MY168738A - Dicing film - Google Patents

Dicing film

Info

Publication number
MY168738A
MY168738A MYPI2015000477A MYPI2015000477A MY168738A MY 168738 A MY168738 A MY 168738A MY PI2015000477 A MYPI2015000477 A MY PI2015000477A MY PI2015000477 A MYPI2015000477 A MY PI2015000477A MY 168738 A MY168738 A MY 168738A
Authority
MY
Malaysia
Prior art keywords
dicing film
base layer
film
dicing
present
Prior art date
Application number
MYPI2015000477A
Inventor
Oda Naoya
Nagao Yoshinori
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY168738A publication Critical patent/MY168738A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The object of the present invention is to provide a deicing film which generates a small amount of the scrapes and bead-like burrs of the base layer during the dicing step when a semiconductor is manufactured, and has suitable strength and excellent appearance for a dicing film, and the present invention provides a dicing film having a base layer (1) and an adhesive layer (2), wherein rupture elongation of the base layer (1) at 80?C is 750% or less. (Fig.1)
MYPI2015000477A 2012-09-25 2013-09-18 Dicing film MY168738A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012210585 2012-09-25

Publications (1)

Publication Number Publication Date
MY168738A true MY168738A (en) 2018-11-29

Family

ID=50388063

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000477A MY168738A (en) 2012-09-25 2013-09-18 Dicing film

Country Status (6)

Country Link
JP (1) JP6160623B2 (en)
KR (1) KR101948374B1 (en)
CN (1) CN104428873B (en)
MY (1) MY168738A (en)
TW (1) TWI614323B (en)
WO (1) WO2014050658A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624527B (en) * 2015-08-26 2018-05-21 feng qian Chen Polyethylene tape

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04196342A (en) * 1990-11-28 1992-07-16 Mitsui Toatsu Chem Inc Film for semiconductor wafer dicing use
JP3984076B2 (en) * 2002-02-27 2007-09-26 日東電工株式会社 Dicing adhesive sheet
JP2006310846A (en) * 2005-04-28 2006-11-09 Ls Cable Ltd Dicing die adhesive film for semiconductor
TW200800584A (en) * 2006-04-03 2008-01-01 Gunze Kk Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
JP4993446B2 (en) * 2006-09-08 2012-08-08 日東電工株式会社 Wafer holding adhesive sheet
JP2008117943A (en) * 2006-11-06 2008-05-22 Nitto Denko Corp Adhesive sheet for water jet laser dicing
JP4994429B2 (en) * 2008-08-04 2012-08-08 日東電工株式会社 Dicing die bond film
JP5561949B2 (en) 2009-04-08 2014-07-30 日東電工株式会社 Thermosetting die bond film
JP5519189B2 (en) * 2009-05-27 2014-06-11 日東電工株式会社 Adhesive sheet for dicing electronic components
JP5580631B2 (en) * 2010-03-19 2014-08-27 積水化学工業株式会社 Curable composition, dicing die-bonding tape, connection structure, and method for producing semiconductor chip with adhesive layer
JP5494075B2 (en) * 2010-03-19 2014-05-14 住友ベークライト株式会社 Dicing film
JP2012094834A (en) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd Dicing film
KR101393878B1 (en) * 2010-09-30 2014-05-12 미쓰이 가가쿠 토세로 가부시키가이샤 Expandable film, dicing film, and method for producing semiconductor device

Also Published As

Publication number Publication date
WO2014050658A1 (en) 2014-04-03
CN104428873A (en) 2015-03-18
CN104428873B (en) 2018-01-09
JPWO2014050658A1 (en) 2016-08-22
TWI614323B (en) 2018-02-11
TW201418401A (en) 2014-05-16
KR20150058100A (en) 2015-05-28
KR101948374B1 (en) 2019-02-14
JP6160623B2 (en) 2017-07-12

Similar Documents

Publication Publication Date Title
MX2016003843A (en) Irak inhibitors and uses thereof.
WO2014165771A3 (en) Anti-il-4 antibodies and bispecific antibodies and uses thereof
WO2014011906A3 (en) Irak inhibitors and uses thereof
WO2014152157A3 (en) Methods and compositions for the generation and use of conformation-specific antibodies
MX2014009171A (en) Pressure-sensitive adhesive.
IN2014CN03520A (en)
MY177183A (en) Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive
TWI561593B (en) Anti-corrosive coating composition, anti-corrosive coating film and anti-corrosive method of base member
WO2014078268A3 (en) Anti-hemagglutinin antibodies and methods of use
MX340555B (en) Antibodies against il-18r1 and uses thereof.
MX2017002633A (en) Polymer composition for a layer of a layer element.
MX363074B (en) Polypropylene based hot-melt adhesive composition.
EP3130009A4 (en) Dc-dc converter having terminals of semiconductor chips
WO2015156891A3 (en) Method of providing a flexible semiconductor device and flexible semiconductor device thereof
EP3390568A4 (en) Silicone pressure-sensitive adhesive composition
MX2017003344A (en) Polymer composition for a layer of a layer element.
MX2017003911A (en) Pressure-sensitive adhesive.
EP3450519A4 (en) Self-adhesive layer
MX2017012813A (en) Adhesive tape for preventing adhesion of aquatic organisms.
MX2016012013A (en) Heavily phosphor loaded led package.
WO2012149334A3 (en) Methods and compositions for the generation and use of conformation-specific antibodies
SG11201507898UA (en) Hydrophilic adhesives and tapes and devices containing the same
SG11201609355VA (en) Crumb of block copolymer and pressure-sensitive adhesive composition
WO2014151358A3 (en) Anaerobic curable compositions
EP3348623A4 (en) Pressure-sensitive adhesive composition, process for producing same, and pressure-sensitive adhesive film