JP2019160868A - 封止用シート - Google Patents
封止用シート Download PDFInfo
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- JP2019160868A JP2019160868A JP2018041966A JP2018041966A JP2019160868A JP 2019160868 A JP2019160868 A JP 2019160868A JP 2018041966 A JP2018041966 A JP 2018041966A JP 2018041966 A JP2018041966 A JP 2018041966A JP 2019160868 A JP2019160868 A JP 2019160868A
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Abstract
Description
以下の各変形例において、上記した一実施形態と同様の部材については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態および各変形例を適宜組み合わせることもできる。
エポキシ樹脂B:日本化薬社製のEPPN501−HY(エポキシ当量169g/eq.軟化点60℃)
硬化剤:群栄化学社製のLVR−8210DL(ノボラック型フェノール樹脂、エポキシ樹脂硬化剤、水酸基当量:104g/eq.、軟化点:60℃)
硬化促進剤:四国化成工業社製の2PHZ−PW(2−フェニル−4,5−ジヒドロキシメチルイミダゾール)、エポキシ樹脂硬化促進剤
ガラス転移温度調整剤:根上工業社製のHME−2006M、カルボキシル基含有のアクリル酸エステルコポリマー(アクリル系ポリマー)、重量平均分子量:60万、ガラス転移温度(Tg):−35℃、固形分濃度20質量%のメチルエチルケトン溶液
シランカップリング剤:信越化学社製のKBM−403(3−グリシドキシプロピルトリメトキシシラン)
顔料:三菱化学社製の#20(カーボンブラック)
第1粒子:FB−5SDC(球状溶融シリカ粉末(無機粒子)、平均粒子径5μm)
第2粒子:アドマテックス社製のSC220G−SMJ(平均粒径0.5μm)を3−メタクリロキシプロピルトリメトキシシラン(信越化学社製の製品名:KBM−503)で表面処理した無機粒子。無機粒子の100重量部に対して1重量部のシランカップリング剤で表面処理したもの。
表1に記載の配合処方に従い、各成分をメチルエチルケトンに溶解および分散させ、ワニスを得た。ワニスの固形分濃度は、80質量%であった。
半導体素子封止用シート1について、下記の項目を評価した。その結果を表1に記載する。
半導体素子封止用シート1を150℃で1時間加熱して、硬化体シート20を調製した。続いて、硬化体シート20について、固体粘弾性測定装置(ティー・エイ・インスツルメンツ社製、形式:RSA−G2)を用いて、引張貯蔵弾性率E’を測定した。
走査温度:0〜260℃
周波数:1Hz
昇温速度:10℃/分
(第1熱膨張係数α1の測定)
半導体素子封止用シート1を150℃で1時間加熱して、硬化体シート20を調製した。続いて、硬化体シート20から、長さ15mm×幅4.5mm×厚さ100μmのサンプルを採取し、これを、熱機械測定装置(Rigaku社製:形式TMA8310)のフィルム引張測定用治具にセットした後、25〜260℃の温度域で、引張荷重2g、昇温速度5℃/分の条件下におき、30℃〜50℃での膨張率から第1熱膨張係数α1(ガラス転移温度Tg以下における熱膨張係数α)を求めた。
半導体素子封止用シート1を150℃で1時間加熱して、硬化体シート20を調製した。続いて、硬化体シート20について、固体粘弾性測定装置(ティー・エイ・インスツルメンツ社製、形式:RSA−G2)を用いて、引張貯蔵弾性率E’を測定した。
走査温度:0〜260℃
周波数:1Hz
昇温速度:10℃/分
(評価2)
評価1に基づいて、信頼性およびハンドリング性を、下記の基準に従って、評価した。その結果を表1に記載する。
(信頼性)
○:ガラス転移温度Tgが、110℃以上。
×:ガラス転移温度Tgが、110℃未満。
(ハンドリング性)
○:25℃における引張貯蔵弾性率E’が、15GPa以下。
×:25℃における引張貯蔵弾性率E’が、15GPa超過。
Claims (9)
- 封止樹脂組成物と、無機粒子と、ハンドリング向上成分とを含む封止用シートであり、
前記無機粒子の含有割合が、前記封止用シート中、50質量%超過、90質量%以下であり、
前記ハンドリング向上成分が、ポリマー粒子であり、
前記ハンドリング向上成分の含有割合が、前記封止用シート中、1質量%以上、8質量%以下であることを特徴とする、封止用シート。 - 前記ポリマー粒子の平均粒子径が、50μm以下であることを特徴とする、請求項1に記載の封止用シート。
- 前記無機粒子は、
第1粒子と、
前記第1粒子の平均粒子径より小さい平均粒子径を有する第2粒子と
を含有することを特徴とする、請求項1または2に記載の封止用シート。 - 前記無機粒子および前記ハンドリング向上成分の総量の割合が、前記封止用シート中、80質量%以上、95質量%以下であることを特徴とする、請求項1〜3のいずれか一項に記載の封止用シート。
