JP2019145665A - ウエーハの分割方法 - Google Patents
ウエーハの分割方法 Download PDFInfo
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- JP2019145665A JP2019145665A JP2018028364A JP2018028364A JP2019145665A JP 2019145665 A JP2019145665 A JP 2019145665A JP 2018028364 A JP2018028364 A JP 2018028364A JP 2018028364 A JP2018028364 A JP 2018028364A JP 2019145665 A JP2019145665 A JP 2019145665A
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- 238000000034 method Methods 0.000 title claims abstract description 22
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- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 98
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
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- 229940068984 polyvinyl alcohol Drugs 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 241001050985 Disco Species 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 238000003672 processing method Methods 0.000 description 1
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- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
21 保持テーブル
31 レーザ加工手段
40 樹脂層
41 空気と樹脂層の界面
42 樹脂層とウエーハの界面
D デバイス
L 分割予定ライン
W ウエーハ
Claims (1)
- 分割予定ラインにより区画され複数のデバイスが形成されたウエーハに対して透過性波長のレーザ光線を照射させてウエーハを該分割予定ラインに沿って分割するウエーハの分割方法であって、
空気より大きくウエーハより小さい屈折率の樹脂でウエーハにレーザ光線が入射する面に樹脂層を形成する樹脂層形成工程と、
該樹脂層形成工程で形成した該樹脂層側からレーザ光線を照射させ該樹脂層を通過しウエーハの内部に集光させた集光点を該分割予定ラインに沿って移動させウエーハの内部に改質層を形成する改質層形成工程と、
該改質層形成工程で形成した該改質層を起点に分割予定ラインに沿って分割する分割工程とを備えるウエーハの分割方法。
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JP2018028364A JP7149077B2 (ja) | 2018-02-21 | 2018-02-21 | ウエーハの分割方法 |
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JP2018028364A JP7149077B2 (ja) | 2018-02-21 | 2018-02-21 | ウエーハの分割方法 |
Publications (2)
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JP2019145665A true JP2019145665A (ja) | 2019-08-29 |
JP7149077B2 JP7149077B2 (ja) | 2022-10-06 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112020003729T5 (de) | 2019-08-07 | 2022-04-21 | Tdk Corporation | Festelektrolyt, festelektrolytschicht und festelektrolytzelle |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011192934A (ja) * | 2010-03-16 | 2011-09-29 | Disco Corp | ワークの分割方法 |
JP2012084618A (ja) * | 2010-10-07 | 2012-04-26 | Disco Abrasive Syst Ltd | ワークの分割方法 |
JP2012124527A (ja) * | 2010-11-16 | 2012-06-28 | Tokyo Seimitsu Co Ltd | ウェーハテーブル及びレーザダイシング装置 |
JP2013095844A (ja) * | 2011-10-31 | 2013-05-20 | Tokyo Ohka Kogyo Co Ltd | 水溶性塗布膜材料、水溶性塗布膜材料の粘度調整方法、及び水溶性塗布膜材料用粘度調整剤 |
JP2015115573A (ja) * | 2013-12-16 | 2015-06-22 | 株式会社東京精密 | レーザダイシング方法 |
JP2016035976A (ja) * | 2014-08-04 | 2016-03-17 | 株式会社ディスコ | ウエーハの加工方法 |
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2018
- 2018-02-21 JP JP2018028364A patent/JP7149077B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011192934A (ja) * | 2010-03-16 | 2011-09-29 | Disco Corp | ワークの分割方法 |
JP2012084618A (ja) * | 2010-10-07 | 2012-04-26 | Disco Abrasive Syst Ltd | ワークの分割方法 |
JP2012124527A (ja) * | 2010-11-16 | 2012-06-28 | Tokyo Seimitsu Co Ltd | ウェーハテーブル及びレーザダイシング装置 |
JP2013095844A (ja) * | 2011-10-31 | 2013-05-20 | Tokyo Ohka Kogyo Co Ltd | 水溶性塗布膜材料、水溶性塗布膜材料の粘度調整方法、及び水溶性塗布膜材料用粘度調整剤 |
JP2015115573A (ja) * | 2013-12-16 | 2015-06-22 | 株式会社東京精密 | レーザダイシング方法 |
JP2016035976A (ja) * | 2014-08-04 | 2016-03-17 | 株式会社ディスコ | ウエーハの加工方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020003729T5 (de) | 2019-08-07 | 2022-04-21 | Tdk Corporation | Festelektrolyt, festelektrolytschicht und festelektrolytzelle |
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