01-24 |
| JP5580631B2 JP5580631B2 (en) | 2014-08-27 |
Family
ID=44874333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010064279A Expired - Fee Related JP5580631B2 (en) | 2010-03-19 | 2010-03-19 | Curable composition, dicing die-bonding tape, connection structure, and method for producing semiconductor chip with adhesive layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5580631B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5754072B2 (en) * | 2010-02-25 | 2015-07-22 | 日立化成株式会社 | Adhesive composition, adhesive member sheet for connecting circuit members, and method for manufacturing semiconductor device |
| JP4976522B2 (en) * | 2010-04-16 | 2012-07-18 | 日東電工株式会社 | Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method |
| JP6160623B2 (en) * | 2012-09-25 | 2017-07-12 | 住友ベークライト株式会社 | Dicing film |
| WO2014109212A1 (en) * | 2013-01-09 | 2014-07-17 | 株式会社ダイセル | Curable epoxy resin composition |
| CN110092937B (en) * | 2014-03-24 | 2022-06-07 | 琳得科株式会社 | Protective film forming film, protective film forming sheet, and method for producing processed product |
| JP6310748B2 (en) * | 2014-03-31 | 2018-04-11 | 日東電工株式会社 | Die bond film, die bond film with dicing sheet, semiconductor device, and method for manufacturing semiconductor device |
| DE102016207548A1 (en) * | 2016-05-02 | 2017-11-02 | Tesa Se | Curable adhesive and reactive adhesive tapes based thereon |
| JP7127266B2 (en) * | 2017-10-11 | 2022-08-30 | 三菱ケミカル株式会社 | Molded article having active energy ray-polymerizable composition and its cured film |
| JP7110600B2 (en) * | 2018-01-17 | 2022-08-02 | 東レ株式会社 | A resin composition for electronic parts and a resin sheet for electronic parts. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4471565B2 (en) * | 2002-12-10 | 2010-06-02 | 株式会社ディスコ | Semiconductor wafer dividing method |
| JP2006054437A (en) * | 2005-07-08 | 2006-02-23 | Sumitomo Bakelite Co Ltd | Die attach film with dicing sheet function, manufacturing method of semiconductor device using the same and semiconductor device |
| JP5549106B2 (en) * | 2008-04-16 | 2014-07-16 | 日立化成株式会社 | Semiconductor adhesive sheet and dicing integrated semiconductor adhesive sheet |
-
2010
- 2010-03-19 JP JP2010064279A patent/JP5580631B2/en not_active Expired - Fee Related
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