- 前記封止樹脂組成物が、ガラス転移温度調整剤をさらに含有することを特徴とする、請求項1〜4のいずれか一項に記載の封止用シート。
- 前記ガラス転移温度調整剤が、アクリル系ポリマーであることを特徴とする、請求項5に記載の封止用シート。
- 前記封止樹脂組成物は、エポキシ樹脂およびエポキシ樹脂硬化剤を含有し、
前記ポリマー粒子は、エポキシ樹脂およびエポキシ樹脂硬化剤の少なくとも一方と反応する官能基を含有することを特徴とする、請求項1〜6のいずれか一項に記載の封止用シート。 - 官能基が、エポキシ基、カルボキシル基、ヒドロキシル基からなる群から選択される少なくとも1つであることを特徴とする、請求項7に記載の封止用シート。
- 前記ポリマー粒子が、シリコーン系粒子であることを特徴とする、請求項1〜8に記載の封止用シート。
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JP2018041966A JP2019160868A (ja) | 2018-03-08 | 2018-03-08 | 封止用シート |
SG10201901844V SG10201901844VA (en) | 2018-03-08 | 2019-03-01 | Sealable sheet |
TW108107352A TW201938745A (zh) | 2018-03-08 | 2019-03-06 | 封裝用薄片 |
CN201910169251.5A CN110240782A (zh) | 2018-03-08 | 2019-03-06 | 密封用片 |
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JP7461229B2 (ja) | 2020-06-17 | 2024-04-03 | 日東電工株式会社 | 封止用樹脂シート |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083451A (ja) * | 1994-06-16 | 1996-01-09 | Tatsumori:Kk | シリカとシリコーンゴムを含む組成物及びその製造法 |
JPH10189832A (ja) * | 1996-12-20 | 1998-07-21 | Nitto Denko Corp | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2017168850A (ja) * | 2017-04-19 | 2017-09-21 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及びフィルム状接着剤 |
WO2017203622A1 (ja) * | 2016-05-25 | 2017-11-30 | 日立化成株式会社 | 封止構造体及びその製造方法、並びに、封止材 |
-
2018
- 2018-03-08 JP JP2018041966A patent/JP2019160868A/ja active Pending
-
2019
- 2019-03-01 SG SG10201901844V patent/SG10201901844VA/en unknown
- 2019-03-06 CN CN201910169251.5A patent/CN110240782A/zh active Pending
- 2019-03-06 TW TW108107352A patent/TW201938745A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083451A (ja) * | 1994-06-16 | 1996-01-09 | Tatsumori:Kk | シリカとシリコーンゴムを含む組成物及びその製造法 |
JPH10189832A (ja) * | 1996-12-20 | 1998-07-21 | Nitto Denko Corp | エポキシ樹脂組成物およびそれを用いた半導体装置 |
WO2017203622A1 (ja) * | 2016-05-25 | 2017-11-30 | 日立化成株式会社 | 封止構造体及びその製造方法、並びに、封止材 |
JP2017168850A (ja) * | 2017-04-19 | 2017-09-21 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及びフィルム状接着剤 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7461229B2 (ja) | 2020-06-17 | 2024-04-03 | 日東電工株式会社 | 封止用樹脂シート |
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TW201938745A (zh) | 2019-10-01 |
SG10201901844VA (en) | 2019-10-30 |
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